Restriction of Hazardous Substances in Electrical and Electronic Equipment - Environment - European Commission

Restriction of Hazardous Substances in Electrical and Electronic Equipment - Environment - European Commission:

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he new RoHS Directive 2011/65/EU (RoHS 2) entered into force on 21 July 2011 and requires Member States to transpose the provisions into their respective national laws by 2  January 2013. At the 2011 RoHS/WEEE Technical Adaptation Committee meeting, the Commission and Member States established an official working group, pursuant to the TAC rules of procedure, for the preparation of a RoHS 2 Frequently Asked Questions (FAQ) document. The working group completed its work in June 2012.
The FAQ are intended to help economic operators interpret the provisions of RoHS 2 in order to ensure compliance with the Directive’s requirements. They are considered a ‘living document’ and may be revised in the future.
Should stakeholders have any comments on the current version (with references to the respective questions and answers), they are asked to submit them to ENV-ROHS@ec.europa.eu until 14 September 2012.
The existing Commission FAQ document related to 2002/95/EC will remain valid until that Directive is repealed on 3 January 2013.

National Conference on Electronics Design, Assembly and Reliability

National Conference on Electronics Design, Assembly and Reliability: "The National Conference on Electronics Design, Assembly and Reliability (NCEDAR) is focused on your needs and your industry. This NEW event, backed by the experience and expertise of IPC — Association Connecting Electronics Industries®, brings you the latest information while providing valuable networking opportunities.

Organized by IPC India in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, NCEDAR will be held at the Indian Institute of Science, Bangalore, December 4–6, 2012.

Technical Conference — Discover the latest breakthroughs on topics including:

Design, simulation and modeling
Electronic components, RF and optoelectronics
Advanced packaging, including interconnections
Assembly and manufacturing technology (PCB)
Materials and processing
Reliability and quality control"

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New patents for Bi rich solders

Sumitomo have applied for patents on a novel lead free solder alloy, consisting predominantly of Bi with the major addition of Zn.  Smaller amounts of Al & P are also added, as well as Cu in some instances. Claims for the alloy include a small residual stress during solidification, allowing for a high joint strength and high reliability.  It also claimed that it can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature.

http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2012120733A1&KC=A1&FT=D&DB=EPODOC&locale=en_EP&date=20120913&rss=true

http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201204502A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120201&rss=true


Senju have also applied for a patent for a high temperature solder alloy containing 90% Bi with additions of Sn, Sb, Ag & P.

http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201213552A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120401&rss=true

Manufacturing of the Raspberry PI to move to the UK

One of the biggest holdups to owning a Raspberry Pi was its stuttering availability, so much so that it even prompted a few copycat boards. Creator Eben Upton and equipment makers Premier Farnell might have found the solution, teaming up with Sony to produce an initial run of 300,000 of the educational computers at the company's UK Technology Center, in Pencoed, near Bridgend in Wales. Upton hopes to keep the cost at $25 and $35 for two boards, thanks to employing Sony's "lean manufacturing techniques," and the Japanese company has already spent £50,000 ($80,000) on new package-on-package assembly equipment -- ensuring that we'll all be able to get our hands on one soon enough.

Premier Farnell, Sony, team up to move Raspberry PI manufacturing to the UK -- Engadget:

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Pb-free Electronics Risks Mitigation Project - DLA Technical Briefing 24 April 2012

A recent brieifing of PERM has taken place discussing the following

Discussion Topics
• Pb-free Electronics Supplier Issues
• Pb-free Electronics Risks & Failures
– Tin Whiskers
– Issues with Pb-free Alloys in COTS Electronics
– Unpredictable Service Life & Reliability for the Warfighter
• Risk Reduction Strategy
– Pb-free Electronics Risk Management (PERM)  Consortium
– “Manhattan Project” to Scope the Problem
– Pb-free Electronics Risk Reduction Program
• Take Away’s


http://www.dscc.dla.mil/downloads/psmc/Apr12/7PbFreeElectronicRiskReduction.pdf


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Orgalime Updates their Guide on Recast RoHS Directive, July 2011

The September 2012 update of "A practical Guide to understanding the specific obligations of Recast Directive 2011/65/EU on the Restriction of the use of Certain Hazardous Substances in EEE (RoHS II)”, update of September 2012."  has just bee n published.

