RoHS2 is coming - will it work better than RoHS?

Electronics Weekly: "Nearly two and a half years on from the introduction of the RoHS Directive, it may be an appropriate time to examine how did we all do?

If the National Weights and Measures Laboratories (NWML) experience is typical across Europe, then probably not very well. In the early days of transition, they claim '99% of products are 99% compliant'. Or, put another way, only 1% of products complied fully.

A 2008 Impact Assessment by the European Commission reveals we still have a long way to go, stating 'Current Member States' checks revealed that up to 44% of EEE
checked were not fully compliant.'"

Manufacturers must not only build compliant products, they will also be required (for the first time) to draw up technical documentation and a formal declaration of conformity.  

They must also prove they have procedures in place to ensure ongoing production remains in conformity.  Once these, and other tasks, have been completed they are then 

required to affix the CE mark, which in itself introduces significant responsibilities.

The next element of the supply chain, the importer, is now obliged to 'mark' the manufacturers work.  They will be required to assess the technical documentation, 

declaration of conformity and CE marking.  Once satisfied everything is in order, they must now label the equipment with their registered trade name or mark and contact 

details.  If the importer inadvertently places non-compliant product on the market by failing to assess the product correctly, they will be responsible for product recall and 

notifying the appropriate national authorities.

 

The distributor is now responsible for 'marking' both the manufacturers and importers work, ensuring both have complied with their individual requirements.  Should the distributor fail to correctly assess the technical documentation and place non-compliant product on the market, they too are responsible for recalling or withdrawing the affected equipment and  notifying the authorities.

IEC Standards for RoHS Testing

http://webstore.iec.ch/webstore/webstore.nsf/mysearchajax?Openform&key=62321&sorting=&start=1

Asian Electronics Associations

SMART: In Asia

CHINA

CECA - China Electronic Components Association

www.ic-CECA.org.CN 

CEAC - China Electronic Appliance Corporation

www.ChinaElec.com 

CECC - China Electronic Chamber of Commerce

www.cecc.org.cn 

CMCA - China mobile Communication Association

www.CMCA.org.CN 

HKEIA - Hong Kong Electronic Industries Association

www.HKEIA.org 

Yury Kovalevsky named IPC Russian representative

EMSNow: "IPC - Association Connecting Electronics Industries has appointed Yury Kovalevsky as its official representative to Russia and Russian-speaking countries.

Kovalevsky's appointment is part of IPC's long-term plan to expand services and standards globally. His presence will make IPC services widely available to companies in Russia, a market with  enormous growth potential for both electronics manufacturing services and printed board production. In his role as IPC Representative, Kovalevsky will break down the barriers of language, distance and market familiarity to foster greater acceptance of IPC standards in the region."

Yamaha wind now lead-free

Mi Pro: "evaluations with artists in order to determine exactly which type of lead-free solder would be the optimum material to use on musical instruments,” the statement read. “The company has gradually succeeded in converting all of its wind instrument production facilities to the use of this ecologically friendly material.”

“We are very proud to have removed the lead from all Yamaha wind instruments and to be the first manufacturer to take this step,” stated Mike Ketley, senior director at Yamaha Music UK. “This serves to reinforce Yamaha's reputation in providing high-quality instruments to its dealers and, in turn, environmentally-friendly instruments to our customers."

Wire Glue - conducting glue makes solder a thing of the past

The Red Ferret Journal: "Wire Glue is a conducting adhesive that you can use to fix broken electrical things around the home. Anyone who’s ever tried to solder two bits of wire together to fix a gadget will know just how annoying it can be if you’re not an expert flux-capacitor. Well now you can just smirk and slap a bit of glue on both ends and be done with it. More time to venture outside to get pizza. I’m definitely going to get me some (glue not pizza). $3.99."

WireGlue website

Oko-Fraunhofer Recommend Discontinuation of 7 RoHS Exemptions

Printed Circuit Design & Fab: "Following a review of 29 exemptions, OkoInstitute and Fraunhofer IZM have recommended seven not be continued: 

- lead in linear incandescent lamps (Exemption 16)

- lead as activator in the fluorescent power of discharge lamps (Exemption 18)

- lead with PbBiSn-Hg and PbBiSn-Hg in specific compositions (Exemption 19)

- lead in oxide glass used for bonding front and rear substrates of flat fluorescent lamps used for LCDs (Exemption 20)

- lead oxide in the glass envelope of black light blue; lead alloys as solder for tranducers used in high-powered loudspeakers (Exemption 27)

hexavalent chromium in corrosion preventive coatings (Exemption 28)."

