Friday, November 30, 2012
DLA Demands Chip Makers Tag Products With Plant DNA; A War On Counterfeiters
This November, the Defense Logistics Agency will require companies selling microcircuits to the military to stamp their products with an unlikely seal of authenticity: plant DNA.
It's an innovative initiative in the fight against counterfeit computer chips, which has been a major concern in the Senate, but it's only one piece of the answer. DLA plans to put out a formal Request For Information sometime this month to ask industry to offer other, complementary authenticity-checking technologies, and Congress is watching closely.
"This and programs like it may be good long-term solutions to the problem, but additional steps are necessary to address the short-term problem," said one congressional source, discussing the DNA marking technology with AOL Government affiliate, AOL Defense.
While markers of authenticity are well and good, the source explained, when Congress addressed counterfeit components in Section 818 of last year's National Defense Authorization Act, "the law went way beyond this; it requires them to change the way that they do business. The implementing regs to Section 818 are really the crux of what needs to be done, and they haven't been issued yet."
Vice Adm. Mark Harnitchek, the director of the Defense Logistics Agency, has touted a four-part plan to combat counterfeiting: testing components already in hand, buying from original manufacturers or their authorized distributors wherever possible, using anomaly-checking software to spot suspect transactions, and, finally, requiring microcircuits to be tagged with DNA.
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The brilliance of DNA tagging is that it's inexpensive, widely applicable, and virtually unhackable, at least according to its inventors. "We stand by the strongest claim in the industry, which is our DNA cannot be copied," said James Hayward, the molecular biologist and bio-physicist who heads Applied DNA Sciences. That's company named in the Defense Logistics Agency mandate as the only authorized purveyor of the marking technology, at least for now.
Hayward's firm starts with natural plant DNA. Then they engineer it -- the process is a trade secret -- to create unique strands of genetic code, which in various formulations can be mixed with ink used to mark products or directly infused into materials used to make them like sillicon, plastic, wire, or textiles.
The technology is already widely used in bank notes in Europe, where it has helped convict more than 30 counterfeiters. Applied DNA is even experimenting with ways to "tag" diesel fuel. Once the DNA is embedded in the product, by whatever means, you detect it with a swab test, or you can shine a CSI-style black light (provided by Applied DNA) onto the tag: If it reflects a particular wavelength, it's authentic. (Other, more time-consuming tests give greater detail).
The downside -- that aforementioned "short-term problem" -- is DNA tagging does nothing about all the components already out there that were not tagged at the moment of manufacture. Those chips are now often in the hands of secondary-market distributors, many of whom got them from still other distributors rather than from the original manufacturer, which may no longer exist.
It is parts bought on this byzantine secondary market, not those directly from manufacturers and their authorized dealers, that are sometimes not what their packaging says they are. Sure, a distributor can tag its inventory, and that will help trace the parts back to that distributor later if there's any question, but doing so says nothing about the original provenance of the parts.
It will take years for tagged components to become commonplace in the secondary market. In the meantime the military must keep buying untagged chips because so many of its systems are so old that the original manufacturer has stopped making components or gone out of business altogether, forcing DLA to scrounge for spart parts wherever it can.
"10 years from now if all parts are implanted with DNA or they're all traceable back to the manufacturer with a unique identifier, that's great and this problem may be significantly reduced in scope," the congressional source explained, "but any part produced prior to today and any part that's produced outside of this requirement may not be marked."
The DLA mandate that takes effect in November applies to "manufacturers, franchised distributors and other distributors [on DLA's] Qualified Suppliers List," according to an agency factsheet. But the Defense Department is no longer the dominant buyer in the microelectronics market, and companies mas-producing chips for iPhones or airbags may see no need to add a step to their manufacturing process -- however easy Hayward says it is -- just to keep selling to the military.
"The Department of Defense can't define the market for what gets done on commercial chips because they're such a small customer," said the congressional source, "so are commercial manufacturers going to do this for the defense market?"
That's a business case Hayward and company must make far beyond the Department of Defense. Given rising concerns about counterfeit components and cybersecurity in the commercial world, not just the military, they have a real shot. Certainly the DLA seal of approval will help them sell their seals of authenticity to civilian markets.
Thursday, November 1, 2012
Lockheed Martin develops new Cu solder - ElectroIQ
Lockheed Martin develops new Cu solder - ElectroIQ:
October 26. 2012 - Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10× the electrical and thermal conductivity of today's tin-based materials.
The principal lead-free replacement for solders is a combination of tin, silver, and copper that is fine for mostly short product life cycles and benign operating environments. However, requiring higher processing temperatures translates into higher costs; the high tin content causes problems with "tin whiskers," needle-like crystals of metal that grow on tin-finished surfaces that potentially cause current leakage and shorting; and more rugged operating environments common in a number of end-use applications (military/aerospace, medical, oil/gas, automotive) lead to more fractures and impact reliability.
"To address these concerns, we realized a fundamentally new approach was needed to solve the lead-free solder challenge," explains Alfred Zinn, materials scientist at the Advanced Materials and Nanosystems directorate (ATC) at Lockheed Martin's Space Systems Advanced Technology Center in Palo Alto, CA.
His invention is a solder paste dubbed "CuantumFuse" that addresses several primary criteria: sufficiently small nanoparticle size and reasonable size distribution, reaction scalability, low cost synthesis, oxidation and growth resistance at ambient conditions, and robust particle fusion when subjected to elevated temperature. Copper was chosen because its existing ubiquity as a material for trace, interconnects, and pads minimizes compatibility issues. It is also cheap -- 1/4th the cost of tin, 1/100th the cost of silver, and 1/10,000th that of gold -- and abundant, and has 10× the electrical and thermal conductivity compared to commercial tin-based solder.
The ATC has demonstrated CuantumFuse with the assembly of a small test camera board. Some technical challenges still have to be addressed, such as improving bond strength, before the solder paste is ready for military and commercial applications, acknowledged Mike Beck, director of the Advanced Materials and Nanosystems group at the ATC.
'via Blog this'
October 26. 2012 - Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10× the electrical and thermal conductivity of today's tin-based materials.
The principal lead-free replacement for solders is a combination of tin, silver, and copper that is fine for mostly short product life cycles and benign operating environments. However, requiring higher processing temperatures translates into higher costs; the high tin content causes problems with "tin whiskers," needle-like crystals of metal that grow on tin-finished surfaces that potentially cause current leakage and shorting; and more rugged operating environments common in a number of end-use applications (military/aerospace, medical, oil/gas, automotive) lead to more fractures and impact reliability.
"To address these concerns, we realized a fundamentally new approach was needed to solve the lead-free solder challenge," explains Alfred Zinn, materials scientist at the Advanced Materials and Nanosystems directorate (ATC) at Lockheed Martin's Space Systems Advanced Technology Center in Palo Alto, CA.
His invention is a solder paste dubbed "CuantumFuse" that addresses several primary criteria: sufficiently small nanoparticle size and reasonable size distribution, reaction scalability, low cost synthesis, oxidation and growth resistance at ambient conditions, and robust particle fusion when subjected to elevated temperature. Copper was chosen because its existing ubiquity as a material for trace, interconnects, and pads minimizes compatibility issues. It is also cheap -- 1/4th the cost of tin, 1/100th the cost of silver, and 1/10,000th that of gold -- and abundant, and has 10× the electrical and thermal conductivity compared to commercial tin-based solder.
The ATC has demonstrated CuantumFuse with the assembly of a small test camera board. Some technical challenges still have to be addressed, such as improving bond strength, before the solder paste is ready for military and commercial applications, acknowledged Mike Beck, director of the Advanced Materials and Nanosystems group at the ATC.
'via Blog this'
Melting point of lead-free solder reduced 11°C by nanoalloying Sb-Sn with nickel
Melting point of lead-free solder reduced 11°C by nanoalloying Sb-Sn with nickel:
The University of Vienna, Austria, announces that a research program has resulted in a reduction in melting point of up to 11°C in tin-antimony based solder with nickel additions by using nanoalloys prepared by a chemical reduction method. Chemical precursors were prepared by precipitation reactions, followed by thermal decomposition, and the reaction conditions were optimized. Particle size was modified to be in the range of 50 to 150 nm, which would translate into a size-dependent lowering of soldering temperature in any practical application.
With the reduction of the grain size into the nanometer range and a corresponding lowering of the melting temperature, considerable energy savings would become possible in the first soldering step without sacrificing the stability of the solder junctions against re-melting in the further assembling procedure.