This updated Guide on the Recast RoHS Directive aims at explaining the main changes and obligations arising from the recast, especially in the following areas:
• Scope
• Substance restrictions
• Exemptions
• Alignment of the Directive with the New Legislative Framework
• Terms and Definitions
• Review
• Transposition
• Comitology
Its update of September 2012 provides to readers the common understanding of the Directive of the affected European manufacturers of electrical and electronic equipment in the context of the Commission’s consultation on the draft RoHS2-FAQ Guidance Document of 15 June 2012 and its announced possible revision before 3 January 2013.
This updated version of the Orgalime RoHS Guide is available free of charge for downloading at http://publications.orgalime.org.
This Orgalime Guide and its update is to be considered as complementary to other Orgalime Guides on the WEEE and RoHS Directives. These other Orgalime Guides remain valid until repeal of the initial RoHS Directive 2002/95/EC taking effect from 3rd January 2013.
Orgalime's new updated RoHS Guide represents a living document that may be updated in the future according to implementation progress.
Orgalime, the European Engineering Industries Association, speaks for 37 trade federations representing some 130,000 companies in the mechanical, electrical, electronic, metalworking & metal articles industries of 22 European countries. The industry employs some 10.2 million people in the EU and in 2011 accounted for some €1,666 billion of annual output. The industry not only represents some 28% of the output of manufactured products but also a third of the manufactured exports of the European Union.

Orgalime Guides:

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Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme.


Science of the Total Environment
Volume 438, 1 November 2012, Pages 49-58



Scopus - Document details:

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RoHS the world over

Through the draft Regulation on the Declaration of Conformity for Pollution Control in Electrical and Electronic Product Enterprises of 18 July 2012 (公开征集《电子电气产品污染控制企业符合性声明规范》意见), China is taking one-step further action on the implementation of advanced RoHS control system. Amongst others, the draft Regulation of 18 July 2012 would provide all EEE producers and importers with a harmonized method of proofs and declaration on their conformance with voluntary and mandatory RoHS scheme in China.

Israel finally adopted the Environmental Treatment of Electrical and Electronic Equipment Law 2012 (חוק לטיפול סביבתי בציוד חשמלי ואלקטרוני ובסוללות, התשע"ב-2012) which is combination of the EU Directive on waste electrical and electronic equipment (WEEE2 recast) 2012/19/EU of 4 July 2012 and Directive 2006/66/EC on waste batteries and accumulators. The Law will require manufacturers and importers of electrical and electronic equipment (including batteries) to meet take-back and recycling targets as well as reporting and record keeping obligations as from 1 January 2014. EU WEEE Recast Directive 2012/19/EU of 4 July 2012 will extend WEEE requirements to all EEE placed on the EU market as from 15 August 2018.

Peru Supreme Decree No. 001-2012-MINAM approving the Regulation on the Management of Waste Electric and Electronic Equipment (Decreto Supremo No. 001-2012-MINAM que aprueba el Reglamento Nacional para la Gestión y Manejo de los Residuos de Aparatos Eléctricos y Electrónicos) starts requiring producers, importers, and/or distributor of electric and electronic equipment to have or enroll in a WEEE management system as from 28 June 2012. The draft European Commission Regulation of July 2012 implementing Directive 2009/125/EC of the European Parliament and of the Council with regard to ecodesign requirements for computers and computer servers is another big issue for electronics companies and may potentially impact:
- desktop computers;
- integrated desktop computers;
- notebook computers;
- desktop thin clients;
- workstations and mobile workstations; and
- small-scale servers and computer servers.

