IPC-SMTA Cleaning and Conformal Coating Conference

This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.

“How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower and what is acceptably clean for one industry segment may be unacceptable in others.

A half-day workshop will be followed by a two-day technical conference, that will include tabletop exhibits, luncheons, and a networking reception.

Workshop
Tuesday, November 13, 8:00 am–12:00 pm

Conformal Coatings: Types, Uses and Specifications
Doug Pauls, Rockwell Collins and Jason Keeping, Celestica


Technical Conference Agenda

Tuesday, November 13
12:50 pm–1:00 pm Welcome
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
1:00 pm–2:30 pm Nano-Coatings
Session Leader: Craig Hillman, Ph.D., DfR Solutions

Innovative Superhydrophobicity Nano-Coatings that Protect HDI Interconnects from Moisture Absorption
Dan Hobson, Ross Technology Corporation

Characterization and Analysis of Plasma Polymers for Protective Films
Tim Von Werne, Semblant Ltd.

Chemical Vapor Deposition Enables Well-Defined Polymeric Films on Micro and Nano-Scale Features
Aleksandr White, GVD Corporation, Inc.
2:30 pm–3:00 pm Break
3:00 pm–4:00 pm Increasing the Reliability of Electronic Devices
Stephen Coulson, Ph.D., P2i

Enhancing Water-Blocking Nano Coatings for Telecommunications Devices
Blake Stevens, Ph.D., HzO
4:00 pm–4:45 pm Keynote: Printed Circuit Board Reliability — Factors OEMs Should Consider in the Age of Miniaturization
Dave Hillman, Rockwell Collins
5:00 pm–6:30 pm Networking Reception sponsored by Kyzen Corporation
Wednesday, November 14
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–9:30 am Conformal Coating
Session Leader: Jeff Kennedy, Celestica

High Temperature Reliability Limits of Silicon Conformal Coatings
Carlos Montemayor, Dow Corning Corporation

Investigation of Adhesive Strength of Conformal Coatings
Rich Kraszewski, Plexus Corporation

Standardization of Electronic Conformal Coatings in an Aerospace OEM
Hector Valladares, Honeywell International
9:30 am–10:00 am Break
10:00 am–11:30 am Use of IPC-B-52 Test Assembly for Conformal Coating Process Optimization
Doug Pauls, Rockwell Collins

A Preliminary Investigation into Enhanced Automated Selective Conformal Coating of Electronic Assemblies by employing Plasma Treatment Technology
David Foote and Hector Pulido, Nordson Asymtek

Throughput and Yield Improvements via Conformal Coating Process Characterization
Brad Perkins and Hector Pulido, Nordson Asymtek and Manuel Fernandez, Celestica
11:30 am–12:30 pm Luncheon sponsored by Zestron
12:30 pm–3:00 pm Cleanliness Assessment & Process Control
Session Leader: Doug Pauls, Rockwell Collins

A ROSE is Still a ROSE? Ionically, It Makes a Difference!
Graham Naisbitt, Gen3 Systems Limited

Localized Extraction Methods for Ionic Analysis
Eric Camden, Foresite, Inc. and Doug Pauls, Rockwell Collins

Cleaning Challenges in an HDI World
Mark Northrup, IEC Electronics Corp., Joe Russeau, Precision Analytical Laboratory, Inc. and Mike Bixenman, DBA, Kyzen Corporation

IPC-B-52 SIR: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future
Matt Kelly, IBM Corporation

A Comparison of Extract Solution Composition for Bare Boards
Jennifer Klavon, Rockwell Collins
3:00 pm–3:30 pm Break
3:30 pm–5:30 pm Environmental Standards and Regulations
Session Leader: Lee Wilmot, TTM Technologies, Inc.

