Scopus This paper elaborates the 3T-approach to life consumption monitoring of solder joints in operating temperature environment without requiring simplification of operating loads.
(Dont really know what this is - sounded interesting... - Jeremy)
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
2012, Article number 6191699
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012;Cascais;16 April 2012through18 April 2012;Code89825
An approach to life consumption monitoring of solder joints in operating temperature environment ( Conference Paper )
Johansson, J.ab, Belov, I.a , Johnson, E.c, Leisner, P.ac
a Dept. Mechanical Engineering, School of Engineering, Jönköping University, Box 1026, SE-551 11 Jönköping, Sweden
b Saab AB, Business Area Electronic Defence Systems, Box 1017, SE-551 11 Jönköping, Sweden
c SP Technical Research Institute of Sweden, Box 857, SE-501 15 Borås, Sweden
Showing posts with label Automotive. Show all posts
Showing posts with label Automotive. Show all posts
Friday, June 22, 2012
Monday, March 19, 2012
EU consultant draft recommendation on ELV windscreen exemption
EU consultant Okopol has drafted a recommendation that the End of Life Vehicle Directive exemption for lead solders used in windscreens be removed.
Possible 3-year extension:
"In case the Commission grants the OEMs additional time, the consultants suggest the following wording for exemption 8 (i):
Lead in solders in electrical glazing applications on glass, except for soldering in laminated glazing, in vehicles type approved before 1 January 2015, and lead in spare parts for these vehicles."
The report has some revealing insights into development and properties of indium lead-free solders.
ACEA representing the car industry argued that indium solders melt at too low temperature and sunlight etc will melt them. However, it seems to depend on how this is measured. Some indium solders are already used in the industry for some years with no evidence of failure.
However, indium is on the list of critical materials.
In fact this is a very small market - only about 15 tonnes maximum (?in Europe) and probably less.
It also says the St Gobain are developing bismuth-based low temperature solders by end-2012.
Report
Related story
Possible 3-year extension:
"In case the Commission grants the OEMs additional time, the consultants suggest the following wording for exemption 8 (i):
Lead in solders in electrical glazing applications on glass, except for soldering in laminated glazing, in vehicles type approved before 1 January 2015, and lead in spare parts for these vehicles."
The report has some revealing insights into development and properties of indium lead-free solders.
ACEA representing the car industry argued that indium solders melt at too low temperature and sunlight etc will melt them. However, it seems to depend on how this is measured. Some indium solders are already used in the industry for some years with no evidence of failure.
However, indium is on the list of critical materials.
In fact this is a very small market - only about 15 tonnes maximum (?in Europe) and probably less.
It also says the St Gobain are developing bismuth-based low temperature solders by end-2012.
Report
Related story
Monday, October 17, 2011
New method for soldering to glass
Factiva "A new variant of the anodic bonding technique (ALTSAB: Activated Liquid Tin Solder Anodic Bonding) is described, which offers a number of advantages for direct glass to metal sealing over conventional methods. It employs a tin solder alloy containing an activating metal which is anodically bonded to alkali rich glass substrates in the liquid state."
"Two different test specimens were fabricated and characterized under vacuum at a pressure of 5 x 10(-4) mbar and a bonding temperature of 300 degrees C and compared with standard Al/glass anodic bonds. The ability to fabricate dual interface bonds of good quality and high shear strength > 16 MPa by the ALTSAB method was demonstrated. With the sealant metal in the liquid state, this methodology promises superior surface adaptation and therefore joint performance when compared with the standard anodic bonding. More importantly, there is no need for premetallization or surface pretreatment of the glass substrates, and unlike in conventional anodic bonding, there is no need for mechanically loading the joining assembly. Wetting of the float glass substrates by the activated solder alloy SnAl0.6 after successful anodic bonding was confirmed by optical microscopy. The enrichment of the activating element Al at the bonding interface was confirmed by SEM and EDS element mapping," wrote M.M. Koebel and colleagues, Swiss Federal Laboratories for Materials Testing and Research.