• [Cyprus] Recovery and recycling obligations of packaging extended to more companies
• [EU] Directive on energy efficiency proposed
• [Lithuania] Online registration required for EEE producers and importers of electric and electronic equipment
• [South Korea] Electromagnetic wave labeling required for wireless equipment
• [Thailand] WEEE management policy and regulation under consideration
• [UK-Scotland] New system for environmental regulation proposed
• [China] WEEE treatment fee imposed on producers and importers
• [EU] Calculation method of recycling efficiency for waste batteries and accumulators provided
• [China] Further hazard prevention and health record- keeping required
• [China] Revised China RoHS II Proposal released
• [Estonia] Suppliers and retailers of energy-related products must now comply with new framework for labelling and product information
• [France] WEEE and waste batteries management further harmonized with EU requirements
• [Germany] Recommendation on Risk assessment of nanomaterials at workplaces released
• [Turkey] WEEE Regulation entered into force
• [EU] Eight substances under consideration as substances of very high concern (SVHC)
• [Germany] Energy related products shall bear energy efficiency label
• [Venezuela] Electric and electronic waste take-back pilot program launched

Global EHS Compliance Insight

From Proactive EHS Compliance to Lobbying

Young & Global Partners

8 September 2012

http://campaign.r20.constantcontact.com/render?llr=rn7iveeab&v=0015qKm9V6FEG5UNsMk_8S9PQxire7yO1uSEJLJsGMHqHK1k9bu_Vs-dIF7wcuyqeB8fWibTCabdY3dvdfkbBVvF0KGcYGZb1nbfRLWmX0KfIQKhtakPayz6brI6aj5-F5I_5Wy8x4-5tme7nJ_VarvLeWDnrQKeWWzfXnRXfwwgCyrBDXWuqbagdArDe9iFvBfujuaeD0SstucqNGqGla32rjvF90O0-W8iJhdMJwkAhy8owNoX15nxuO4K6IOcAwmujAgIfDRmiw5_RSJVPv3aYOEWWAkHytCGA-evONQkemN-Hf_CwkUYFdzziPCqFmjx49Q2SMbP1GjaJAG6SFc2vIMhRQo9tYMmp_wiFsZpUU%3D

Key reliability concerns with lead-free connectors

The key reliability issues of lead-free connectors are presented. The electrical contact resistance of lead-free and lead-based solder-dipped contacts under various aging conditions is discussed first, followed by the fretting corrosion of lead-free contacts. Also presented is the reliability due to tin whiskers induced by mating pressure between connector contact elements.



Tadahiro Shibutani & Qiang Yu, Faculty of Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya, Yokohama, Kanagawa 240-8501, Japan

Michael Pechta, Center of Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, United States

Ji Wuc, Intel Corporation, Chandler, Arizona, United States


Microelectronics Reliability
Volume 48, Issue 10, October 2008, Pages 1613–1627



ScienceDirect.com - Microelectronics Reliability - Key reliability concerns with lead-free connectors:

TOWARDS ZERO DEFECTS SMART Group European Conference and Exhibition 2012

Tuesday 18th / Wednesday 19th September 2012 - Thame, Oxfordshire, UK



If your goal is 0% rework and 0% field failures, then the SMART Group’s exciting two day conference and exhibition is for you!
The proposed schedule for the two days is as follows:
 DAY 1
Keynote Presentation: Printed Circuit Boards to Printed Electronics - The Future: Steve Jones - Printed Electronics Ltd
Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins
 Electronics Design for Vibration: Andy Stiles - Aero Engine Controls
SMART HALT: Bob Page – Reliability Plus
Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett  - Axiom Manufacturing Services
High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV
Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium
Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen
Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt -  SMART Group
DAY 2
DFM – Why Can’t People Communicate?!:  Sue Knight - STI Ltd
A Practical View on the Introduction of Package On Package Assembly:  Bob Willis - EPS
Cleaning Under Low Stand-off Components: Rob Murphy - Zestron
Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL
Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins
Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus
DfM and DfR - Their Application for Hi-Rel Electronics Manufacture:  Charles Cawthorne - MBDA(UK)
ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd
The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins
Who should attend?
This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. Delegates can choose to attend either of the days or both. The costs for delegates include arrival drinks, mid-morning drinks, lunch, afternoon drinks and full access to all the proceedings immediately after the event.


http://www.smartgroup.org/wp-content/uploads/2012/06/SMARTConference2012flyer.pdf

Weak demand in electronics solders forces stall in recovery of Tin price

Tin prices are expected to stay in the $19,000 – 21,000/tonne range in the short-term, with some potential for an increase in price through the final quarter of the year into 2013. The main factors constraining an increase an increasingly gloomy world macro-economic outlook and weak demand in electronics solders.  However, some Chinese solder companies have reported that their business has improved since August and think the worst time in the year has been passed. A government transition is rumoured to be happening in the end of September. We expect that Chinese consumption will be better in the last quarter of this year.