Regulations and Productive Electronics Assembly: A Review of the Proposed OTC Regulations Targeted for 13 Eastern States
Barbara Kanegsberg, BFK Solutions

Green Screen Chemical Hazard Assessment Tool for Selecting Safer Cleaning
Curtis Wray, Hewlett-Packard Company

Reduction of VOC Emissions and Alternatives to Toxic Conformal Coatings
Emmanuelle Guene, Inventec Performance Chemicals

RoHS 2 / REACH / Conflict Materials
Ron Lasky, Ph.D., Indium Corporation of America
Thursday, November 15
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–10:00 am Electronics Assembly and PCB Failure Mechanisms & Reliability
Session Leader: Dave Hillman, Rockwell Collins

Influence of Ionic Contamination and Tin Whiskers
Stephan Meschter, Ph.D., BAE Systems Platform Solutions and Polina Snugovsky, Ph.D., Celestica

Creep Corrosion of PCB Assemblies: Effects of Surface Contamination
Martin Anselm, Universal Instruments

How Conformal Coating Can Kill
Craig Hillman, Ph.D., DfR Solutions

Electrical Reliability of Combinations of Solder Paste, Wave Soldering Flux and Conformal Coatings
Karen Tellefsen, Cookson Electronics
10:00 am–10:30 am Break and Box Lunch
10:30 am–1:30 pm Assembly Cleaning & Challenges
Session Leader: Dale Lee, Plexus Corporation

Process Optimization and Customer Requirements
Ken Van Zill, Ducommun LaBarge Technologies, Inc.

Cleaning No-Clean Flux Residues
Michael Havener, Benchmark Electronics Inc.

Electronics Effects of Cleaning Agents on Adhesives and Conformal Coating
Tana Soffa, L.W. Nusbaum, P.A. Panackal and K.F. Schoch, Jr., Northrop Grumman Corporation

Improvement of Cleaning Lead-Free Flux Residues for HDI Assemblies by Reduction of Oxygen Levels During Reflow
Maeva Tureau, Ph.D.; Chris Han-Adebekun, Ph.D. and Greg Arslanian, Air Products & Chemicals

Determining Critical Cleaning Process Parameters for QFNs
Umut Tosun, Naveen Ravindran and Michael McCutchen, ZESTRON America

Assembly Cleaning Process Characterization — Utilizing Repeatable Chemistry Solution Control
Dave Adams, Rockwell Collins; Dave Lober and John Williamson, Kyzen Corporation
1:30 pm–1:45 pm Adjournment
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation



IPC-SMTA Cleaning and Conformal Coating Conference:

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IPC APEX EXPO 2013

San Diego Conference Centre
19 - 21 February 2013

FREE! Opening keynote — Join theoretical physicist, best-selling author and futurist Dr. Michio Kaku for an awe-inspiring look at the future!

Show highlights include:

FREE! More than 400 exhibitors showing equipment, materials and services for printed boards and electronics manufacturing — plus printed electronics! There's no better place to see and compare.
The largest technical conference for our industry in the world. Highly selective, the conference presents new research and innovations from experts in the fields of electronics assembly, test and board fabrication and design.
FREE! Industry poster sessions — Catch up on the latest research and meet the authors.
Professional development courses provide comprehensive updates on pressing industry concerns.
Standards development meetings that help shape the future of our industry.
Compete in or watch the exciting IPC International Hand Soldering Grand Championship on the show floor.
Stay tuned, there’s a lot more to come!


Home Page | IPC APEX EXPO 2013:

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THE Pb-FREE IN ELECTRONICS RISK MITIGATION (PERM) CONSORTIUM

A paper has just be released describing the organization, content, and expectations of the newly formed Pb-free Electronics Risk Mitigation (PERM) consortium and its stakeholders. PERM was created as a more focussed group of the LEAP consortium.

The AIA-sponsored Pb-free Electronics in Aerospace  Project (LEAP) has been the premier industry working group in the the defense/aerospace industry since 2004.  It has worked to identify and address the risks and other challenges associated with the use of Pb-free electronics in high performance & high reliability equipment.  It has successfully provided resources such as handbooks and standards as well as templates, guidelines, and other tools to support risk mitigation.  However, the use of Pb-free materials has grown to such an extent that many components/parts are no longer available in tin-lead (either surface finishes or interconnection media).   Engineers have been forced to use some Pb-free parts in their new designs or,  in  many  cases,  as  part  of retrofits and upgrades, leading to concern over performance and reliability.

