Scopus - Document details:
http://www.scopus.com/record/display.url?eid=2-s2.0-84866533597&origin=inward&txGid=bKWlxuWR1ZmFh1DrfpQ4Gij%3a3
Almeida, C.M.V.B. , Madureira, M.A., Bonilla, S.H., Giannetti, B.F.
Programa de Pós - Graduação em Engenharia de Produção da Universidade Paulista, Rua Dr Bacelar 1212, Mirandópolis, 04026-002 São Paulo, Brazil
Abstract
Human health and environmental concerns are not usually considered at the same time. Tin-lead solders are still widely used in several countries, including Brazil, by manufacturers of electronic assemblies. One of the options to reduce or eliminate lead from the manufacturing environment is its replacement with lead-free alloys. This paper applies emergy synthesis and the DALY indicator (Disability Adjusted Life Years) to assess the impact of manufacturing soft solder using tin, lead and other metals on the environment and on human health. The results are presented together with the company's financial results and the results calculated from the Brazilian statistical value of life. The calculation of emergy per unit showed that more resources are used to produce one ton of lead-free solders than to produce one ton of tin-lead solders, with and without the use of consumer waste recovered through a reverse logistics system. The assessment of air emissions during solder production shows that the benefits of the lead-free solution are limited to the stages of manufacturing and assembling. The tin-lead solder appears as the best option in terms of resource use efficiency and with respect to emissions into the atmosphere when the mining stage is included. A discussion on the influence of the system's boundaries on the decision-making process for materials substitution is presented.
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Friday, October 19, 2012
New nanoalloys for high temperature soldering
New nanoalloys for high temperature soldering:
Nanowerk News) Removing lead from manufacturing processes and products is high priority for the EU. A European research programme has tackled the problem of high-temperature solders used in the electronics industry.
On soldering components on a printed circuit board, it is crucial that the joints do not remelt in subsequent soldering operations. The electronics industry is therefore inclined to use solder material containing a high percentage of lead with a higher melting point (300 °C and above).
One solution is to use so-called nanosolders based on tin-antimony (Sn-Sb) alloys. Nanoparticles have a lower melting point than the bulk substance. Funded by the EU, the project 'A chemical approach to lead-free nanosolders' (Nanosold) aimed to develop new lead-free high-temperature solders with Sn-Sb-M alloys. M is silver (Ag), copper (Cu) and nickel (Ni).
Concentrating on the two ternary alloy systems Sn-Sb-Ag and Sn-Sb-Cu, the Nanosold project investigated the thermodynamic properties, the sum of the features of the individual phases. The team used the so-called 'Computer coupling of phase diagrams and thermochemistry' (Calphad) method enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
A reduction in melting point of up to 11 °C was achieved using nanoalloys rich in Sn prepared by a chemical reduction method. Particle size was modified to be in the range of 50 to 150 nm which would translate into a size-dependent lowering of soldering temperature in any practical application.
Although there are further problems to be worked on, solder pastes based on nanoalloys would achieve a decrease in melting point. From an environmental point of view, the new nanoalloys remove a very toxic element from electronic appliances' manufacturing.
Source: Cordis
'via Blog this'
Nanowerk News) Removing lead from manufacturing processes and products is high priority for the EU. A European research programme has tackled the problem of high-temperature solders used in the electronics industry.
On soldering components on a printed circuit board, it is crucial that the joints do not remelt in subsequent soldering operations. The electronics industry is therefore inclined to use solder material containing a high percentage of lead with a higher melting point (300 °C and above).
One solution is to use so-called nanosolders based on tin-antimony (Sn-Sb) alloys. Nanoparticles have a lower melting point than the bulk substance. Funded by the EU, the project 'A chemical approach to lead-free nanosolders' (Nanosold) aimed to develop new lead-free high-temperature solders with Sn-Sb-M alloys. M is silver (Ag), copper (Cu) and nickel (Ni).