Electronics Manufacturing by Inkjet Printing

Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for physical tooling. A wide variety of active and passive materials are currently being investigated for use in inkjet printed electronics. These include semiconductors, light emitters and photovoltaic materials as well as dielectric materials and straight forward conductors. The range of conducting materials that can be printed is somewhat limited by the constraints of inkjet printing. Ideally, particle sizes should be below 1 micron and the viscosities and surface tensions of the fluids need to be tailored to the particular printhead being used. Regardless of these limitations, various technologies are now being implemented in the production of circuit boards, interconnects and antennas by inkjet printing. The properties of these inkjet
printed circuits do not currently mimic traditional PCB materials – in particular, the sheet resistances of inkjet printed materials tend to be significantly higher than traditional copper clad laminate and the minimum feature sizes are somewhat larger than state of the art semi-additive plating. However, inkjet printed circuit technologies are a still finding many applications which are particularly well suited to their properties and the digital nature of their application.



Steve Thomas
 Conductive Inkjet Technology Ltd.
 Cambridge, England


http://www.ipcoutlook.org/pdf/inkjet_printing_ipc.pdf

Comparison of SAC105 and SAC305 Solders

Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys.  Much of the motivation for the alloy changes has been to improve mechanical shock resistance.  Several publications have established the improved performance of such 2nd
 level BGA/CSP sphere alloys; however, much less has been published regarding the thermal fatigue resistance of components with these new Pb-free ball alloys.  As these components and alloys become mainstream, their use in situations where thermal fatigue resistance is critical to product life will become an important consideration.  Therefore, an understanding of thermal fatigue performance for new alloys is
necessary for OEM/ EMS/ ODM companies to make design and procurement decisions, and for component suppliers to ensure the reliability of their products under a range of field use conditions.
In this study, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys: SAC105, Sn-3.5Ag, and SAC305 as a control.  Accelerated thermal cycle (ATC) testing was performed using 676 PBGA components with 1.0 mm pitch and electrolytic Ni/Au finished component pads.  These components were assembled to high-temperature rated Cu-OSP coated printed circuit boards using SAC 305 solder paste, which represents one of the most common assembly practices in industry today.  ATC testing was performed using the IPC-9701A TC1 condition of 0/100°C with 10-minute dwells (nominal); 3 different failure criteria were used in constructing the Weibull failure curves.  The data indicate that SAC105 has the lowest thermal fatigue resistance among the alloys tested, with Sn-3.5Ag and SAC
305 having similar and superior performance.  The impact of failure criterion on the Weibull curves is also presented.  The implications of these findings and areas for further study are discussed.


Authored By:
 Gregory Henshall, Hewlett-Packard Co.
 Jasbir Bath, Bath Technical Consultancy
 Sundar Sethuraman, Jabil
 David Geiger, Flextronics International
 Ahmer Syed, Amkor
 M.J. Lee, Xilinx
 Keith Newman and Livia Hu, Sun Microsystems
 Dong Hyun Kim and Weidong Xie, Cisco Systems
 Wade Eagar and Jack Waldvogel, Motorola



http://www.ipcoutlook.org/pdf/comparison_thermal_fatigue_ipc.pdf

Overcoming the Next Set of Technology Hurdles

The latest computer chips offer more functionality but are also harder to manufacture with technology reaching fundamental limits. Where will it go from here? What are the implications? This article will show you.

http://www.ipcoutlook.org/pdf2/next_set_technology_hurdles.pdf

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IPC-SMTA Cleaning and Conformal Coating Conference

This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.

“How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower and what is acceptably clean for one industry segment may be unacceptable in others.

A half-day workshop will be followed by a two-day technical conference, that will include tabletop exhibits, luncheons, and a networking reception.

Workshop
Tuesday, November 13, 8:00 am–12:00 pm

Conformal Coatings: Types, Uses and Specifications
Doug Pauls, Rockwell Collins and Jason Keeping, Celestica


Technical Conference Agenda

Tuesday, November 13
12:50 pm–1:00 pm Welcome
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
1:00 pm–2:30 pm Nano-Coatings
Session Leader: Craig Hillman, Ph.D., DfR Solutions

Innovative Superhydrophobicity Nano-Coatings that Protect HDI Interconnects from Moisture Absorption
Dan Hobson, Ross Technology Corporation

Characterization and Analysis of Plasma Polymers for Protective Films
Tim Von Werne, Semblant Ltd.