Special emphasis was placed on Sn-rich compositions that were assumed to be of particular importance for soldering purposes. Standard methods such as powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy, and differential thermal analysis were used to clarify the phase relations in the ternary Sn-Sb-Ni system. The team used the "Computer coupling of phase diagrams and thermochemistry" (Calphad) method, enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
Read the complete release.
'via Blog this'
The University of Vienna, Austria, announces that a research program has resulted in a reduction in melting point of up to 11°C in tin-antimony based solder with nickel additions by using nanoalloys prepared by a chemical reduction method. Chemical precursors were prepared by precipitation reactions, followed by thermal decomposition, and the reaction conditions were optimized. Particle size was modified to be in the range of 50 to 150 nm, which would translate into a size-dependent lowering of soldering temperature in any practical application.
With the reduction of the grain size into the nanometer range and a corresponding lowering of the melting temperature, considerable energy savings would become possible in the first soldering step without sacrificing the stability of the solder junctions against re-melting in the further assembling procedure.
Special emphasis was placed on Sn-rich compositions that were assumed to be of particular importance for soldering purposes. Standard methods such as powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy, and differential thermal analysis were used to clarify the phase relations in the ternary Sn-Sb-Ni system. The team used the "Computer coupling of phase diagrams and thermochemistry" (Calphad) method, enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
Read the complete release.
'via Blog this'
High risk defense suppliers soars, report finds
High risk defense suppliers soars, report finds:
Anne-Françoise PELE
10/31/2012 1:30 PM EDT
PARIS – The number of high risk suppliers to the U.S. government agencies, defense contractors and subcontractors, as well as all military and commercial electronics application markets increased by 63 percent from 2002 to 2011, according to market research firm IHS iSuppli.
In 2011, IHS observed that a total of 9,539 suppliers were reported either for known involvement in high-risk, fraudulent and suspect counterfeit part transactions, or for conduct identified by the government as grounds to debar, suspend or otherwise exclude from contract participation. There were 5,849 in 2002.
In all, IHS reported that 78,217 high risk suppliers to U.S. government had been identified during the period from 2002 to 2011.
Click on image to enlarge
Vicki Knauf, parts logistics expert at IHS, declared: “It’s abundantly clear that supplier risk is real, extensive and growing. It’s a federal acquisition requirement to screen for debarred, suspended or otherwise excluded parties. The Department of Defense, as well as its contractors and subcontractors, must comply with new regulations for the use of trusted suppliers and authorized sources."
"A key component of developing a secure supply chain includes the use of Trusted Suppliers. Pinpointing probabilities of risk, blacklisting and vetting high-risk suppliers are crucial to developing a resilient supply chain that fends off devious behavior," Knauf concluded.
'via Blog this'
Anne-Françoise PELE
10/31/2012 1:30 PM EDT
PARIS – The number of high risk suppliers to the U.S. government agencies, defense contractors and subcontractors, as well as all military and commercial electronics application markets increased by 63 percent from 2002 to 2011, according to market research firm IHS iSuppli.
In 2011, IHS observed that a total of 9,539 suppliers were reported either for known involvement in high-risk, fraudulent and suspect counterfeit part transactions, or for conduct identified by the government as grounds to debar, suspend or otherwise exclude from contract participation. There were 5,849 in 2002.
In all, IHS reported that 78,217 high risk suppliers to U.S. government had been identified during the period from 2002 to 2011.
Click on image to enlarge
Vicki Knauf, parts logistics expert at IHS, declared: “It’s abundantly clear that supplier risk is real, extensive and growing. It’s a federal acquisition requirement to screen for debarred, suspended or otherwise excluded parties. The Department of Defense, as well as its contractors and subcontractors, must comply with new regulations for the use of trusted suppliers and authorized sources."
"A key component of developing a secure supply chain includes the use of Trusted Suppliers. Pinpointing probabilities of risk, blacklisting and vetting high-risk suppliers are crucial to developing a resilient supply chain that fends off devious behavior," Knauf concluded.
'via Blog this'
Combating fake chips by controlling supply chain
Combating fake chips by controlling supply chain:
In December 2011, President Barack Obama signed the fiscal year 2012 US National Defense Authorization Act. The budget bill also encourages the implementation of procedures to mitigate the possibility of obtaining counterfeit components by making members of all tiers of the defense supply chain accountable. The meaning of the term counterfeit in this context includes fake, substandard, damaged, or mismarked components.
In the fall of 2011, for the first time in history, U.S. Federal Courts prosecuted an individual for trafficking in counterfeit integrated circuits, many of which were targeted for the U.S. military. Others were to be used in brake systems in high-speed trains and instruments used by firefighters to detect nuclear radiation. The administrator of the company that sold the components was sentenced to 38 months in prison and assessed fines of $166,141 for selling almost $16 million worth of semiconductors falsely marked as military, commercial or industrial grade.
As progressive as all of this news seems to be in the fight against counterfeit semiconductors making their way into the US supply chain, it is just the beginning. In fact, it is estimated that 2 percent of all the semiconductors sold last year were counterfeit. That doesn’t sound too threatening until we do the math: the estimated value of counterfeit parts that made their way into the U.S. supply chain in 2011 is over $5 billion.
Not only do counterfeit components threaten lives, they impose a vast negative financial impact to semiconductor manufacturers, distributors, electronics equipment manufacturers and end users. It is estimated that the actual cost of a failed semiconductor that makes its way into production – in any industry – can be more than 100 times the cost of the original component. That makes the bargain price – often 70 percent less than the “real thing” – look less and less attractive. No matter how hard the industry tries, it can’t get around that old adage: you get what you pay for.
'via Blog this'
In December 2011, President Barack Obama signed the fiscal year 2012 US National Defense Authorization Act. The budget bill also encourages the implementation of procedures to mitigate the possibility of obtaining counterfeit components by making members of all tiers of the defense supply chain accountable. The meaning of the term counterfeit in this context includes fake, substandard, damaged, or mismarked components.
In the fall of 2011, for the first time in history, U.S. Federal Courts prosecuted an individual for trafficking in counterfeit integrated circuits, many of which were targeted for the U.S. military. Others were to be used in brake systems in high-speed trains and instruments used by firefighters to detect nuclear radiation. The administrator of the company that sold the components was sentenced to 38 months in prison and assessed fines of $166,141 for selling almost $16 million worth of semiconductors falsely marked as military, commercial or industrial grade.
As progressive as all of this news seems to be in the fight against counterfeit semiconductors making their way into the US supply chain, it is just the beginning. In fact, it is estimated that 2 percent of all the semiconductors sold last year were counterfeit. That doesn’t sound too threatening until we do the math: the estimated value of counterfeit parts that made their way into the U.S. supply chain in 2011 is over $5 billion.
Not only do counterfeit components threaten lives, they impose a vast negative financial impact to semiconductor manufacturers, distributors, electronics equipment manufacturers and end users. It is estimated that the actual cost of a failed semiconductor that makes its way into production – in any industry – can be more than 100 times the cost of the original component. That makes the bargain price – often 70 percent less than the “real thing” – look less and less attractive. No matter how hard the industry tries, it can’t get around that old adage: you get what you pay for.
'via Blog this'
Friday, October 19, 2012
Assessing the replacement of lead in solders: effects on resource use and human health
Scopus - Document details:
http://www.scopus.com/record/display.url?eid=2-s2.0-84866533597&origin=inward&txGid=bKWlxuWR1ZmFh1DrfpQ4Gij%3a3
Almeida, C.M.V.B. , Madureira, M.A., Bonilla, S.H., Giannetti, B.F.
Programa de Pós - Graduação em Engenharia de Produção da Universidade Paulista, Rua Dr Bacelar 1212, Mirandópolis, 04026-002 São Paulo, Brazil
Abstract
Human health and environmental concerns are not usually considered at the same time. Tin-lead solders are still widely used in several countries, including Brazil, by manufacturers of electronic assemblies. One of the options to reduce or eliminate lead from the manufacturing environment is its replacement with lead-free alloys. This paper applies emergy synthesis and the DALY indicator (Disability Adjusted Life Years) to assess the impact of manufacturing soft solder using tin, lead and other metals on the environment and on human health. The results are presented together with the company's financial results and the results calculated from the Brazilian statistical value of life. The calculation of emergy per unit showed that more resources are used to produce one ton of lead-free solders than to produce one ton of tin-lead solders, with and without the use of consumer waste recovered through a reverse logistics system. The assessment of air emissions during solder production shows that the benefits of the lead-free solution are limited to the stages of manufacturing and assembling. The tin-lead solder appears as the best option in terms of resource use efficiency and with respect to emissions into the atmosphere when the mining stage is included. A discussion on the influence of the system's boundaries on the decision-making process for materials substitution is presented.