Okö also evaluated five requests for new exemptions: 

1) lead in solders for the connection of very thin enameled wires with a terminal

2) lead and cadmium as components of the glazes and color used to glaze or decorate lamp bases, lamp carriers or clocks

3) lead in solders in a third-party component of cortex family equipment

4) cadmium for use in solid-state illumination and display systems

5) lead in solders for the connection of very thin (<100>

The firms recommended granting number 4, refusing number 3, and were unable to make recommendations regarding numbers 1, 2 and 5. 

Specific applications that do not have technically feasible alternatives, or cannot be foreseen within the next five to ten years, have been given an expiration date of July 31, 2014, which is when the next revision cycle will occur. 

The EC will review the recommendations but have not set a timeline for release of its conclusions.

The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment

Scopus: "Tin oxide nano particles dispersed in water solution were sprayed on the tin-plated copper surface and served as coating layer in order to study its effect on the prevention of tin whisker formation. The results indicated that tin oxide nano particles could inhibit the growth of tin whiskers to certain extent. Many hillocks instead of long whiskers grew on the surfaces of samples that underwent 25, 40 and 60'C annealing for 10 weeks."

Alloying modification of Sn-Ag-Cu solders by manganese and titanium

Scopus: "Effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys (SAC105), as well as mechanical properties, were investigated in this study. 

Results show that alloying of Mn and Ti resulted in dramatically reduced undercooling, coarse eutectic structure and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Those thermal and microstructural changes might be ascribed to the formation of MnSn2 and Ti2Sn3 intermetallic compounds (IMCs) which appeared respectively in the Mn-doped and Ti-doped samples."

Research advances in nano-composite solders

Scopus: "Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite solders in the electronic packaging industry and the research advances of the composite solders developed."

Strengthening mechanism of SiC-particulate reinforced Sn-3.7Ag-0.9Zn lead-free solder

Scopusr: "Mechanically mixing was adopted to prepare SiC-particulate reinforced Sn-3.7Ag-0.9Zn composite solders and the effects of SiC addition on the solidification behavior, melting behavior and the corresponding microhardness of air-cooled composite solders were explored. It is found that the addition of SiC particles into the Sn-3.7Ag-0.9Zn alloy melt prompts the formation of primary β-Sn phase in the solidified structure. For the SiC particles serve as additional nucleation sites"

The hard SiC particles and refined β-Sn dendrites and IMCs could obstruct the dislocation slipping and thus lead to a strong strengthening effect in the composite solder.

Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary sol

Scopus: "In this study, addition of Ag micro-particles with a content in the range between 0 and 4 wt.% to a Sn-Zn eutectic solder, were examined in order to understand the effect of Ag additions on the microstructural and mechanical properties as well as the thermal behavior of the composite solder formed.

 The shear strengths and the interfacial reactions of Sn-Zn micro-composite eutectic solders with Au/Ni/Cu ball grid array (BGA) pad metallizations were systematically investigated. Three distinct intermetallic compound (IMC) layers were formed at the solder interface of the Au/electrolytic Ni/Cu bond pads with the Sn-Zn composite alloys. 

The more Ag particles that were added to the Sn-Zn solder, the more Ag-Zn compound formed to thicken the uppermost IMC layer."

Anomalous growth of whisker-like bismuth-tin extrusions from tin-enriched tin-Bi deposits

Scopus: "This article shows the first finding that the anomalous growth of Bi-Sn extrusions from tin-enriched alloys (Sn-xBi with x between 20 and 10 wt.%) can be induced by post-plating annealing in N2 between 145 and 260 'C for 10 min"

Annealing resulting in thermal expansion of Sn grains is believed to squeeze the Bi-Sn alloys with relatively low melting points to form whisker-like extrusions although the exact mechanism is unclear.

Interaction behavior between Co/Ni and Sn in Sn-3.0Ag-0.5Cu-based solder alloys

Scopus: "The minor element Co/Ni was adopted to study the microstructural evolution of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloy. The 0.2 mass% Co addition induced the formation of CoSn2 in the cast SAC305 solder."

However, the Co/Ni addition into SAC305 alloy led to the much higher bridging defects of the solder joint, which was attributed to the presence of Co-Sn intermetallic compound at the soldering temperature.