Chemical Vapor Deposition Enables Well-Defined Polymeric Films on Micro and Nano-Scale Features
Aleksandr White, GVD Corporation, Inc.
2:30 pm–3:00 pm Break
3:00 pm–4:00 pm Increasing the Reliability of Electronic Devices
Stephen Coulson, Ph.D., P2i

Enhancing Water-Blocking Nano Coatings for Telecommunications Devices
Blake Stevens, Ph.D., HzO
4:00 pm–4:45 pm Keynote: Printed Circuit Board Reliability — Factors OEMs Should Consider in the Age of Miniaturization
Dave Hillman, Rockwell Collins
5:00 pm–6:30 pm Networking Reception sponsored by Kyzen Corporation
Wednesday, November 14
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–9:30 am Conformal Coating
Session Leader: Jeff Kennedy, Celestica

High Temperature Reliability Limits of Silicon Conformal Coatings
Carlos Montemayor, Dow Corning Corporation

Investigation of Adhesive Strength of Conformal Coatings
Rich Kraszewski, Plexus Corporation

Standardization of Electronic Conformal Coatings in an Aerospace OEM
Hector Valladares, Honeywell International
9:30 am–10:00 am Break
10:00 am–11:30 am Use of IPC-B-52 Test Assembly for Conformal Coating Process Optimization
Doug Pauls, Rockwell Collins

A Preliminary Investigation into Enhanced Automated Selective Conformal Coating of Electronic Assemblies by employing Plasma Treatment Technology
David Foote and Hector Pulido, Nordson Asymtek

Throughput and Yield Improvements via Conformal Coating Process Characterization
Brad Perkins and Hector Pulido, Nordson Asymtek and Manuel Fernandez, Celestica
11:30 am–12:30 pm Luncheon sponsored by Zestron
12:30 pm–3:00 pm Cleanliness Assessment & Process Control
Session Leader: Doug Pauls, Rockwell Collins

A ROSE is Still a ROSE? Ionically, It Makes a Difference!
Graham Naisbitt, Gen3 Systems Limited

Localized Extraction Methods for Ionic Analysis
Eric Camden, Foresite, Inc. and Doug Pauls, Rockwell Collins

Cleaning Challenges in an HDI World
Mark Northrup, IEC Electronics Corp., Joe Russeau, Precision Analytical Laboratory, Inc. and Mike Bixenman, DBA, Kyzen Corporation

IPC-B-52 SIR: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future
Matt Kelly, IBM Corporation

A Comparison of Extract Solution Composition for Bare Boards
Jennifer Klavon, Rockwell Collins
3:00 pm–3:30 pm Break
3:30 pm–5:30 pm Environmental Standards and Regulations
Session Leader: Lee Wilmot, TTM Technologies, Inc.

Regulations and Productive Electronics Assembly: A Review of the Proposed OTC Regulations Targeted for 13 Eastern States
Barbara Kanegsberg, BFK Solutions

Green Screen Chemical Hazard Assessment Tool for Selecting Safer Cleaning
Curtis Wray, Hewlett-Packard Company

Reduction of VOC Emissions and Alternatives to Toxic Conformal Coatings
Emmanuelle Guene, Inventec Performance Chemicals

RoHS 2 / REACH / Conflict Materials
Ron Lasky, Ph.D., Indium Corporation of America
Thursday, November 15
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–10:00 am Electronics Assembly and PCB Failure Mechanisms & Reliability
Session Leader: Dave Hillman, Rockwell Collins

Influence of Ionic Contamination and Tin Whiskers
Stephan Meschter, Ph.D., BAE Systems Platform Solutions and Polina Snugovsky, Ph.D., Celestica

Creep Corrosion of PCB Assemblies: Effects of Surface Contamination
Martin Anselm, Universal Instruments

How Conformal Coating Can Kill
Craig Hillman, Ph.D., DfR Solutions

Electrical Reliability of Combinations of Solder Paste, Wave Soldering Flux and Conformal Coatings
Karen Tellefsen, Cookson Electronics
10:00 am–10:30 am Break and Box Lunch
10:30 am–1:30 pm Assembly Cleaning & Challenges
Session Leader: Dale Lee, Plexus Corporation

Process Optimization and Customer Requirements
Ken Van Zill, Ducommun LaBarge Technologies, Inc.