'via Blog this'
http://www.scopus.com/record/display.url?eid=2-s2.0-84866533597&origin=inward&txGid=bKWlxuWR1ZmFh1DrfpQ4Gij%3a3
Almeida, C.M.V.B. , Madureira, M.A., Bonilla, S.H., Giannetti, B.F.
Programa de Pós - Graduação em Engenharia de Produção da Universidade Paulista, Rua Dr Bacelar 1212, Mirandópolis, 04026-002 São Paulo, Brazil
Abstract
Human health and environmental concerns are not usually considered at the same time. Tin-lead solders are still widely used in several countries, including Brazil, by manufacturers of electronic assemblies. One of the options to reduce or eliminate lead from the manufacturing environment is its replacement with lead-free alloys. This paper applies emergy synthesis and the DALY indicator (Disability Adjusted Life Years) to assess the impact of manufacturing soft solder using tin, lead and other metals on the environment and on human health. The results are presented together with the company's financial results and the results calculated from the Brazilian statistical value of life. The calculation of emergy per unit showed that more resources are used to produce one ton of lead-free solders than to produce one ton of tin-lead solders, with and without the use of consumer waste recovered through a reverse logistics system. The assessment of air emissions during solder production shows that the benefits of the lead-free solution are limited to the stages of manufacturing and assembling. The tin-lead solder appears as the best option in terms of resource use efficiency and with respect to emissions into the atmosphere when the mining stage is included. A discussion on the influence of the system's boundaries on the decision-making process for materials substitution is presented.
'via Blog this'
New nanoalloys for high temperature soldering
New nanoalloys for high temperature soldering:
Nanowerk News) Removing lead from manufacturing processes and products is high priority for the EU. A European research programme has tackled the problem of high-temperature solders used in the electronics industry.
On soldering components on a printed circuit board, it is crucial that the joints do not remelt in subsequent soldering operations. The electronics industry is therefore inclined to use solder material containing a high percentage of lead with a higher melting point (300 °C and above).
One solution is to use so-called nanosolders based on tin-antimony (Sn-Sb) alloys. Nanoparticles have a lower melting point than the bulk substance. Funded by the EU, the project 'A chemical approach to lead-free nanosolders' (Nanosold) aimed to develop new lead-free high-temperature solders with Sn-Sb-M alloys. M is silver (Ag), copper (Cu) and nickel (Ni).
Concentrating on the two ternary alloy systems Sn-Sb-Ag and Sn-Sb-Cu, the Nanosold project investigated the thermodynamic properties, the sum of the features of the individual phases. The team used the so-called 'Computer coupling of phase diagrams and thermochemistry' (Calphad) method enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
A reduction in melting point of up to 11 °C was achieved using nanoalloys rich in Sn prepared by a chemical reduction method. Particle size was modified to be in the range of 50 to 150 nm which would translate into a size-dependent lowering of soldering temperature in any practical application.
Although there are further problems to be worked on, solder pastes based on nanoalloys would achieve a decrease in melting point. From an environmental point of view, the new nanoalloys remove a very toxic element from electronic appliances' manufacturing.
Source: Cordis
'via Blog this'
Nanowerk News) Removing lead from manufacturing processes and products is high priority for the EU. A European research programme has tackled the problem of high-temperature solders used in the electronics industry.
On soldering components on a printed circuit board, it is crucial that the joints do not remelt in subsequent soldering operations. The electronics industry is therefore inclined to use solder material containing a high percentage of lead with a higher melting point (300 °C and above).
One solution is to use so-called nanosolders based on tin-antimony (Sn-Sb) alloys. Nanoparticles have a lower melting point than the bulk substance. Funded by the EU, the project 'A chemical approach to lead-free nanosolders' (Nanosold) aimed to develop new lead-free high-temperature solders with Sn-Sb-M alloys. M is silver (Ag), copper (Cu) and nickel (Ni).
Concentrating on the two ternary alloy systems Sn-Sb-Ag and Sn-Sb-Cu, the Nanosold project investigated the thermodynamic properties, the sum of the features of the individual phases. The team used the so-called 'Computer coupling of phase diagrams and thermochemistry' (Calphad) method enabling the scientists to reliably predict the thermodynamic properties without experimental information.
To refine the phase relations in the Sn-Sb-Ni system, Nanosold used other complementary methods. These included powder X-ray diffraction, electron probe micro-analysis, scanning electron microscopy and differential thermal analysis.
A reduction in melting point of up to 11 °C was achieved using nanoalloys rich in Sn prepared by a chemical reduction method. Particle size was modified to be in the range of 50 to 150 nm which would translate into a size-dependent lowering of soldering temperature in any practical application.
Although there are further problems to be worked on, solder pastes based on nanoalloys would achieve a decrease in melting point. From an environmental point of view, the new nanoalloys remove a very toxic element from electronic appliances' manufacturing.
Source: Cordis
'via Blog this'
Friday, October 12, 2012
How Lead-Free Solder (Mis)Behaves under Stress | Advanced Photon Source
How Lead-Free Solder (Mis)Behaves under Stress | Advanced Photon Source:
The reliability and longevity of electronics are critical to our interconnected world that is so dependent upon Internet and telecommunications technology. The computers, routers and switches, phones, and all the devices that link us together must be dependable down to the solder joints that connect integrated circuits to circuit boards, which can be an Achilles heel in an otherwise failure-free device.
Utilizing new synchrotron x-ray techniques and two synchrotron x-ray beamlines at the U.S. Department of Energy Office of Science’s Advanced Photon Source (APS), researchers from Cisco Systems, Inc.; Michigan State University; and the Max-Planck-Institut für Eisenforschung GmbH studied the beginnings of the thermal fatigue process in environmentally friendly, lead-free solder joints, as well as what happens toward the end of that process. These insights bring scientists a step closer to developing useful models for making reliability predictions about solder-joint failure in this new material.
"In electronic system failures, more than half are solder joint failures," said Thomas Bieler of Michigan State University, a coauthor of the two Journal of Electronic Materials articles based on these studies. "There are a lot of these connections, and a failure in any one of them could potentially kill the functionality of the entire system."
The first century of electronics used lead-based solder because it was cheap and easy to work with. Engineers thoroughly understood the electrical, thermal, and structural behavior of these solders and were able to accurately predict reliability. As the environmental dangers of lead became apparent, manufacturers looked for alternatives. In 2006, the European Union Restriction of Hazardous Substances Directive came into effect, banning lead-containing solders from all consumer electronics devices. But while protecting people and the environment, the ban created a new problem: How reliable were lead-free solders?
"Especially in the telecommunications industry, the expected lifetime of many products is long, and also a very low failure rate is needed," said coauthor Tae-Kyu Lee of the Component Quality and Technology Group at Cisco Systems. "Before 2006, the industry had a very large library of reliability data based on lead-containing material, so even if they didn't know the exact failure mechanism, they could still assess the lifetime of the product. But since we're now using a new material, we need to know more about how the material’s performance evolves."
The researchers in this study developed new techniques and employed them at the APS to track the development of the failure mechanism of lead-free solder joints in situ for the first time. Working at the X-ray Science Division 6-ID-D and 34-ID-E beamlines at the Argonne National Laboratory APS, they conducted experiments to demonstrate how synchrotron x-ray diffraction could reveal the evolution of crystal orientation and strain patterns during thermal cycling in tin-containing, lead-free solder joints, specifically in the commonly used tin-silver-copper alloy SAC 305 (Sn-3%Ag-0.5% Cu).
Older lead-tin solders tend to solidify as a polycrystal, delivering a solder joint that has a uniform microstructure, with reproducible properties. But lead-free solders usually solidify either as a randomly oriented single crystal or a tricrystal. "With the lead-free solders, the properties of solder joints are all over the map," Bieler said. "Some joints have hard orientations, others soft, some last forever, some fail at a very early time. That makes life difficult for electronics manufacturers when they have to think about warranty costs and when the first failure is going to happen."
Failures in lead-free solders don't always occur in areas where shear strains from thermal expansion mismatches are highest. This is a consequence of the non-cubic structure of tin and its highly anisotropic thermal expansion and stiffness. It is difficult to predict the strains that develop in an individual joint, given the random crystal orientation, so the prediction of damage is even more challenging. Furthermore, the crystal orientations evolve with thermal cycling. The experimenters examined SAC 305 joints both in a plastic ball grid array (PBGA) package sample and a wafer-level chip-scale package (WLCSP). Both types have been examined under thermal cycling, and the latter was studied in situ during melting, resolidification, and thermal cycling.