An ad hoc sub-committee of the LEAP team spent over a year producing a more focused entity called the Pb-free Electronics Risk Mitigation (PERM) consortium, to provide overarching executive leadership and coordination of Pb-free electronics risk management activities for the aerospace and defense community on both the government and industry side.   It is focussed on those activities that provide value-added results.  More information


http://www.ipcoutlook.org/pdf/pb_free_risk_mitigation_smta.pdf

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Orgalime seek to clarify RoHS2 scope questions

Orgalime document
New guidance document tries to resolve some very tricky issues but asks lots of complicated questions and overall just shows how complicated it is all going to be


Following Orgalime¡¦s recent participation in the RoHS2 FAQ Working Group meeting, our industry provides this outline of its common understanding of the scope provisions of Directive 2011/65/EU on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (¡§RoHS2¡¨).

The background to this paper is twofold:
1. It substantiates the initial understanding expressed in Orgalime¡¦s RoHS2 Guide of July 2011 and aims at particularly clarifying the background to the position of the affected industry
„h that the compliance obligations with the substance restrictions and CE marking obligations established by RoHS2 arise for manufacturers and importers of EEE, however not for installers,
„h that the definition of ¡§electrical and electronic equipment¡¨ cannot be interpreted as targeting anything and everything with the slightest connection to electrical or electronic,
„h that any interpretative criteria in the context of RoHS2, and article 2.4 in particular, requires full respect of the legal text of the Directive and an ¡§ex ante¡¨ approach
in the light of the alignment of the RoHS Directive with the New Legislative Framework (NLF) and in view of preparing for RoHS2 compliance and for effective market surveillance and enforcement.

2. The draft FAQs are in our view built on a number of significant flaws, misunderstandings and erroneous starting points, including for example:
„h accepting that Member States have different interpretations of the existing RoHS Directive, despite the fact that it represents a fully harmonised product legislation and the existence of a Commission Guidance Document on the existing RoHS Directive, and accepting that they plan to perpetuate those differences in the implementation of RoHS2.
„h charging responsibilities and obligations on market operators regardless of the New Legislative Framework and of the official text of RoHS 2 itself, or
„h proposing unclear interpretations of the New Legislative Framework, which result in conflicting answers and misleading indications.

Orgalime also want the EU to revise the RoHS2 FAQ

Background

There are some related RoHS2 stories in the Soldertec newsfeed
Background EU webpage re RoHS2 FAQ etc
Previous ORGALIME RoHS2 Guidance document

SMTA China Announces 2012 Paper/Presentation Awards

EMSNow: SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony, which took place on April 26, 2012 at the Shanghai Expo Intercontinental Hotel during NEPCON China in Shanghai.

 May Yan of Cisco Systems Ltd. was awarded the Best Paper of Technology Conference One (CE12) for the paper "Discussion on CU Dissolution in PB-Free PTH Rework".

Flextronics Industrial (Zhuhai) Co., Ltd.'s Carl Cai received the Excellent Paper of Technology Conference One (CE12) for the paper "Cycle Time Prediction and UPH Driving Methodologies Study for Fast Capacity Ramp Up".

Henley Zhou, Flextronics Industrial (Zhuhai) Co., Ltd., received The Best Paper of Technology Conference Two (CE12) for "A solution for BGA Underfill Partial Cured Issue and Coverage Issue".

IST-Integrated Service Technology Inc.'s Cherie Chen was awarded the Excellent Paper of Technology Conference Two (CE12) for the paper "The Surface Finish Effect on Creep Corrosion of PCB".

Jason Chan of Kyzen was awarded the Best Presentation of Technology Conference One (CE12) for the presentation "Cleaning Highly Dense Circuit Assemblies".

Cisco Systems Ltd.'s Xia Chuan received the Excellent Presentation of Technology Conference Two (CE12) for the presentation "Evaluation of an Alternative PB-Free Alloy Used in Wave Soldering Process".