Concentrating on the two ternary alloy systems Sn-Sb-Ag and Sn-Sb-Cu, the Nanosold project investigated the thermodynamic properties, the sum of the features of the individual phases. The team used the so-called 'Computer coupling of phase diagrams and thermochemistry' (Calphad) method enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
A reduction in melting point of up to 11 °C was achieved using nanoalloys rich in Sn prepared by a chemical reduction method. Particle size was modified to be in the range of 50 to 150 nm which would translate into a size-dependent lowering of soldering temperature in any practical application.
Although there are further problems to be worked on, solder pastes based on nanoalloys would achieve a decrease in melting point. From an environmental point of view, the new nanoalloys remove a very toxic element from electronic appliances' manufacturing.
Source: Cordis
'via Blog this'
Friday, October 12, 2012
How Lead-Free Solder (Mis)Behaves under Stress | Advanced Photon Source
How Lead-Free Solder (Mis)Behaves under Stress | Advanced Photon Source:
The reliability and longevity of electronics are critical to our interconnected world that is so dependent upon Internet and telecommunications technology. The computers, routers and switches, phones, and all the devices that link us together must be dependable down to the solder joints that connect integrated circuits to circuit boards, which can be an Achilles heel in an otherwise failure-free device.
Utilizing new synchrotron x-ray techniques and two synchrotron x-ray beamlines at the U.S. Department of Energy Office of Science’s Advanced Photon Source (APS), researchers from Cisco Systems, Inc.; Michigan State University; and the Max-Planck-Institut für Eisenforschung GmbH studied the beginnings of the thermal fatigue process in environmentally friendly, lead-free solder joints, as well as what happens toward the end of that process. These insights bring scientists a step closer to developing useful models for making reliability predictions about solder-joint failure in this new material.
"In electronic system failures, more than half are solder joint failures," said Thomas Bieler of Michigan State University, a coauthor of the two Journal of Electronic Materials articles based on these studies. "There are a lot of these connections, and a failure in any one of them could potentially kill the functionality of the entire system."
The first century of electronics used lead-based solder because it was cheap and easy to work with. Engineers thoroughly understood the electrical, thermal, and structural behavior of these solders and were able to accurately predict reliability. As the environmental dangers of lead became apparent, manufacturers looked for alternatives. In 2006, the European Union Restriction of Hazardous Substances Directive came into effect, banning lead-containing solders from all consumer electronics devices. But while protecting people and the environment, the ban created a new problem: How reliable were lead-free solders?
"Especially in the telecommunications industry, the expected lifetime of many products is long, and also a very low failure rate is needed," said coauthor Tae-Kyu Lee of the Component Quality and Technology Group at Cisco Systems. "Before 2006, the industry had a very large library of reliability data based on lead-containing material, so even if they didn't know the exact failure mechanism, they could still assess the lifetime of the product. But since we're now using a new material, we need to know more about how the material’s performance evolves."
The researchers in this study developed new techniques and employed them at the APS to track the development of the failure mechanism of lead-free solder joints in situ for the first time. Working at the X-ray Science Division 6-ID-D and 34-ID-E beamlines at the Argonne National Laboratory APS, they conducted experiments to demonstrate how synchrotron x-ray diffraction could reveal the evolution of crystal orientation and strain patterns during thermal cycling in tin-containing, lead-free solder joints, specifically in the commonly used tin-silver-copper alloy SAC 305 (Sn-3%Ag-0.5% Cu).
Older lead-tin solders tend to solidify as a polycrystal, delivering a solder joint that has a uniform microstructure, with reproducible properties. But lead-free solders usually solidify either as a randomly oriented single crystal or a tricrystal. "With the lead-free solders, the properties of solder joints are all over the map," Bieler said. "Some joints have hard orientations, others soft, some last forever, some fail at a very early time. That makes life difficult for electronics manufacturers when they have to think about warranty costs and when the first failure is going to happen."