Cleaning No-Clean Flux Residues
Michael Havener, Benchmark Electronics Inc.

Electronics Effects of Cleaning Agents on Adhesives and Conformal Coating
Tana Soffa, L.W. Nusbaum, P.A. Panackal and K.F. Schoch, Jr., Northrop Grumman Corporation

Improvement of Cleaning Lead-Free Flux Residues for HDI Assemblies by Reduction of Oxygen Levels During Reflow
Maeva Tureau, Ph.D.; Chris Han-Adebekun, Ph.D. and Greg Arslanian, Air Products & Chemicals

Determining Critical Cleaning Process Parameters for QFNs
Umut Tosun, Naveen Ravindran and Michael McCutchen, ZESTRON America

Assembly Cleaning Process Characterization — Utilizing Repeatable Chemistry Solution Control
Dave Adams, Rockwell Collins; Dave Lober and John Williamson, Kyzen Corporation
1:30 pm–1:45 pm Adjournment
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation



IPC-SMTA Cleaning and Conformal Coating Conference:

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Solder foams, nano-porous solders, foamed-solder balls

A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.



Page bookmark TWI358340  (B)  -  Solder foams, nano-porous solders, foamed-solder b
Inventor(s): CHOE HEEMAN [KR]; SUH DAEWOONG [KR] +
Applicant(s): INTEL CORP [US] +
Classification:
- international: B23K35/02; B23K35/14; H01L21/66
- European: B23K35/02D5P; B23K35/22; H05K3/34C4B; H05K3/34F1
Application number: TW20060146439 20061212 
Priority number(s): US20050323218 20051230
Also published as:
US2007152016  (A1)   US7745013  (B2)   WO2007078717  (A2)   WO2007078717  (A3)   KR20080083127  (A)   more 

IPC APEX EXPO 2013

San Diego Conference Centre
19 - 21 February 2013

FREE! Opening keynote — Join theoretical physicist, best-selling author and futurist Dr. Michio Kaku for an awe-inspiring look at the future!

Show highlights include:

FREE! More than 400 exhibitors showing equipment, materials and services for printed boards and electronics manufacturing — plus printed electronics! There's no better place to see and compare.
The largest technical conference for our industry in the world. Highly selective, the conference presents new research and innovations from experts in the fields of electronics assembly, test and board fabrication and design.
FREE! Industry poster sessions — Catch up on the latest research and meet the authors.
Professional development courses provide comprehensive updates on pressing industry concerns.
Standards development meetings that help shape the future of our industry.
Compete in or watch the exciting IPC International Hand Soldering Grand Championship on the show floor.
Stay tuned, there’s a lot more to come!


Home Page | IPC APEX EXPO 2013:

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IPCWorksAsia 2012

IPC WorksAsia 2012 to build the South China electronics industry technology festival

PCB & electronic assembly and cutting-edge technology / best practices / Green Manufacturing

Time: 30 to 31st October 2012

Location: Shenzhen, Shihua Hotel

Organizers: IPC-International Electronics Industry Association Connecting

IPC engineers in Shenzhen, southern China, the majority of electronics companies, professional and technical personnel, functional managers are meeting to create a PCB & electronic assembly and cutting-edge technology / best practices / green manufacturing technology festival! Economic slowdown, lack of demand, rising costs, the opportunity to learn a changing set of technologies, processes, management and policy in one place, absolutely not to be missed!
•Activities: theme seminars , experienced professionals bringing together well-known domestic and foreign enterprises and academia, side by side hot topics dedicated to advanced theories on PCB & assembly, best practices, management and policy.
•Activity Two: Reliability seminar, lectures by experts from well-known companies and laboratories on ways to improve product reliability.