The advantages of the x-ray approach over the cross-sectional electron microscopy generally used to study solder joints were immediately apparent. "In a two-dimensional cross section, one does not necessarily know what has been removed or what is underneath the surface. With three-dimensional full illumination of the joint, we were able to prove that we did indeed primarily have single crystals in some joints and tricrystals in others," said Bieler.
"To clearly predict the lifetime of a certain joint,” said Lee, “we need to understand the failure mechanism. This study allowed us to see inside the joint while imposing thermal cycles in situ. Most of the earlier studies use destructive analysis to see the microstructure development after things happened. But the APS synchrotron lets us see the microstructure evolution during the event."
The x-ray diffraction measurements also provide a more dynamic picture of what happens inside the solder joint as it passes through different phases over time. For example, although there are only a few different tin crystal orientations in a given SAC lead-free solder joint, different orientations are always observed after melting and resolidification. Recrystallization behavior under thermal cycling also results in evolution of the tin crystal orientation.
Lee was surprised by "the overall tin material response to the external factors. I considered tin as a 'dead' material with a certain crystal structure, but the more you look into this material, it seems to react like a living thing."
“What the APS data has especially enabled us to do is get a comprehensive picture of the very beginning of the thermal fatigue process [on beamline 6-ID-D] and connect it with what happens toward the end [on beamline 34-ID-E]," Bieler said.
Observing how the x-ray diffraction peaks changed from initial solidification and proceeded to spread out over repeated thermal cycles, Bieler said, "really helped us get to the point where we could describe the sequential mechanism from the moment of solidification up to the first crack that forms. We are able to explain everything that happened and why it happened in these solder joints as a result of what we've been able to do at the APS. The APS has been very helpful for understanding the early stage as well as the stage just before cracks form."
These fresh insights into the failure mechanism of lead-free solder joints guide scientists in their development of models for making reliability predictions. Although it is too early to proclaim any definite remedy for improving reliability in lead-free solder joints, the work provides some important clues.
"To find the right mitigation, you need to find the right failure mechanism," Lee said. "Based on the study so far, we identified that the grain refinement in tin interconnects is bad for thermal cycling performance. But at the same time it is beneficial for resistance to mechanical shock. So there are no golden rules, but at least we are beginning to understand why."
As for next steps, Bieler said that "finding a reliable, automated way to index diffraction patterns from multi-crystal joints would greatly speed up our ability to mine the data we have more effectively. Analysis strategies to obtain stress and strain would naturally follow using established methods. Continuing in situ measurements in thermomechanical cycling specimens, and looking toward comparing the microstructure before and after shock conditions (or possibly in situ), could also be effective. Microbeam diffraction in solder bumps is also a desirable thing to do, as the volumes are small, and this method is well suited for exploring tiny places." — Mark Wolverton
http://www.aps.anl.gov/Science/Highlights/Content/APS_SCIENCE_20121008.php
'via Blog this'
The reliability and longevity of electronics are critical to our interconnected world that is so dependent upon Internet and telecommunications technology. The computers, routers and switches, phones, and all the devices that link us together must be dependable down to the solder joints that connect integrated circuits to circuit boards, which can be an Achilles heel in an otherwise failure-free device.
Utilizing new synchrotron x-ray techniques and two synchrotron x-ray beamlines at the U.S. Department of Energy Office of Science’s Advanced Photon Source (APS), researchers from Cisco Systems, Inc.; Michigan State University; and the Max-Planck-Institut für Eisenforschung GmbH studied the beginnings of the thermal fatigue process in environmentally friendly, lead-free solder joints, as well as what happens toward the end of that process. These insights bring scientists a step closer to developing useful models for making reliability predictions about solder-joint failure in this new material.
"In electronic system failures, more than half are solder joint failures," said Thomas Bieler of Michigan State University, a coauthor of the two Journal of Electronic Materials articles based on these studies. "There are a lot of these connections, and a failure in any one of them could potentially kill the functionality of the entire system."
The first century of electronics used lead-based solder because it was cheap and easy to work with. Engineers thoroughly understood the electrical, thermal, and structural behavior of these solders and were able to accurately predict reliability. As the environmental dangers of lead became apparent, manufacturers looked for alternatives. In 2006, the European Union Restriction of Hazardous Substances Directive came into effect, banning lead-containing solders from all consumer electronics devices. But while protecting people and the environment, the ban created a new problem: How reliable were lead-free solders?
"Especially in the telecommunications industry, the expected lifetime of many products is long, and also a very low failure rate is needed," said coauthor Tae-Kyu Lee of the Component Quality and Technology Group at Cisco Systems. "Before 2006, the industry had a very large library of reliability data based on lead-containing material, so even if they didn't know the exact failure mechanism, they could still assess the lifetime of the product. But since we're now using a new material, we need to know more about how the material’s performance evolves."
The researchers in this study developed new techniques and employed them at the APS to track the development of the failure mechanism of lead-free solder joints in situ for the first time. Working at the X-ray Science Division 6-ID-D and 34-ID-E beamlines at the Argonne National Laboratory APS, they conducted experiments to demonstrate how synchrotron x-ray diffraction could reveal the evolution of crystal orientation and strain patterns during thermal cycling in tin-containing, lead-free solder joints, specifically in the commonly used tin-silver-copper alloy SAC 305 (Sn-3%Ag-0.5% Cu).
Older lead-tin solders tend to solidify as a polycrystal, delivering a solder joint that has a uniform microstructure, with reproducible properties. But lead-free solders usually solidify either as a randomly oriented single crystal or a tricrystal. "With the lead-free solders, the properties of solder joints are all over the map," Bieler said. "Some joints have hard orientations, others soft, some last forever, some fail at a very early time. That makes life difficult for electronics manufacturers when they have to think about warranty costs and when the first failure is going to happen."
Failures in lead-free solders don't always occur in areas where shear strains from thermal expansion mismatches are highest. This is a consequence of the non-cubic structure of tin and its highly anisotropic thermal expansion and stiffness. It is difficult to predict the strains that develop in an individual joint, given the random crystal orientation, so the prediction of damage is even more challenging. Furthermore, the crystal orientations evolve with thermal cycling. The experimenters examined SAC 305 joints both in a plastic ball grid array (PBGA) package sample and a wafer-level chip-scale package (WLCSP). Both types have been examined under thermal cycling, and the latter was studied in situ during melting, resolidification, and thermal cycling.
The advantages of the x-ray approach over the cross-sectional electron microscopy generally used to study solder joints were immediately apparent. "In a two-dimensional cross section, one does not necessarily know what has been removed or what is underneath the surface. With three-dimensional full illumination of the joint, we were able to prove that we did indeed primarily have single crystals in some joints and tricrystals in others," said Bieler.
"To clearly predict the lifetime of a certain joint,” said Lee, “we need to understand the failure mechanism. This study allowed us to see inside the joint while imposing thermal cycles in situ. Most of the earlier studies use destructive analysis to see the microstructure development after things happened. But the APS synchrotron lets us see the microstructure evolution during the event."
The x-ray diffraction measurements also provide a more dynamic picture of what happens inside the solder joint as it passes through different phases over time. For example, although there are only a few different tin crystal orientations in a given SAC lead-free solder joint, different orientations are always observed after melting and resolidification. Recrystallization behavior under thermal cycling also results in evolution of the tin crystal orientation.
Lee was surprised by "the overall tin material response to the external factors. I considered tin as a 'dead' material with a certain crystal structure, but the more you look into this material, it seems to react like a living thing."
“What the APS data has especially enabled us to do is get a comprehensive picture of the very beginning of the thermal fatigue process [on beamline 6-ID-D] and connect it with what happens toward the end [on beamline 34-ID-E]," Bieler said.
Observing how the x-ray diffraction peaks changed from initial solidification and proceeded to spread out over repeated thermal cycles, Bieler said, "really helped us get to the point where we could describe the sequential mechanism from the moment of solidification up to the first crack that forms. We are able to explain everything that happened and why it happened in these solder joints as a result of what we've been able to do at the APS. The APS has been very helpful for understanding the early stage as well as the stage just before cracks form."
These fresh insights into the failure mechanism of lead-free solder joints guide scientists in their development of models for making reliability predictions. Although it is too early to proclaim any definite remedy for improving reliability in lead-free solder joints, the work provides some important clues.
"To find the right mitigation, you need to find the right failure mechanism," Lee said. "Based on the study so far, we identified that the grain refinement in tin interconnects is bad for thermal cycling performance. But at the same time it is beneficial for resistance to mechanical shock. So there are no golden rules, but at least we are beginning to understand why."