Tianjin University, China

Osaka University, Japan

Georgia Inst of Technology, US

Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint

Scopus: "In this paper, the effects of rare earth (RE) element additions on the mechanical creep-fatigue property of the Sn3.8Ag0.7Cu solder joint have been investigated. The results show that adding a small amount of the RE elements can evidently increase the creep-fatigue rupture lifetime of the Sn3.8Ag0.7Cu solder joint."

The increase in the creep-fatigue property can be attributed to the reduction of the creep-fatigue damages and the change of microcrack propagation site during the fracture process, which depends on the refining of intermetallic compounds due to the RE elements. In addition, it is also found that adding the RE elements decreases the strain amplitude of the solder joint under the constant stress amplitude.

W. Xiao, Beijing University, China

SMTA 3rd International Symposium on Tin Whiskers, June 2009, Denmark

SMTA: "3rd International Symposium on Tin Whiskers
June 23-24, 2009
Technical University of Denmark, Lyngby, Denmark

Tin whiskers present a unique challenge to the electronics industry. There have been a large number of electronics failures in the market caused by tin whiskers since the 1940s. After 2000, as a result of the global transition to lead-free electronics, a majority of electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased use of tin-based lead-free finishes and materials has focused concern and research on tin whiskers, particularly for long-life and mission-critical applications such as space, aviation, and implantable medical devices."

This symposium will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Attendees will be able to learn about the current state of knowledge regarding tin whisker growth, risk, and mitigation strategies, enabling the development of improved and effective qualification and mitigation procedures. 

The conference is organized by SMTA in conjunction with the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD and the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark. 

Siemens patent nickel zircon alloy

Factiva: "Paul Heinz and Michael Ott, both of Germany, have developed a solder alloy comprising at least nickel zircon.

The patent has been assigned to Siemens Aktiengesellschaft, Munchen, Germany.

According to an abstract posted by the World Intellectual Property Organization, the invention relates to a 'solder alloy comprising at least nickel zircon and preferably also germanium.'"

APEX and Universities: The Collaboration is Academic

SMT LIVE BLOG: "IPC’s top 14 poster papers are:

- “Whisker and Hillock Growth Observed on Pure Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films” by Aaron Pedigo, Pylin Sarobol, John Blendell, and Carol Handwerker, Purdue University; 

- “Silver-Bismuth Alloys as a High Temperature Lead-Free Solder” by Anthony Muza, Purdue University

“Utilizing the Thermodynamic Nanoparticle Size Effects for Low Temperature Pb-Free Solder Applications” by John P. Koppes, Purdue University."

“Room Temperature Sintering of Ag Nanoparticle Paste by Chemical Dip Treatment” by Daisuke Wakuda, Osaka University is an international submission, as is 

“Control of Tin Whisker Growth” by schoolmate Keun-Soo Kim, Osaka University.

- “Fluxless Bonding of Si Chips to Cu Substrates Using Ag-In System” by Pin J. Wang, University of California — Irvine.

- “Ink-jet Printed Electronics” by Rostyslav Lesyuk, Werner Jillek, Ewald Schmitt, Yaroslav Bobitski, and Zhen-Guo Yang comes from the National University “Lvivska polytechnika,” Lviv, Ukraine and University of Applied Science in Nuremberg, Germany.

Finally, Taiwan’s academic program is represented by “A Suitability Study for Mechanical Shear and Bend Tests as Alternatives for Thermal Cycling Reliability Test of Electronic Components” by Yeong-Shu Chen, Chen-Tse Fan, and Yu-chun Huang, Yuan-Ze University.

NPL Researching Tin Pest, Tin Whiskers in Pb-free Solder

Circuits Assembly: "National Physical Laboratory scientists are researching what use of Pb-free solder alloys could mean for tin pest and tin whiskers.

NPL has been studying the allotropic phase transformation in tin and its alloys, commonly known as tin pest, to measure the implications of adopting Pb-free solder manufacturing practices.
The firm has received funding from the Department for Business, Enterprise & Regulatory Reform. It seeks industry support for the work on the order of 5,200 per company for the 14-month project.

Also, NPL has developed a measurement system and test method to assess the ability of different conformal coatings to stop or slow down tin whisker growth. The method can help conformal coating suppliers modify coatings to inhibit whisker initiation, growth and penetration for electronics."

Orgalime Comments on Commission Recast Proposal for Directive 2002/95/EC (RoHS) | Press Release Services - EurActiv.com

EurActiv.com: "The RoHS recast proposal claims to simplify existing legislation and to avoid unnecessary bureaucracy and administrative costs in line with Better Regulation principles of the EU. However, the RoHS recast proposal in our view fails to realise this objective, in particular since it overlaps with other legislation and thereby creates legal uncertainty. 