Seats are limited, please register reserved seats as soon as possible!


http://www.ipc.org.cn/Events/IPCWorksAsia-2012/default.htm

THE Pb-FREE IN ELECTRONICS RISK MITIGATION (PERM) CONSORTIUM

A paper has just be released describing the organization, content, and expectations of the newly formed Pb-free Electronics Risk Mitigation (PERM) consortium and its stakeholders. PERM was created as a more focussed group of the LEAP consortium.

The AIA-sponsored Pb-free Electronics in Aerospace  Project (LEAP) has been the premier industry working group in the the defense/aerospace industry since 2004.  It has worked to identify and address the risks and other challenges associated with the use of Pb-free electronics in high performance & high reliability equipment.  It has successfully provided resources such as handbooks and standards as well as templates, guidelines, and other tools to support risk mitigation.  However, the use of Pb-free materials has grown to such an extent that many components/parts are no longer available in tin-lead (either surface finishes or interconnection media).   Engineers have been forced to use some Pb-free parts in their new designs or,  in  many  cases,  as  part  of retrofits and upgrades, leading to concern over performance and reliability.

An ad hoc sub-committee of the LEAP team spent over a year producing a more focused entity called the Pb-free Electronics Risk Mitigation (PERM) consortium, to provide overarching executive leadership and coordination of Pb-free electronics risk management activities for the aerospace and defense community on both the government and industry side.   It is focussed on those activities that provide value-added results.  More information


http://www.ipcoutlook.org/pdf/pb_free_risk_mitigation_smta.pdf

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IPC Solder paste standard emerges

IPC-7527, the first published standard that originated outside the U.S., provides guidance for solder paste.

Solder paste is a necessity for basically all printed circuit boards, but it's one of the most overlooked technologies in the electronics industry. IPC has completed the first standard that will help development teams improve the quality of their solder paste operations, which could bring significant improvements in quality and reliability.

IPC-7527, Requirements for Solder Paste Printing, covers the many aspects of solder paste, from initial placement on the board through tests after boards are ready to move forward on production lines. The standard will cover a large footprint.

"This document is useful for anyone who uses solder paste," said Kris Roberson, IPC's manager of assembly technology. "Before this came together, much of the awareness for solder was 'tribal knowledge' passed from one person to another. That can get to be like the telephone game, where two or three generations down the road the information has changed quite a bit."

The benefits go beyond the unchanging nature of the printed word. The new standard serves as a reference guide for equipment operators. They can now turn to a book when they have questions and can't find the company expert.

"It provides the operators with a standard that will help them make the right decisions when they face with issues in production, and no professionals or specialists are present," Steven Juel Hansen, cochairman of the Solder Paste Printing Task Group and production engineer at Vestas Control Systems A/S, based in Hammel, Denmark.

That Hansen is in Denmark is quite significant. IPC-7527 is the first published IPC standard that originated outside the United States.

"The Nordic group came up with the idea, created the standard and brought a nearly-completed document to IPC. They had done a thorough job. Once they brought it to us it took less than a year to move it to publication. That's pretty speedy given the time needed for public comment and responses, as well as for getting the document ready to publish," Roberson said.

Given IPC's expanding global strategy, it's unlikely that it will be the last. Roberson cites another first for the document, this one on the technical side.

"There are standards that tell what the completed assembly should look like, but this is the first one to tell us what the solder paste should look like," Roberson said. "When things are written down, they provide a common language that clearly specifies requirements. IPC-7527 tells you how far off centers can be before they're considered faulty. In the past, operators did whatever the companies decided to do."

He noted that IPC-7527 is designed to be a useful document for equipment operators and others who work with one of this industry's basic infrastructure elements, solder. Preventing problems with this electrical and mechanical technology can help improve the quality and reliability of many printed circuit boards.

"The standard does a nice job of bringing out common problems, like solder that has rooftops or saddle shapes instead of a nice brick form, and it provides solutions so those issues can be fixed," Roberson said.

When issues like saddles and rooftops arise, the old adage of a picture being worth 1,000 words comes into play. Committee members endorsed that simple saying, packing 50 photos into the 15-page standard.

Though it's fairly short, IPC-7527 addresses a broad range of technologies. It covers solder paste from the early stages through production and testing.

"This covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. It also provides information on automated past inspection using either cameras or lasers," Roberson said.

For more information on the standard (already available in English and Danish), visit www.ipc.org/onlinestore.



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