Failures in lead-free solders don't always occur in areas where shear strains from thermal expansion mismatches are highest. This is a consequence of the non-cubic structure of tin and its highly anisotropic thermal expansion and stiffness. It is difficult to predict the strains that develop in an individual joint, given the random crystal orientation, so the prediction of damage is even more challenging. Furthermore, the crystal orientations evolve with thermal cycling. The experimenters examined SAC 305 joints both in a plastic ball grid array (PBGA) package sample and a wafer-level chip-scale package (WLCSP). Both types have been examined under thermal cycling, and the latter was studied in situ during melting, resolidification, and thermal cycling.
The advantages of the x-ray approach over the cross-sectional electron microscopy generally used to study solder joints were immediately apparent. "In a two-dimensional cross section, one does not necessarily know what has been removed or what is underneath the surface. With three-dimensional full illumination of the joint, we were able to prove that we did indeed primarily have single crystals in some joints and tricrystals in others," said Bieler.
"To clearly predict the lifetime of a certain joint,” said Lee, “we need to understand the failure mechanism. This study allowed us to see inside the joint while imposing thermal cycles in situ. Most of the earlier studies use destructive analysis to see the microstructure development after things happened. But the APS synchrotron lets us see the microstructure evolution during the event."
The x-ray diffraction measurements also provide a more dynamic picture of what happens inside the solder joint as it passes through different phases over time. For example, although there are only a few different tin crystal orientations in a given SAC lead-free solder joint, different orientations are always observed after melting and resolidification. Recrystallization behavior under thermal cycling also results in evolution of the tin crystal orientation.
Lee was surprised by "the overall tin material response to the external factors. I considered tin as a 'dead' material with a certain crystal structure, but the more you look into this material, it seems to react like a living thing."
“What the APS data has especially enabled us to do is get a comprehensive picture of the very beginning of the thermal fatigue process [on beamline 6-ID-D] and connect it with what happens toward the end [on beamline 34-ID-E]," Bieler said.
Observing how the x-ray diffraction peaks changed from initial solidification and proceeded to spread out over repeated thermal cycles, Bieler said, "really helped us get to the point where we could describe the sequential mechanism from the moment of solidification up to the first crack that forms. We are able to explain everything that happened and why it happened in these solder joints as a result of what we've been able to do at the APS. The APS has been very helpful for understanding the early stage as well as the stage just before cracks form."
These fresh insights into the failure mechanism of lead-free solder joints guide scientists in their development of models for making reliability predictions. Although it is too early to proclaim any definite remedy for improving reliability in lead-free solder joints, the work provides some important clues.
"To find the right mitigation, you need to find the right failure mechanism," Lee said. "Based on the study so far, we identified that the grain refinement in tin interconnects is bad for thermal cycling performance. But at the same time it is beneficial for resistance to mechanical shock. So there are no golden rules, but at least we are beginning to understand why."
As for next steps, Bieler said that "finding a reliable, automated way to index diffraction patterns from multi-crystal joints would greatly speed up our ability to mine the data we have more effectively. Analysis strategies to obtain stress and strain would naturally follow using established methods. Continuing in situ measurements in thermomechanical cycling specimens, and looking toward comparing the microstructure before and after shock conditions (or possibly in situ), could also be effective. Microbeam diffraction in solder bumps is also a desirable thing to do, as the volumes are small, and this method is well suited for exploring tiny places." — Mark Wolverton
http://www.aps.anl.gov/Science/Highlights/Content/APS_SCIENCE_20121008.php
'via Blog this'
The reliability and longevity of electronics are critical to our interconnected world that is so dependent upon Internet and telecommunications technology. The computers, routers and switches, phones, and all the devices that link us together must be dependable down to the solder joints that connect integrated circuits to circuit boards, which can be an Achilles heel in an otherwise failure-free device.
Utilizing new synchrotron x-ray techniques and two synchrotron x-ray beamlines at the U.S. Department of Energy Office of Science’s Advanced Photon Source (APS), researchers from Cisco Systems, Inc.; Michigan State University; and the Max-Planck-Institut für Eisenforschung GmbH studied the beginnings of the thermal fatigue process in environmentally friendly, lead-free solder joints, as well as what happens toward the end of that process. These insights bring scientists a step closer to developing useful models for making reliability predictions about solder-joint failure in this new material.