Therefore, Orgalime’s fundamental request to regulators is to ensure full legal consistency between the RoHS Directive and other legislative initiatives, in particular with the REACH Regulation and New Legislative Framework (NLF) that have been finalised after the adoption of the initial RoHS Directive."

Solder Materials Melting and Freezing Characteristics of Common Lead-free Alloys

SMT: "Much work has been reported on the melting and freezing behavior of tin/silver/copper (Sn/Ag/Cu — SAC) alloys. Knowing melting and freezing points is only part of the information. A slight change in composition may result in a significant difference in solder performance."

A detailed experimental study and thermodynamic calculations were reported by the NIST metallurgy group.1 Figure 1 shows the calculated liquidus surface in the SnAgCu phase diagram as reported in that article. SAC305 and SAC405 are close to the eutectic. There are some differences in the ternary eutectic composition reported by different groups. In this article, the reported eutectic alloy composition is approximately Sn3.7Ag0.9Cu with 217°C eutectic temperature. Low-Ag alloys typically show two distinct melting phases: a low-temperature melting phase corresponding to Sn/Ag eutectic and high-temperature phase corresponding to Sn/Cu eutectic melting around 228°C. See the differential scanning calorimetry (DSC) plots of SAC305, SAC105, and SAC0307 in Figure 2. As the silver level goes down, so does the first, low-temperature peak. Calculated isothermal sections of SAC phase diagram at 223°C, a temperature between the two major peaks seen in low-Ag SAC alloys' DSC, are shown in Figure 3.

EuropElectro - ZVEI office in China

Since February 2007, the European electrical and electronics industry has been represented in China with an office in Beijing under the leadership of Orgalime German member, ZVEI under the name "EuropElectro".  In partnership with Orgalime, the goal is to work on topics relating to technical legislation, standardisation and certification in China.

 

It is already showing results with an anticipated 90% of International standards being adopted into Chinese standards by 2015.  Great news for European industry

Flier

Mezzanine trade-offs stack up

EETimes.com: "Another customer consideration is how the connectors adhere to the board, said Stanczak, who explained that the two standard options are surface-mount and press-fit. Surface-mount is generally superior when it comes to electrical characteristics, he said, but press-fit offers robustness and locks well onto the board, providing better retention.

Molex has developed a surface-mount attach method that is said to deliver higher reliability and lower cost than typical ball-grid-array attach methods, as well as a higher retention force."

The Molex SeaRay and HD Mezz both use the new, patented solder charge technology for standard surface-mount attach, which is said to result in better process yields and lower applied cost compared with BGA connectors. The Molex products also use open pin fields for custom pin assignments, another benefit for designers, according to the company.

With the solder charge technology, the solder is stamped on the side of terminal; thus, when it goes through the reflow oven, the solder completely melts around the terminal, creating a pocket, instead of melting and forming to the pc board. Key benefits include higher reliability (with increased board retention--about three times as strong as is achieved with typical BGAs), less stress to the solder joint and lower cost.

Technology Drives New Stencil Applications

SMT: "With new stencil designs, printing can occur for small and bulky components on the same PCB, wafer-level and flip-chip package mounting, and 3D packaging interconnections, among other applications. 3D electroformed stencils might be the next step for stacked die inside packages, printing solder for die-to-die interconnects.

Although the stencil is commonly recognized as a simple tool used in the printing process, its uses are continually evolving. Normally, it is used to print solder paste on pads of the PCB as the first step in surface mount assembly. After the paste bricks are printed, components are placed in solder paste while it is still tacky. Next, the PCB is heated in a reflow oven to melt the paste and form a solder joint at each component lead."

Solder Vendors Say No Plans to Kill RMA Flux

Circuits Assembly: "Solder vendors are denying reports of plans to eliminate a type of flux classified in industry standards as rosin mildly activated (RMA).

On an industry email forum Friday, an engineer at a large defense contractor said he had heard from solder reps of a consensus to discontinue RMA fluxes due to a lack of general use.

The engineer said the reps were with Kester and Alpha Metals.

Meanwhile, a veteran engineer at another major defense contractor said he had heard similar rumors from colleagues.

However, the vendors disputed the reports. Paul Lotosky, global director, customer technical support at Cookson, said, “I can confidently state that Alpha has no plans to discontinue producing currently available RMA fluxes, including the ROL1 Solderability Test Flux.”"