As for next steps, Bieler said that "finding a reliable, automated way to index diffraction patterns from multi-crystal joints would greatly speed up our ability to mine the data we have more effectively. Analysis strategies to obtain stress and strain would naturally follow using established methods. Continuing in situ measurements in thermomechanical cycling specimens, and looking toward comparing the microstructure before and after shock conditions (or possibly in situ), could also be effective. Microbeam diffraction in solder bumps is also a desirable thing to do, as the volumes are small, and this method is well suited for exploring tiny places." — Mark Wolverton
http://www.aps.anl.gov/Science/Highlights/Content/APS_SCIENCE_20121008.php
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Pb-free solder alloy mainly containing Zn
Espacenet - Bibliographic data:
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400 DEG C and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass%, preferably 3.0 to 7.0 mass% of Al, 0.002 to 0.800 mass%, preferably 0.005 to 0.500 mass% of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass% of Mg or 0.3 to 3.0 mass% of Ge.
Page bookmark TW201228764 (A) - Pb-free solder alloy mainly containing Zn
Inventor(s): ISEKI TAKASHI [JP] +
Applicant(s): SUMITOMO METAL MINING CO [JP] +
Classification:
- international: B23K35/28; C22C18/04
- European: B23K35/28B; H05K3/34F1
Application number: TW100140229 20111104
Priority number(s): JP20100274134 20101208
Also published as: WO2012077415 (A1) JP2012121053 (A)
'via Blog this'
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400 DEG C and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass%, preferably 3.0 to 7.0 mass% of Al, 0.002 to 0.800 mass%, preferably 0.005 to 0.500 mass% of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass% of Mg or 0.3 to 3.0 mass% of Ge.
Page bookmark TW201228764 (A) - Pb-free solder alloy mainly containing Zn
Inventor(s): ISEKI TAKASHI [JP] +
Applicant(s): SUMITOMO METAL MINING CO [JP] +
Classification:
- international: B23K35/28; C22C18/04
- European: B23K35/28B; H05K3/34F1
Application number: TW100140229 20111104
Priority number(s): JP20100274134 20101208
Also published as: WO2012077415 (A1) JP2012121053 (A)
'via Blog this'
IWLPC - International Wafer-Level Packaging Conference
IWLPC - International Wafer-Level Packaging Conference:
SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition program is finalized. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
http://www.iwlpc.com/
'via Blog this'
SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition program is finalized. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
http://www.iwlpc.com/
'via Blog this'
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy:
ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
'via Blog this'
ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
'via Blog this'
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn:
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
'via Blog this'
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
'via Blog this'
Tuesday, October 9, 2012
IPC Medical Industries Technical Conference
IPC Medical Industries Technical Conference:
'via Blog this'
November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
'via Blog this'
November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
Wednesday, September 26, 2012
Restriction of Hazardous Substances in Electrical and Electronic Equipment - Environment - European Commission
Restriction of Hazardous Substances in Electrical and Electronic Equipment - Environment - European Commission:
'via Blog this'
he new RoHS Directive 2011/65/EU (RoHS 2) entered into force on 21 July 2011 and requires Member States to transpose the provisions into their respective national laws by 2 January 2013. At the 2011 RoHS/WEEE Technical Adaptation Committee meeting, the Commission and Member States established an official working group, pursuant to the TAC rules of procedure, for the preparation of a RoHS 2 Frequently Asked Questions (FAQ) document. The working group completed its work in June 2012.
The FAQ are intended to help economic operators interpret the provisions of RoHS 2 in order to ensure compliance with the Directive’s requirements. They are considered a ‘living document’ and may be revised in the future.
Should stakeholders have any comments on the current version (with references to the respective questions and answers), they are asked to submit them to ENV-ROHS@ec.europa.eu until 14 September 2012.
The existing Commission FAQ document related to 2002/95/EC will remain valid until that Directive is repealed on 3 January 2013.
'via Blog this'
he new RoHS Directive 2011/65/EU (RoHS 2) entered into force on 21 July 2011 and requires Member States to transpose the provisions into their respective national laws by 2 January 2013. At the 2011 RoHS/WEEE Technical Adaptation Committee meeting, the Commission and Member States established an official working group, pursuant to the TAC rules of procedure, for the preparation of a RoHS 2 Frequently Asked Questions (FAQ) document. The working group completed its work in June 2012.
The FAQ are intended to help economic operators interpret the provisions of RoHS 2 in order to ensure compliance with the Directive’s requirements. They are considered a ‘living document’ and may be revised in the future.
Should stakeholders have any comments on the current version (with references to the respective questions and answers), they are asked to submit them to ENV-ROHS@ec.europa.eu until 14 September 2012.
The existing Commission FAQ document related to 2002/95/EC will remain valid until that Directive is repealed on 3 January 2013.
Tuesday, September 25, 2012
National Conference on Electronics Design, Assembly and Reliability
National Conference on Electronics Design, Assembly and Reliability: "The National Conference on Electronics Design, Assembly and Reliability (NCEDAR) is focused on your needs and your industry. This NEW event, backed by the experience and expertise of IPC — Association Connecting Electronics Industries®, brings you the latest information while providing valuable networking opportunities.
Organized by IPC India in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, NCEDAR will be held at the Indian Institute of Science, Bangalore, December 4–6, 2012.
Technical Conference — Discover the latest breakthroughs on topics including:
Design, simulation and modeling
Electronic components, RF and optoelectronics
Advanced packaging, including interconnections
Assembly and manufacturing technology (PCB)
Materials and processing
Reliability and quality control"
'via Blog this'
Organized by IPC India in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, NCEDAR will be held at the Indian Institute of Science, Bangalore, December 4–6, 2012.
Technical Conference — Discover the latest breakthroughs on topics including:
Design, simulation and modeling
Electronic components, RF and optoelectronics
Advanced packaging, including interconnections
Assembly and manufacturing technology (PCB)
Materials and processing
Reliability and quality control"
'via Blog this'
Tuesday, September 18, 2012
New patents for Bi rich solders
Sumitomo have applied for patents on a novel lead free solder alloy, consisting predominantly of Bi with the major addition of Zn. Smaller amounts of Al & P are also added, as well as Cu in some instances. Claims for the alloy include a small residual stress during solidification, allowing for a high joint strength and high reliability. It also claimed that it can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature.
http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2012120733A1&KC=A1&FT=D&DB=EPODOC&locale=en_EP&date=20120913&rss=true
http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201204502A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120201&rss=true
Senju have also applied for a patent for a high temperature solder alloy containing 90% Bi with additions of Sn, Sb, Ag & P.
http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201213552A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120401&rss=true
http://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2012120733A1&KC=A1&FT=D&DB=EPODOC&locale=en_EP&date=20120913&rss=true
http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201204502A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120201&rss=true
Senju have also applied for a patent for a high temperature solder alloy containing 90% Bi with additions of Sn, Sb, Ag & P.
http://worldwide.espacenet.com/publicationDetails/biblio?CC=TW&NR=201213552A&KC=A&FT=D&DB=EPODOC&locale=en_EP&date=20120401&rss=true
Manufacturing of the Raspberry PI to move to the UK
One of the biggest holdups to owning a Raspberry Pi was its stuttering availability, so much so that it even prompted a few copycat boards. Creator Eben Upton and equipment makers Premier Farnell might have found the solution, teaming up with Sony to produce an initial run of 300,000 of the educational computers at the company's UK Technology Center, in Pencoed, near Bridgend in Wales. Upton hopes to keep the cost at $25 and $35 for two boards, thanks to employing Sony's "lean manufacturing techniques," and the Japanese company has already spent £50,000 ($80,000) on new package-on-package assembly equipment -- ensuring that we'll all be able to get our hands on one soon enough.
Premier Farnell, Sony, team up to move Raspberry PI manufacturing to the UK -- Engadget:
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Premier Farnell, Sony, team up to move Raspberry PI manufacturing to the UK -- Engadget:
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Pb-free Electronics Risks Mitigation Project - DLA Technical Briefing 24 April 2012
A recent brieifing of PERM has taken place discussing the following
Discussion Topics
• Pb-free Electronics Supplier Issues
• Pb-free Electronics Risks & Failures
– Tin Whiskers
– Issues with Pb-free Alloys in COTS Electronics
– Unpredictable Service Life & Reliability for the Warfighter
• Risk Reduction Strategy
– Pb-free Electronics Risk Management (PERM) Consortium
– “Manhattan Project” to Scope the Problem
– Pb-free Electronics Risk Reduction Program
• Take Away’s
http://www.dscc.dla.mil/downloads/psmc/Apr12/7PbFreeElectronicRiskReduction.pdf
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Monday, September 17, 2012
Orgalime Updates their Guide on Recast RoHS Directive, July 2011
The September 2012 update of "A practical Guide to understanding the specific obligations of Recast Directive 2011/65/EU on the Restriction of the use of Certain Hazardous Substances in EEE (RoHS II)”, update of September 2012." has just bee n published.