The researchers concluded: "The methodology presented here shows great promise for various large-area sealing applications, particularly vacuum glazing, thin film and organic PV and OLED technology."
Koebel and colleagues published their study in Solar Energy Materials and Solar Cells (Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method. Solar Energy Materials and Solar Cells, 2011;95(11):3001-3008).
"Two different test specimens were fabricated and characterized under vacuum at a pressure of 5 x 10(-4) mbar and a bonding temperature of 300 degrees C and compared with standard Al/glass anodic bonds. The ability to fabricate dual interface bonds of good quality and high shear strength > 16 MPa by the ALTSAB method was demonstrated. With the sealant metal in the liquid state, this methodology promises superior surface adaptation and therefore joint performance when compared with the standard anodic bonding. More importantly, there is no need for premetallization or surface pretreatment of the glass substrates, and unlike in conventional anodic bonding, there is no need for mechanically loading the joining assembly. Wetting of the float glass substrates by the activated solder alloy SnAl0.6 after successful anodic bonding was confirmed by optical microscopy. The enrichment of the activating element Al at the bonding interface was confirmed by SEM and EDS element mapping," wrote M.M. Koebel and colleagues, Swiss Federal Laboratories for Materials Testing and Research.
The researchers concluded: "The methodology presented here shows great promise for various large-area sealing applications, particularly vacuum glazing, thin film and organic PV and OLED technology."
Koebel and colleagues published their study in Solar Energy Materials and Solar Cells (Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method. Solar Energy Materials and Solar Cells, 2011;95(11):3001-3008).
Thursday, June 30, 2011
Toyota hybrid recall
KETK: "The Toyota Highlander and Lexus RX hybrids are being called in for a transistor on a control board in the Hybrid system inverter may have a bad solder.
“And what we have is a circuit board inside what’s called the intelligent power module,” says Brian Lyons of Toyota. “And some of the transistors responsible, there’s a transistor that wasn’t adequately soldered. And it will be damaged during high load and large current flow during driving.”
“And what we have is a circuit board inside what’s called the intelligent power module,” says Brian Lyons of Toyota. “And some of the transistors responsible, there’s a transistor that wasn’t adequately soldered. And it will be damaged during high load and large current flow during driving.”
That’s right. One bad solder that finally gives way and your Lexus will either simply limp home on half power or…
“Uh, coast to a stop,” Lyons said. “I want to clarify, it doesn’t just stop, but yeah, you would lose all motive power.”
“Uh, coast to a stop,” Lyons said. “I want to clarify, it doesn’t just stop, but yeah, you would lose all motive power.”
The company says, it is a voluntary recall…
“Uh, yes, well, to be precise it’s more of an influenced recall. The federal…NHTSA had begin an investigation into the problem back in February,” according to Lyons.
Owners will get a letter in July and the fix, if necessary, will take about 4 hours.
“Uh, yes, well, to be precise it’s more of an influenced recall. The federal…NHTSA had begin an investigation into the problem back in February,” according to Lyons.
Owners will get a letter in July and the fix, if necessary, will take about 4 hours.
Although Toyota sales are rebounding finally, the company expects the cumulative effects of both publicity and national disasters to reduce their 2011 profits by one third."
Thursday, April 29, 2010
Solder joint reliability in automotive applications: New assessment criteria through the use of EBSD
Scopus: "The transition to lead-free materials within the electronics industry has raised the question of solder joint reliability for automotive applications. Traditional analysis methods like shear testing and light microscopic cross section analysis do not offer explanations for different damage appearances of solder joints that seem to have same material properties, same production and aging history.
A better understanding of microstructural properties and changes will help to solve those questions. Therefore, EBSD is used to analyze the grain structure of solder joints in the as-soldered state and after different aging conditions. In this paper a test program that is just being carried out at the Volkswagen Lab is summarized and first results of texture analysis are presented."
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