Honeywell Ge-Doped Bi-11Ag Lead-Free Die Attach

A bismuth-silver alloy (Bi-11wt.%Ag) has been identified as a viable Pb-free power die-attach solder. The alloy has a solidus at 262.5°C and a liquidus at 360°C. It has a shear modulus of 13.28 GPa and an ultimate tensile strength (UTS) of 59 MPa. Bismuth-silver alloys oxidize in air but will solder to nickel, silver, and gold under reducing atmospheres. Germanium may be added in small

amounts (#500 ppm) to improve the wetting.Wire, ribbon, and preform shapes of the alloy have been fabricated by conventional metalworking techniques.

2002 paper

Die attach solder design

Advanced Packaging: "In the quest for lead-free solders, there have been few reports regarding possible replacements for the Pb-5Sn and Pb-10Sn alloys. These alloys are commonly used for die attach in power devices, because of their high melting point, thermal conductivity and thermomechanical fatigue resistance. A project has been undertaken to identify lead-free alloys for this application using the CALPHAD (CALculation of PHAse Diagrams) method.

The task of developing a new lead-free alloy necessitates a complete assessment of all available data, as well as the acquisition of new data. Designing 'drop-in' replacements for lead-containing alloys and materials can be technically challenging; this article primarily focuses on thermochemical aspects of designing an alloy for level-one die attach solder used in power devices."

Honeywell Develops Lead-Free Thermal Management Material for Semiconductors

SYS-CON UK: "Demand for lead-free solders is growing, driven in part by regulation. Honeywell's new Pb-free Die Attach Solder is an advanced technology that is not only better for the environment, but is also cost effective. Lead-based solders are currently used for power/discrete die attach because they have a very good combination of melting temperature, wetting behavior, and mechanical properties.

The new lead-free solder alloys are designed to meet these requirements, particularly resistance to melting during board level solder reflow.

Targeting the semiconductor industry's power device segment, Pb-free Die Attach Solder will be used in chips that service a wide range of industries, from automotives to cell phones.

The lead free material is based on Honeywell's metallurgical expertise and long experience as a supplier of die-attach solders. Honeywell Pb-free Die Attach Solder is designed to be used mainly in wire form and compliments Honeywell's large diameter aluminum wire products. It provides power device manufacturers with a lower cost, more effective and greener alternative."

The influence of lead-free RoHS guidelines on military electronics procurement

Military & Aerospace Electronics: "In the U.S. and elsewhere, original equipment manufacturer (OEM) response to RoHS -- especially within the military aerospace electronics industry -- has been almost universally negative, with a specific focus on the ban on lead.

'Our experience in the U.S. in the past couple of years has been somewhat of a surprise at the slow pace of switch of customer demand to lead-free product. We've had a lot longer, bigger latent demand than we expected three years ago. When you look at what we are shipping now, there are a tremendous number of leaded products still going out,' says Bryan Brady, vice president of the Avnet Defense & Aerospace Business Unit in Tempe, Ariz."

"The caveat we often hear is the supply increasingly will move over at the OEM base to deal with lead free," Brady explains. "Whether they want to or their customers are driving them to, that switch is happening and will happen and industry is dealing with all of the points in-between. One of the questions I'm pursuing with industry is, if you had a warranted leaded product, would you prefer to use that -- and the answer, especially from the defense side, is yes."

Despite the military aero exemptions, the heavy reliance on COTS components from a commercial world whose major customers are not exempt has placed those industries in a de facto compliance environment. While the costs of conversion and compliance testing have been significant issues, the most serious objection involves the reliability of non-leaded solders.

Variable-Size Solder Droplets by a Molten-Solder Ejection Method

Scopus: "We have developed a molten-solder ejection method by which molten-solder droplets from a 13- (1 pL) to 450- μm (48 nL) diameter could be realized. This method has been developed as a technique to supply small solder balls. The authors have developed a newly designed solder ejection head and confirmed that solder balls with almost no surface oxidation can be formed by using this method."

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

Scopus: "We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys."

he Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement. 

Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints

Scopus: "The present study details the microstructure evolution of the interfacial intermetallic compounds (IMCs) layer formed between the Sn-xAg-0.5Cu (x = 1, 3, and 4 wt.%) solder balls and electroless Ni-P layer, and their bond strength variation during aging."

This fact demonstrates that interfacial layers are key to understanding the changes in bonding strength. Additionally, comparison of the bond strength with various Sn-Ag-Cu lead-free solders for various Ag contents show that the Sn-1Ag-0.5Cu solder joint is not sensitive to extended aging time.