"In electronic system failures, more than half are solder joint failures," said Thomas Bieler of Michigan State University, a coauthor of the two Journal of Electronic Materials articles based on these studies. "There are a lot of these connections, and a failure in any one of them could potentially kill the functionality of the entire system."
The first century of electronics used lead-based solder because it was cheap and easy to work with. Engineers thoroughly understood the electrical, thermal, and structural behavior of these solders and were able to accurately predict reliability. As the environmental dangers of lead became apparent, manufacturers looked for alternatives. In 2006, the European Union Restriction of Hazardous Substances Directive came into effect, banning lead-containing solders from all consumer electronics devices. But while protecting people and the environment, the ban created a new problem: How reliable were lead-free solders?
"Especially in the telecommunications industry, the expected lifetime of many products is long, and also a very low failure rate is needed," said coauthor Tae-Kyu Lee of the Component Quality and Technology Group at Cisco Systems. "Before 2006, the industry had a very large library of reliability data based on lead-containing material, so even if they didn't know the exact failure mechanism, they could still assess the lifetime of the product. But since we're now using a new material, we need to know more about how the material’s performance evolves."
The researchers in this study developed new techniques and employed them at the APS to track the development of the failure mechanism of lead-free solder joints in situ for the first time. Working at the X-ray Science Division 6-ID-D and 34-ID-E beamlines at the Argonne National Laboratory APS, they conducted experiments to demonstrate how synchrotron x-ray diffraction could reveal the evolution of crystal orientation and strain patterns during thermal cycling in tin-containing, lead-free solder joints, specifically in the commonly used tin-silver-copper alloy SAC 305 (Sn-3%Ag-0.5% Cu).
Older lead-tin solders tend to solidify as a polycrystal, delivering a solder joint that has a uniform microstructure, with reproducible properties. But lead-free solders usually solidify either as a randomly oriented single crystal or a tricrystal. "With the lead-free solders, the properties of solder joints are all over the map," Bieler said. "Some joints have hard orientations, others soft, some last forever, some fail at a very early time. That makes life difficult for electronics manufacturers when they have to think about warranty costs and when the first failure is going to happen."
Failures in lead-free solders don't always occur in areas where shear strains from thermal expansion mismatches are highest. This is a consequence of the non-cubic structure of tin and its highly anisotropic thermal expansion and stiffness. It is difficult to predict the strains that develop in an individual joint, given the random crystal orientation, so the prediction of damage is even more challenging. Furthermore, the crystal orientations evolve with thermal cycling. The experimenters examined SAC 305 joints both in a plastic ball grid array (PBGA) package sample and a wafer-level chip-scale package (WLCSP). Both types have been examined under thermal cycling, and the latter was studied in situ during melting, resolidification, and thermal cycling.
The advantages of the x-ray approach over the cross-sectional electron microscopy generally used to study solder joints were immediately apparent. "In a two-dimensional cross section, one does not necessarily know what has been removed or what is underneath the surface. With three-dimensional full illumination of the joint, we were able to prove that we did indeed primarily have single crystals in some joints and tricrystals in others," said Bieler.
"To clearly predict the lifetime of a certain joint,” said Lee, “we need to understand the failure mechanism. This study allowed us to see inside the joint while imposing thermal cycles in situ. Most of the earlier studies use destructive analysis to see the microstructure development after things happened. But the APS synchrotron lets us see the microstructure evolution during the event."
The x-ray diffraction measurements also provide a more dynamic picture of what happens inside the solder joint as it passes through different phases over time. For example, although there are only a few different tin crystal orientations in a given SAC lead-free solder joint, different orientations are always observed after melting and resolidification. Recrystallization behavior under thermal cycling also results in evolution of the tin crystal orientation.
Lee was surprised by "the overall tin material response to the external factors. I considered tin as a 'dead' material with a certain crystal structure, but the more you look into this material, it seems to react like a living thing."