This updated Guide on the Recast RoHS Directive aims at explaining the main changes and obligations arising from the recast, especially in the following areas:
• Scope
• Substance restrictions
• Exemptions
• Alignment of the Directive with the New Legislative Framework
• Terms and Definitions
• Review
• Transposition
• Comitology
Its update of September 2012 provides to readers the common understanding of the Directive of the affected European manufacturers of electrical and electronic equipment in the context of the Commission’s consultation on the draft RoHS2-FAQ Guidance Document of 15 June 2012 and its announced possible revision before 3 January 2013.
This updated version of the Orgalime RoHS Guide is available free of charge for downloading at http://publications.orgalime.org.
This Orgalime Guide and its update is to be considered as complementary to other Orgalime Guides on the WEEE and RoHS Directives. These other Orgalime Guides remain valid until repeal of the initial RoHS Directive 2002/95/EC taking effect from 3rd January 2013.
Orgalime's new updated RoHS Guide represents a living document that may be updated in the future according to implementation progress.
Orgalime, the European Engineering Industries Association, speaks for 37 trade federations representing some 130,000 companies in the mechanical, electrical, electronic, metalworking & metal articles industries of 22 European countries. The industry employs some 10.2 million people in the EU and in 2011 accounted for some €1,666 billion of annual output. The industry not only represents some 28% of the output of manufactured products but also a third of the manufactured exports of the European Union.
Orgalime Guides:
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Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis
Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme.
Science of the Total Environment
Volume 438, 1 November 2012, Pages 49-58
Scopus - Document details:
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Science of the Total Environment
Volume 438, 1 November 2012, Pages 49-58
Scopus - Document details:
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Thursday, September 13, 2012
RoHS the world over
Through the draft Regulation on the Declaration of Conformity for Pollution Control in Electrical and Electronic Product Enterprises of 18 July 2012 (公开征集《电子电气产品污染控制企业符合性声明规范》意见), China is taking one-step further action on the implementation of advanced RoHS control system. Amongst others, the draft Regulation of 18 July 2012 would provide all EEE producers and importers with a harmonized method of proofs and declaration on their conformance with voluntary and mandatory RoHS scheme in China.
Israel finally adopted the Environmental Treatment of Electrical and Electronic Equipment Law 2012 (חוק לטיפול סביבתי בציוד חשמלי ואלקטרוני ובסוללות, התשע"ב-2012) which is combination of the EU Directive on waste electrical and electronic equipment (WEEE2 recast) 2012/19/EU of 4 July 2012 and Directive 2006/66/EC on waste batteries and accumulators. The Law will require manufacturers and importers of electrical and electronic equipment (including batteries) to meet take-back and recycling targets as well as reporting and record keeping obligations as from 1 January 2014. EU WEEE Recast Directive 2012/19/EU of 4 July 2012 will extend WEEE requirements to all EEE placed on the EU market as from 15 August 2018.
Peru Supreme Decree No. 001-2012-MINAM approving the Regulation on the Management of Waste Electric and Electronic Equipment (Decreto Supremo No. 001-2012-MINAM que aprueba el Reglamento Nacional para la Gestión y Manejo de los Residuos de Aparatos Eléctricos y Electrónicos) starts requiring producers, importers, and/or distributor of electric and electronic equipment to have or enroll in a WEEE management system as from 28 June 2012. The draft European Commission Regulation of July 2012 implementing Directive 2009/125/EC of the European Parliament and of the Council with regard to ecodesign requirements for computers and computer servers is another big issue for electronics companies and may potentially impact:
- desktop computers;
- integrated desktop computers;
- notebook computers;
- desktop thin clients;
- workstations and mobile workstations; and
- small-scale servers and computer servers.
• [Cyprus] Recovery and recycling obligations of packaging extended to more companies
• [EU] Directive on energy efficiency proposed
• [Lithuania] Online registration required for EEE producers and importers of electric and electronic equipment
• [South Korea] Electromagnetic wave labeling required for wireless equipment
• [Thailand] WEEE management policy and regulation under consideration
• [UK-Scotland] New system for environmental regulation proposed
• [China] WEEE treatment fee imposed on producers and importers
• [EU] Calculation method of recycling efficiency for waste batteries and accumulators provided
• [China] Further hazard prevention and health record- keeping required
• [China] Revised China RoHS II Proposal released
• [Estonia] Suppliers and retailers of energy-related products must now comply with new framework for labelling and product information
• [France] WEEE and waste batteries management further harmonized with EU requirements
• [Germany] Recommendation on Risk assessment of nanomaterials at workplaces released
• [Turkey] WEEE Regulation entered into force
• [EU] Eight substances under consideration as substances of very high concern (SVHC)
• [Germany] Energy related products shall bear energy efficiency label
• [Venezuela] Electric and electronic waste take-back pilot program launched
Global EHS Compliance Insight
From Proactive EHS Compliance to Lobbying
Young & Global Partners
8 September 2012
http://campaign.r20.constantcontact.com/render?llr=rn7iveeab&v=0015qKm9V6FEG5UNsMk_8S9PQxire7yO1uSEJLJsGMHqHK1k9bu_Vs-dIF7wcuyqeB8fWibTCabdY3dvdfkbBVvF0KGcYGZb1nbfRLWmX0KfIQKhtakPayz6brI6aj5-F5I_5Wy8x4-5tme7nJ_VarvLeWDnrQKeWWzfXnRXfwwgCyrBDXWuqbagdArDe9iFvBfujuaeD0SstucqNGqGla32rjvF90O0-W8iJhdMJwkAhy8owNoX15nxuO4K6IOcAwmujAgIfDRmiw5_RSJVPv3aYOEWWAkHytCGA-evONQkemN-Hf_CwkUYFdzziPCqFmjx49Q2SMbP1GjaJAG6SFc2vIMhRQo9tYMmp_wiFsZpUU%3D
Key reliability concerns with lead-free connectors
The key reliability issues of lead-free connectors are presented. The electrical contact resistance of lead-free and lead-based solder-dipped contacts under various aging conditions is discussed first, followed by the fretting corrosion of lead-free contacts. Also presented is the reliability due to tin whiskers induced by mating pressure between connector contact elements.
Tadahiro Shibutani & Qiang Yu, Faculty of Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya, Yokohama, Kanagawa 240-8501, Japan
Michael Pechta, Center of Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, United States
Ji Wuc, Intel Corporation, Chandler, Arizona, United States
Microelectronics Reliability
Volume 48, Issue 10, October 2008, Pages 1613–1627
ScienceDirect.com - Microelectronics Reliability - Key reliability concerns with lead-free connectors:
Tadahiro Shibutani & Qiang Yu, Faculty of Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya, Yokohama, Kanagawa 240-8501, Japan
Michael Pechta, Center of Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, United States
Ji Wuc, Intel Corporation, Chandler, Arizona, United States
Microelectronics Reliability
Volume 48, Issue 10, October 2008, Pages 1613–1627
ScienceDirect.com - Microelectronics Reliability - Key reliability concerns with lead-free connectors:
TOWARDS ZERO DEFECTS SMART Group European Conference and Exhibition 2012
Tuesday 18th / Wednesday 19th September 2012 - Thame, Oxfordshire, UK
If your goal is 0% rework and 0% field failures, then the SMART Group’s exciting two day conference and exhibition is for you!
The proposed schedule for the two days is as follows:
DAY 1
Keynote Presentation: Printed Circuit Boards to Printed Electronics - The Future: Steve Jones - Printed Electronics Ltd
Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins
Electronics Design for Vibration: Andy Stiles - Aero Engine Controls
SMART HALT: Bob Page – Reliability Plus
Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services
High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV
Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium
Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen
Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group
DAY 2
DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd
A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS
Cleaning Under Low Stand-off Components: Rob Murphy - Zestron
Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL
Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins
Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus
DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)
ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd
The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins
Who should attend?
This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. Delegates can choose to attend either of the days or both. The costs for delegates include arrival drinks, mid-morning drinks, lunch, afternoon drinks and full access to all the proceedings immediately after the event.
http://www.smartgroup.org/wp-content/uploads/2012/06/SMARTConference2012flyer.pdf
Weak demand in electronics solders forces stall in recovery of Tin price
Tin prices are expected to stay in the $19,000 – 21,000/tonne range in the short-term, with some potential for an increase in price through the final quarter of the year into 2013. The main factors constraining an increase an increasingly gloomy world macro-economic outlook and weak demand in electronics solders. However, some Chinese solder companies have reported that their business has improved since August and think the worst time in the year has been passed. A government transition is rumoured to be happening in the end of September. We expect that Chinese consumption will be better in the last quarter of this year.