Henley Zhou, Flextronics Industrial (Zhuhai) Co., Ltd., was awarded the Excellent Presentation of Technology Conference Two (CE12) for the presentation "A solution for BGA Underfill Partial Cured Issue and Coverage Issue".

Heraeus Zhaoyuan (Changshu) Electronic Materials Co., Ltd.'s Dai Peng received the Best Presentation of Vendor Conference One (CE12) for "Heraeus Products for High Reliability Application in Electronics".

Sunny Mu of Cookson Electronics-Enthone was awarded the Best Presentation of Vendor Conference Two (CE12) for the presentation "Considerations for the Long Term Reliability of PCBs in Harsh Environmental Conditions".

OK International's Paul Wood received the Best Presentation of Vendor Conference Three (CE12) for the presentation "Challenges of Rework on Micro BGAs".

The Best Emerging Exhibit of the Year 2012 China East award went to CyberOptics for its SE500 ULTRA solder paste inspection system.

The award for Best Exhibit Technology of the Year 2012 China East went to Assembléon Asia Ltd. for its iFlex high-precision flexible pick-and-place machine.

POP, LGA, QFN Designing & Assembly Workshop

SMART Group:

Stoke Mandeville Stadium – Aylesbury

To book your place or table top exhibition space contact Tony Gordon
Package on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection.

Lead-Free Experience Workshop – 6 Years On!!

event website

Thursday 10th May – Enterprise Ireland, East Point Dublin

iMAPS New England 39th Symposium & Expo

Tuesday May 8th, 2012
Holiday Inn Boxborough Woods Conference Center


Event programme


"Void Free Soldering in Vapor Phase Reflow"
J. Bashe, Rehm Thermal Systems LLC


"RoHS Recast"
K. Stanvick, Design Chair Associates



“Microstructure and Failure Modes of Pb-Free TSOP, QFN and LGA Solder Joints”
M. Anselm, Universal Instruments


"Lead-free Nanosolders and their Application for Nanowire Assembly and Joining"
F. Gao, & Z. Gu, University of Massachusetts Lowell

"Developing Lead-free Nanosolders for Nanoelectronics Assembly and Packaging"
F. Gao, & Z. Gu, University of Massachusetts Lowell (poster)

"Developing Lead-free Nanosolders for Nanoelectronics Assembly and Packaging"
F. Gao, & Z. Gu, University of Massachusetts Lowell

IPC Updates Assembly and Joining Handbook

SMTONLINE: For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB. With input from leading OEMs and research facilities, the recently released “A” revision of this industry handbook contains updated information on proven techniques for the assembly and soldering of electronic assemblies.

“IPC-AJ-820A covers 14 topics in 289 pages, addressing everything from handling to design to component selection and soldering,” says Kris Roberson, IPC assembly technology manager. “The handbook gives users basic data such as terms and definitions as well as the technical, more nitty-gritty, down-and-dirty information.”

With no shortage of in-depth information, the handbook includes equations for designers as well as techniques for tin whisker mitigation. A section titled “tin pest” explains how parts with high tin content can break down to powder under certain conditions.

IPC 2011 International technology roadmap for electronic interconnections

Global SMT and Packaging The International Technology Roadmap provides vision and direction for product development, process development and services required to satisfy the current and future needs of companies who are building electronic equipment for global customer requirements


The Roadmap presents findings and recommendations based on OEM, ODM and EMS vision and needs assessment. The Roadmap encompasses the supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points. Many chapters contain specific recommendations addressing current, near-term, mid-term and long-term requirements, proposed actions and opportunities. In addition, technical presentations made by industry experts are included as a special resource section used by the roadmap developers to provide predictions and visionary descriptions. The Roadmap is a valuable resource for companies throughout the global electronic equipment manufacturing industry and can be used for business, technology, and strategic planning for the near and long term. A new feature of the roadmap is to provide a technical driver comparison tool where the software is included in the CD so that long range planners can compare their technical descriptions of company products with the eight industry emulators published in the 2011 Roadmap. 590 pages. Released February 2012.