“What the APS data has especially enabled us to do is get a comprehensive picture of the very beginning of the thermal fatigue process [on beamline 6-ID-D] and connect it with what happens toward the end [on beamline 34-ID-E]," Bieler said.
Observing how the x-ray diffraction peaks changed from initial solidification and proceeded to spread out over repeated thermal cycles, Bieler said, "really helped us get to the point where we could describe the sequential mechanism from the moment of solidification up to the first crack that forms. We are able to explain everything that happened and why it happened in these solder joints as a result of what we've been able to do at the APS. The APS has been very helpful for understanding the early stage as well as the stage just before cracks form."
These fresh insights into the failure mechanism of lead-free solder joints guide scientists in their development of models for making reliability predictions. Although it is too early to proclaim any definite remedy for improving reliability in lead-free solder joints, the work provides some important clues.
"To find the right mitigation, you need to find the right failure mechanism," Lee said. "Based on the study so far, we identified that the grain refinement in tin interconnects is bad for thermal cycling performance. But at the same time it is beneficial for resistance to mechanical shock. So there are no golden rules, but at least we are beginning to understand why."
As for next steps, Bieler said that "finding a reliable, automated way to index diffraction patterns from multi-crystal joints would greatly speed up our ability to mine the data we have more effectively. Analysis strategies to obtain stress and strain would naturally follow using established methods. Continuing in situ measurements in thermomechanical cycling specimens, and looking toward comparing the microstructure before and after shock conditions (or possibly in situ), could also be effective. Microbeam diffraction in solder bumps is also a desirable thing to do, as the volumes are small, and this method is well suited for exploring tiny places." — Mark Wolverton
http://www.aps.anl.gov/Science/Highlights/Content/APS_SCIENCE_20121008.php
'via Blog this'
Pb-free solder alloy mainly containing Zn
Espacenet - Bibliographic data:
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400 DEG C and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass%, preferably 3.0 to 7.0 mass% of Al, 0.002 to 0.800 mass%, preferably 0.005 to 0.500 mass% of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass% of Mg or 0.3 to 3.0 mass% of Ge.
Page bookmark TW201228764 (A) - Pb-free solder alloy mainly containing Zn
Inventor(s): ISEKI TAKASHI [JP] +
Applicant(s): SUMITOMO METAL MINING CO [JP] +
Classification:
- international: B23K35/28; C22C18/04
- European: B23K35/28B; H05K3/34F1
Application number: TW100140229 20111104
Priority number(s): JP20100274134 20101208
Also published as: WO2012077415 (A1) JP2012121053 (A)
'via Blog this'
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400 DEG C and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass%, preferably 3.0 to 7.0 mass% of Al, 0.002 to 0.800 mass%, preferably 0.005 to 0.500 mass% of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass% of Mg or 0.3 to 3.0 mass% of Ge.
Page bookmark TW201228764 (A) - Pb-free solder alloy mainly containing Zn
Inventor(s): ISEKI TAKASHI [JP] +
Applicant(s): SUMITOMO METAL MINING CO [JP] +
Classification:
- international: B23K35/28; C22C18/04
- European: B23K35/28B; H05K3/34F1
Application number: TW100140229 20111104
Priority number(s): JP20100274134 20101208
Also published as: WO2012077415 (A1) JP2012121053 (A)
'via Blog this'
IWLPC - International Wafer-Level Packaging Conference
IWLPC - International Wafer-Level Packaging Conference:
SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition program is finalized. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
http://www.iwlpc.com/
'via Blog this'
SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition program is finalized. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
http://www.iwlpc.com/
'via Blog this'
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy:
ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
'via Blog this'
ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
'via Blog this'
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn:
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
'via Blog this'
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
'via Blog this'
Tuesday, October 9, 2012
IPC Medical Industries Technical Conference
IPC Medical Industries Technical Conference:
'via Blog this'
November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
'via Blog this'
November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
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