Electronics Manufacturing by Inkjet Printing
Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for physical tooling. A wide variety of active and passive materials are currently being investigated for use in inkjet printed electronics. These include semiconductors, light emitters and photovoltaic materials as well as dielectric materials and straight forward conductors. The range of conducting materials that can be printed is somewhat limited by the constraints of inkjet printing. Ideally, particle sizes should be below 1 micron and the viscosities and surface tensions of the fluids need to be tailored to the particular printhead being used. Regardless of these limitations, various technologies are now being implemented in the production of circuit boards, interconnects and antennas by inkjet printing. The properties of these inkjet
printed circuits do not currently mimic traditional PCB materials – in particular, the sheet resistances of inkjet printed materials tend to be significantly higher than traditional copper clad laminate and the minimum feature sizes are somewhat larger than state of the art semi-additive plating. However, inkjet printed circuit technologies are a still finding many applications which are particularly well suited to their properties and the digital nature of their application.
Steve Thomas
Conductive Inkjet Technology Ltd.
Cambridge, England
http://www.ipcoutlook.org/pdf/inkjet_printing_ipc.pdf
Comparison of SAC105 and SAC305 Solders
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to improve mechanical shock resistance. Several publications have established the improved performance of such 2nd
level BGA/CSP sphere alloys; however, much less has been published regarding the thermal fatigue resistance of components with these new Pb-free ball alloys. As these components and alloys become mainstream, their use in situations where thermal fatigue resistance is critical to product life will become an important consideration. Therefore, an understanding of thermal fatigue performance for new alloys is
necessary for OEM/ EMS/ ODM companies to make design and procurement decisions, and for component suppliers to ensure the reliability of their products under a range of field use conditions.
In this study, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys: SAC105, Sn-3.5Ag, and SAC305 as a control. Accelerated thermal cycle (ATC) testing was performed using 676 PBGA components with 1.0 mm pitch and electrolytic Ni/Au finished component pads. These components were assembled to high-temperature rated Cu-OSP coated printed circuit boards using SAC 305 solder paste, which represents one of the most common assembly practices in industry today. ATC testing was performed using the IPC-9701A TC1 condition of 0/100°C with 10-minute dwells (nominal); 3 different failure criteria were used in constructing the Weibull failure curves. The data indicate that SAC105 has the lowest thermal fatigue resistance among the alloys tested, with Sn-3.5Ag and SAC
305 having similar and superior performance. The impact of failure criterion on the Weibull curves is also presented. The implications of these findings and areas for further study are discussed.
Authored By:
Gregory Henshall, Hewlett-Packard Co.
Jasbir Bath, Bath Technical Consultancy
Sundar Sethuraman, Jabil
David Geiger, Flextronics International
Ahmer Syed, Amkor
M.J. Lee, Xilinx
Keith Newman and Livia Hu, Sun Microsystems
Dong Hyun Kim and Weidong Xie, Cisco Systems
Wade Eagar and Jack Waldvogel, Motorola
http://www.ipcoutlook.org/pdf/comparison_thermal_fatigue_ipc.pdf
Overcoming the Next Set of Technology Hurdles
The latest computer chips offer more functionality but are also harder to manufacture with technology reaching fundamental limits. Where will it go from here? What are the implications? This article will show you.
http://www.ipcoutlook.org/pdf2/next_set_technology_hurdles.pdf
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http://www.ipcoutlook.org/pdf2/next_set_technology_hurdles.pdf
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IPC-SMTA Cleaning and Conformal Coating Conference
This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.
“How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower and what is acceptably clean for one industry segment may be unacceptable in others.
A half-day workshop will be followed by a two-day technical conference, that will include tabletop exhibits, luncheons, and a networking reception.
Workshop
Tuesday, November 13, 8:00 am–12:00 pm
Conformal Coatings: Types, Uses and Specifications
Doug Pauls, Rockwell Collins and Jason Keeping, Celestica
Technical Conference Agenda
Tuesday, November 13
12:50 pm–1:00 pm Welcome
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
1:00 pm–2:30 pm Nano-Coatings
Session Leader: Craig Hillman, Ph.D., DfR Solutions
Innovative Superhydrophobicity Nano-Coatings that Protect HDI Interconnects from Moisture Absorption
Dan Hobson, Ross Technology Corporation
Characterization and Analysis of Plasma Polymers for Protective Films
Tim Von Werne, Semblant Ltd.
Chemical Vapor Deposition Enables Well-Defined Polymeric Films on Micro and Nano-Scale Features
Aleksandr White, GVD Corporation, Inc.
2:30 pm–3:00 pm Break
3:00 pm–4:00 pm Increasing the Reliability of Electronic Devices
Stephen Coulson, Ph.D., P2i
Enhancing Water-Blocking Nano Coatings for Telecommunications Devices
Blake Stevens, Ph.D., HzO
4:00 pm–4:45 pm Keynote: Printed Circuit Board Reliability — Factors OEMs Should Consider in the Age of Miniaturization
Dave Hillman, Rockwell Collins
5:00 pm–6:30 pm Networking Reception sponsored by Kyzen Corporation
Wednesday, November 14
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–9:30 am Conformal Coating
Session Leader: Jeff Kennedy, Celestica
High Temperature Reliability Limits of Silicon Conformal Coatings
Carlos Montemayor, Dow Corning Corporation
Investigation of Adhesive Strength of Conformal Coatings
Rich Kraszewski, Plexus Corporation
Standardization of Electronic Conformal Coatings in an Aerospace OEM
Hector Valladares, Honeywell International
9:30 am–10:00 am Break
10:00 am–11:30 am Use of IPC-B-52 Test Assembly for Conformal Coating Process Optimization
Doug Pauls, Rockwell Collins
A Preliminary Investigation into Enhanced Automated Selective Conformal Coating of Electronic Assemblies by employing Plasma Treatment Technology
David Foote and Hector Pulido, Nordson Asymtek
Throughput and Yield Improvements via Conformal Coating Process Characterization
Brad Perkins and Hector Pulido, Nordson Asymtek and Manuel Fernandez, Celestica
11:30 am–12:30 pm Luncheon sponsored by Zestron
12:30 pm–3:00 pm Cleanliness Assessment & Process Control
Session Leader: Doug Pauls, Rockwell Collins
A ROSE is Still a ROSE? Ionically, It Makes a Difference!
Graham Naisbitt, Gen3 Systems Limited
Localized Extraction Methods for Ionic Analysis
Eric Camden, Foresite, Inc. and Doug Pauls, Rockwell Collins
Cleaning Challenges in an HDI World
Mark Northrup, IEC Electronics Corp., Joe Russeau, Precision Analytical Laboratory, Inc. and Mike Bixenman, DBA, Kyzen Corporation
IPC-B-52 SIR: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future
Matt Kelly, IBM Corporation
A Comparison of Extract Solution Composition for Bare Boards
Jennifer Klavon, Rockwell Collins
3:00 pm–3:30 pm Break
3:30 pm–5:30 pm Environmental Standards and Regulations
Session Leader: Lee Wilmot, TTM Technologies, Inc.
Regulations and Productive Electronics Assembly: A Review of the Proposed OTC Regulations Targeted for 13 Eastern States
Barbara Kanegsberg, BFK Solutions
Green Screen Chemical Hazard Assessment Tool for Selecting Safer Cleaning
Curtis Wray, Hewlett-Packard Company
Reduction of VOC Emissions and Alternatives to Toxic Conformal Coatings
Emmanuelle Guene, Inventec Performance Chemicals
RoHS 2 / REACH / Conflict Materials
Ron Lasky, Ph.D., Indium Corporation of America
Thursday, November 15
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–10:00 am Electronics Assembly and PCB Failure Mechanisms & Reliability
Session Leader: Dave Hillman, Rockwell Collins
Influence of Ionic Contamination and Tin Whiskers
Stephan Meschter, Ph.D., BAE Systems Platform Solutions and Polina Snugovsky, Ph.D., Celestica
Creep Corrosion of PCB Assemblies: Effects of Surface Contamination
Martin Anselm, Universal Instruments
How Conformal Coating Can Kill
Craig Hillman, Ph.D., DfR Solutions
Electrical Reliability of Combinations of Solder Paste, Wave Soldering Flux and Conformal Coatings
Karen Tellefsen, Cookson Electronics
10:00 am–10:30 am Break and Box Lunch
10:30 am–1:30 pm Assembly Cleaning & Challenges
Session Leader: Dale Lee, Plexus Corporation
Process Optimization and Customer Requirements
Ken Van Zill, Ducommun LaBarge Technologies, Inc.