IPC Member Price $75.00
Non member Price $150.00
This document is only available for purchase. If you wish to order the above (or other) IPC standard please go to the EIPC website and click on the section Publications/IPC Standards for more information.

Please note EIPC members are entitled to the IPC member price.

For more information you can contact the EIPC office at eipc@eipc.org or             +31-43-3440872      .

The 6th SMT China Vision Awards Call for Entrie

SMT Chinae: During economic depression, everything slows down. However, China’s electronics manufacturing market remains strong in 2012. The coming years will find China continues to be the world's largest electronics manufacturing market, the electronics manufacturing industry will continue be driven by the strong demand of the domestic market.

Both international and domestic providers of SMT equipment, materials, software and services have made outstanding contributions to the rapid growth of China’s electronics manufacturing industry by their inventions and innovations. To recognize their contributions, SMT China magazine is pleased to sponsor the 6th SMT China Vision Awards program. SMT China magazine launched the SMT China Vision Awards in 2007, which is the only international accreditation for China's electronics manufacturing market.

IPC Roadmap 2012 to be released at APEX

SMTONLINE: BUZZ sessions, February 28-March 1, will cover critical industry topics such as process defects; embedded technologies; conflict minerals; supply line issues of obsolescence, quality and compliance of parts and counterfeit parts; breaking research from academia; the industry’s first solar standard for electronics assemblies; and the just-released IPC International Technology Roadmap.

On February 28, the IPC Government Relations committee will hold an open forum to provide an update on IPC’s advocacy efforts to protect PCB designs for military products under ITAR and offer the latest information on the impending conflict minerals regulation.

On the show floor, attendees will be able to get free, unbiased help with their process-related issues at the NPL Defect Database Clinic. In addition, participants can visit the New Product Zone for a sneak preview of the equipment, materials and services that are breaking new ground in the industry, and then go to cheer on the competitors in the IPC APEX EXPO Hand Soldering Competition and IPC Grand Championship.

Packaging Community Takes on New Challenges through Industry Collaboration

SEMI.ORG: The collaborative work of the packaging programs committees has also produced outstanding sessions focused on the intersection of semiconductor packaging technology and business.

In the second half of 2011 alone, the Americas Advanced Packaging Committee developed sessions which brought together industry leaders in 3D and 2.5D as well as heterogeneous integration of devices, while at the same time keep a focus on developments on packaging technologies that are needed in the near term.

The SEMI Taiwan Packaging & Testing Committee developed the inaugural SiP Global Summit, which was a three-day intense look at 3D-IC packaging and test technologies as well as embedded substrates.

The Advanced Packaging Committee of Europe delivered two half-day sessions at SEMICON Europe which took a hard look specifically at manufacturability with respect to technologies, materials, processes and equipment.

And the Japan Packaging Committee developed two sessions of strong technical content covering 3D-ICs, TSVs, system scaling and integration, and interconnect in conjunction with the SEMI Technology Symposium (STS).

iNEMI Kicks off 2013 Roadmap

Word versions of 2011 TWG chapters and the Executive Summary will be sent to all TWG Chairs on or about January 4 for use in preparing the 2013 version. An organizing teleconference with TWG Chairs will be held on January 11. Additionally, a teleconference for the iNEMI Technical Committee and PEG Chairs is scheduled for January 13 to review the status of the PEG emulators. Any TWG that would like to meet at APEX prior to the Kick-Off Workshop should contact  Chuck Richardson regarding meeting room availability.

Website with Schedule

e-Book collection on lead-free technologies

Website

IPC SPVC Round Robin study on alternative alloys

Background - IPC White Paper July 2011


Auburn test - a test mthod is being recommended
Work with iNEMI
Reliability experts - buy-in
Categorisation - not pass-fail

Video interview

IPC to Develop Data Exchange Standard for Conflict Minerals Regulation

IPC: IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, Ill.