Nihon introduces lead-free solder paste for 0402 chip components

EMSNow: "Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.

Following the recent development of densely populated boards, it is essential to improve the quality of high-density mounting, such as the application of minimal components represented by the 0402 metric package, also known as 01005, filletless mounting, and narrow pitch mounting."

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150'C

Scopus: "The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 'C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time."

The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability. 

Tianjin University, China

Motorola, China

University of Wollongong, Australia

IPC Issues Call to Action on RoHS

SMT: "Association Connecting Electronics Industries issued a call for assemblers and electronics companies creating products for the EU market to weigh in on the proposed changes to RoHS. Proposed revisions could make exemptions more difficult to obtain and add compliance requirements, such as eliminating TBBPA.

The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive impacted every facet of the supply chain and forced the electronics industry to make enormous, expensive, and burdensome changes, forever transforming the electronics industry landscape."

New IPC white paper examines embedded passive technology

EMSNow: "IPC - Association Connecting Electronics Industries  has released a new white paper, Embedded Passives: An Overview of Implementation, Benefits and Costs, in response to member requests for information about the cost/value proposition of this growing and evolving technology. Created for use by engineers, executives and others considering embedded passive technology, the document provides guidance for evaluating the technology, as well as general information on how to proceed with implementation."

Nihon Superior’s High Ductility Lead-free Solder Provides High Impact Strength

Global SMT: "Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.

The graphic below shows the stress-strain curves and BGA sphere fracture areas generated by shear impact tests with speeds of (a) 100 mm/sec and (b) 1000 mm/sec on an electroless Ni/Immersion Au surface finish. (The fracture areas are compared to Sn-37Pb normalized to 100 percent)."

Cookson Group announces 2008 results‏

EMSNow" 2008 results significantly ahead of 2007 despite weak final quarter, and slightly ahead of estimates published on 29 January 2009: 

- Revenue of $2,203 million, up 23%*
- Trading profit of $216.3 million, up 11%*
- Headline profit before tax of $176.2 million, up 18%"

Management actions continuing as planned to reduce cost base by £40 million and conserve cash; suspending expansion capex, dividends and UK pension 'top-up' payments will reduce cash outflow by greater than £85 million compared to 2008 

SMT - IPC APEX Expo Preview: Innovative Technology Center, Task Groups, and More

SMT: "Intel Corp., IBM, and Hewlett-Packard Company will lead the IPC APEX EXPO OEM Summit to define key issues they are facing in halogen-free materials, materials reliability, and supplier quality, 

Thursday, April 2, 8–10 am. Martin Rausch, general manager of System Manufacturing TD for Intel Corp., will discuss the challenges involved in making the transition to halogen-free materials — issues that he does not believe are widely understood within the supply chain. 

Michael Roesch, manager, Reliability and Test Engineering, Global Engineering Services (GES) for Hewlett-Packard Company, will address the challenges for a large OEM managing materials changes and their reliability impact on electronic assemblies in an increasingly complex supply chain. 

Dr. Kitty Pearsall, DE, ISC Procurement Engineering, IBM, routinely leads strategic procurement initiatives focusing on high quality and solid reliability of the final end product. Kitty will present the IBM End to End (E2E) Supplier Quality Management System that includes the traditional elements of supplier selection, qualification and monitoring."

IPC and JEDEC help industry transition to lead free

EMSNow:"Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present

Transitioning to Lead Free - Strategies for Implementation,' a three-day conference to be held March 3-5, 2009 in Santa Clara, Calif."

3rd International Symposium on Tin Whiskers

EMSNow: "This symposium will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Attendees will be able to learn about the current state of knowledge regarding tin whisker growth, risk, and mitigation strategies, enabling the development of improved and effective qualification and mitigation procedures.

The conference is organized by SMTA in conjunction with the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD and the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark."

Preparation of Sn-3.5Ag nano-solder by supernatant process

Scopus: "The nano-scaled Sn-3.5Ag solder was prepared successfully by a supernatant process in the present study."

The eutectic element, Ag with a weight percentage of 3.5%, was found to be homogenous over all of the particles. Furthermore, the microstructure of the Sn-3.5Ag alloy was identified by X-ray diffraction. It was found that the trace element, Ag was dissolved in the matrix, a tetragonal system, without an intermetallic phase.

Lin C.Y., National Cheng Kung University, Taiwan

Chien-Kuo Institute of Technology, Taiwan

Murdoch University, WA, Australia