The IPC data exchange standard will build upon the due diligence communication tool recently released by the Electronic Industry Citizenship Coalition (EICC) and Global e-Sustainability Initiative (GeSI) and utilize the sophistication of an XML schema incorporated in the IPC-175x family of IPC standards. As an ANSI-accredited standards development organization, IPC will seek input from a broad stakeholder group, beginning with the kickoff meeting at IPC Midwest.

iNEMI: Book on Lead-Free Solder Process Development

EMS007: "The International Electronics Manufacturing Initiative (iNEMI) is pleased to announce the recent publication of Lead-free Solder Process Development, by Wiley-IEEE Press. Several iNEMI project leaders and participants were involved with this book, which is an important reference guide for engineers in the electronics manufacturing industry who are, or will be, migrating to lead-free soldering.

The book’s editors are Gregory Henshall (HP), chair of iNEMI’s Characterization of Pb-Free Alloys Project; Jasbir Bath (iNEMI consultant), co-chair of the Pb-Free Rework Optimization Project; and Carol Handwerker (Purdue University), co-chair of of iNEMI’s Research Committee. In addition, more than half of the book’s 10 chapters were written or co-authored by iNEMI members, including representatives from Cisco, Delphi, Flextronics, HP and Intel.

The 250-page book covers several key lead-free topics, including legislation, SMT, wave soldering, rework, BGA/CSP component alloys, tin whiskers, testability, mechanical reliability, aerospace/military reliability and automotive reliability. Each subject area is discussed by people who have conducted work in the field and can provide insights into the most important considerations. The book also provides updates regarding ongoing research and development, and addresses new topics that are relevant to lead-free soldering."

NPL to Present Technical Webinars

EMS007 : "NPL's Electronic Interconnection Group will be presenting eight technical Webinars over the coming months. The Group will also host a European Technical Seminar at its facility at Teddington, UK, October 29, 2011"

This Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker mitigation and conformal coating research.

These free online Webinars provide you or a team of your company engineers with an opportunity to draw on years of practical experience without leaving your desk. The Webinars focus on test methods used in industry to monitor or help evaluate possible failure modes in electronic assemblies. Alternatively, you can attend the annual seminar and tabletop exhibition in October.

Each Webinar will last approximately 60 minutes and can be booked online by selecting the topic of choice at http://www.npl.co.uk/ei.

NPL Technology Webinar series:

Tin Whiskers Evaluation Techniques and Benefits of Conformal Coating - Wednesday, June 22, 2011

X-Ray Fluorescence Testing results with Laboratory and Handheld Systems - Thursday, September 8, 2011

Solderability Assessment – Testing, Ageing and Practical Impact on Assembly Yield - Tuesday, October 11, 2011

How to Test and Qualify Packages with Scanning Acoustic Microscopy (SAM) - Thursday, October 27, 2011

Using Surface Insulation Resistance (SIR) to Qualify Production Processes and Materials - Tuesday, November 8, 2011

Cleanliness Assessment Using Solvent Extract and Ionic Extraction to Improve Reliability - Thursday, November 24, 2011

Characterisation of Solder Joints, Test Methods and Typical Failure Modes - Tuesday, January 24, 2012

Using Mechanical Testing to Diagnose Design, Product and Process Failures - Tuesday, February 21, 2012.

The webinars have been created to support the successful launch of the NPL Process Defect Database, a free online solutions to PCB assembly problems and the monthly IPC Defect of the Month Video. Analysis has shown that engineers require a better understanding of the laboratory investigation techniques used in industry to solve process issues.

Example

Indium Technology Expert to Present at SMTA Penang

EMS007: "Indium Corporation's Area Technical Manager, Sehar Samiappan will present two technical papers at SMTA's South East Asia Technical Conference on Electronics Assembly Technologies, Penang, Malaysia, on May 19-20, 2011.

Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly offers an easy way to select a flux or solder paste that could be used for dip transfer of PoP assembly applications.

Room Temperature LED and D-Pak Type Component Attach and Reliability Testing will discuss technology improvements for improved assembly materials and process enhancements to increase throughput, reduce cost, and improve product efficiency and reliability."