Cleaning No-Clean Flux Residues
Michael Havener, Benchmark Electronics Inc.
Electronics Effects of Cleaning Agents on Adhesives and Conformal Coating
Tana Soffa, L.W. Nusbaum, P.A. Panackal and K.F. Schoch, Jr., Northrop Grumman Corporation
Improvement of Cleaning Lead-Free Flux Residues for HDI Assemblies by Reduction of Oxygen Levels During Reflow
Maeva Tureau, Ph.D.; Chris Han-Adebekun, Ph.D. and Greg Arslanian, Air Products & Chemicals
Determining Critical Cleaning Process Parameters for QFNs
Umut Tosun, Naveen Ravindran and Michael McCutchen, ZESTRON America
Assembly Cleaning Process Characterization — Utilizing Repeatable Chemistry Solution Control
Dave Adams, Rockwell Collins; Dave Lober and John Williamson, Kyzen Corporation
1:30 pm–1:45 pm Adjournment
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
IPC-SMTA Cleaning and Conformal Coating Conference:
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Tuesday, September 11, 2012
Solder foams, nano-porous solders, foamed-solder balls
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
Page bookmark TWI358340 (B) - Solder foams, nano-porous solders, foamed-solder b
Inventor(s): CHOE HEEMAN [KR]; SUH DAEWOONG [KR] +
Applicant(s): INTEL CORP [US] +
Classification:
- international: B23K35/02; B23K35/14; H01L21/66
- European: B23K35/02D5P; B23K35/22; H05K3/34C4B; H05K3/34F1
Application number: TW20060146439 20061212
Priority number(s): US20050323218 20051230
Also published as:
US2007152016 (A1) US7745013 (B2) WO2007078717 (A2) WO2007078717 (A3) KR20080083127 (A) more
Page bookmark TWI358340 (B) - Solder foams, nano-porous solders, foamed-solder b
Inventor(s): CHOE HEEMAN [KR]; SUH DAEWOONG [KR] +
Applicant(s): INTEL CORP [US] +
Classification:
- international: B23K35/02; B23K35/14; H01L21/66
- European: B23K35/02D5P; B23K35/22; H05K3/34C4B; H05K3/34F1
Application number: TW20060146439 20061212
Priority number(s): US20050323218 20051230
Also published as:
US2007152016 (A1) US7745013 (B2) WO2007078717 (A2) WO2007078717 (A3) KR20080083127 (A) more
IPC APEX EXPO 2013
San Diego Conference Centre
19 - 21 February 2013
FREE! Opening keynote — Join theoretical physicist, best-selling author and futurist Dr. Michio Kaku for an awe-inspiring look at the future!
Show highlights include:
FREE! More than 400 exhibitors showing equipment, materials and services for printed boards and electronics manufacturing — plus printed electronics! There's no better place to see and compare.
The largest technical conference for our industry in the world. Highly selective, the conference presents new research and innovations from experts in the fields of electronics assembly, test and board fabrication and design.
FREE! Industry poster sessions — Catch up on the latest research and meet the authors.
Professional development courses provide comprehensive updates on pressing industry concerns.
Standards development meetings that help shape the future of our industry.
Compete in or watch the exciting IPC International Hand Soldering Grand Championship on the show floor.
Stay tuned, there’s a lot more to come!
Home Page | IPC APEX EXPO 2013:
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Monday, September 10, 2012
IPCWorksAsia 2012
IPC WorksAsia 2012 to build the South China electronics industry technology festival
PCB & electronic assembly and cutting-edge technology / best practices / Green Manufacturing
Time: 30 to 31st October 2012
Location: Shenzhen, Shihua Hotel
Organizers: IPC-International Electronics Industry Association Connecting
IPC engineers in Shenzhen, southern China, the majority of electronics companies, professional and technical personnel, functional managers are meeting to create a PCB & electronic assembly and cutting-edge technology / best practices / green manufacturing technology festival! Economic slowdown, lack of demand, rising costs, the opportunity to learn a changing set of technologies, processes, management and policy in one place, absolutely not to be missed!
•Activities: theme seminars , experienced professionals bringing together well-known domestic and foreign enterprises and academia, side by side hot topics dedicated to advanced theories on PCB & assembly, best practices, management and policy.
•Activity Two: Reliability seminar, lectures by experts from well-known companies and laboratories on ways to improve product reliability.
Seats are limited, please register reserved seats as soon as possible!
http://www.ipc.org.cn/Events/IPCWorksAsia-2012/default.htm
PCB & electronic assembly and cutting-edge technology / best practices / Green Manufacturing
Time: 30 to 31st October 2012
Location: Shenzhen, Shihua Hotel
Organizers: IPC-International Electronics Industry Association Connecting
IPC engineers in Shenzhen, southern China, the majority of electronics companies, professional and technical personnel, functional managers are meeting to create a PCB & electronic assembly and cutting-edge technology / best practices / green manufacturing technology festival! Economic slowdown, lack of demand, rising costs, the opportunity to learn a changing set of technologies, processes, management and policy in one place, absolutely not to be missed!
•Activities: theme seminars , experienced professionals bringing together well-known domestic and foreign enterprises and academia, side by side hot topics dedicated to advanced theories on PCB & assembly, best practices, management and policy.
•Activity Two: Reliability seminar, lectures by experts from well-known companies and laboratories on ways to improve product reliability.
Seats are limited, please register reserved seats as soon as possible!
http://www.ipc.org.cn/Events/IPCWorksAsia-2012/default.htm
Thursday, September 6, 2012
THE Pb-FREE IN ELECTRONICS RISK MITIGATION (PERM) CONSORTIUM
A paper has just be released describing the organization, content, and expectations of the newly formed Pb-free Electronics Risk Mitigation (PERM) consortium and its stakeholders. PERM was created as a more focussed group of the LEAP consortium.
The AIA-sponsored Pb-free Electronics in Aerospace Project (LEAP) has been the premier industry working group in the the defense/aerospace industry since 2004. It has worked to identify and address the risks and other challenges associated with the use of Pb-free electronics in high performance & high reliability equipment. It has successfully provided resources such as handbooks and standards as well as templates, guidelines, and other tools to support risk mitigation. However, the use of Pb-free materials has grown to such an extent that many components/parts are no longer available in tin-lead (either surface finishes or interconnection media). Engineers have been forced to use some Pb-free parts in their new designs or, in many cases, as part of retrofits and upgrades, leading to concern over performance and reliability.
An ad hoc sub-committee of the LEAP team spent over a year producing a more focused entity called the Pb-free Electronics Risk Mitigation (PERM) consortium, to provide overarching executive leadership and coordination of Pb-free electronics risk management activities for the aerospace and defense community on both the government and industry side. It is focussed on those activities that provide value-added results. More information
http://www.ipcoutlook.org/pdf/pb_free_risk_mitigation_smta.pdf
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Monday, September 3, 2012
IPC Solder paste standard emerges
IPC-7527, the first published standard that originated outside the U.S., provides guidance for solder paste.
Solder paste is a necessity for basically all printed circuit boards, but it's one of the most overlooked technologies in the electronics industry. IPC has completed the first standard that will help development teams improve the quality of their solder paste operations, which could bring significant improvements in quality and reliability.
IPC-7527, Requirements for Solder Paste Printing, covers the many aspects of solder paste, from initial placement on the board through tests after boards are ready to move forward on production lines. The standard will cover a large footprint.
"This document is useful for anyone who uses solder paste," said Kris Roberson, IPC's manager of assembly technology. "Before this came together, much of the awareness for solder was 'tribal knowledge' passed from one person to another. That can get to be like the telephone game, where two or three generations down the road the information has changed quite a bit."
The benefits go beyond the unchanging nature of the printed word. The new standard serves as a reference guide for equipment operators. They can now turn to a book when they have questions and can't find the company expert.
"It provides the operators with a standard that will help them make the right decisions when they face with issues in production, and no professionals or specialists are present," Steven Juel Hansen, cochairman of the Solder Paste Printing Task Group and production engineer at Vestas Control Systems A/S, based in Hammel, Denmark.
That Hansen is in Denmark is quite significant. IPC-7527 is the first published IPC standard that originated outside the United States.
"The Nordic group came up with the idea, created the standard and brought a nearly-completed document to IPC. They had done a thorough job. Once they brought it to us it took less than a year to move it to publication. That's pretty speedy given the time needed for public comment and responses, as well as for getting the document ready to publish," Roberson said.
Given IPC's expanding global strategy, it's unlikely that it will be the last. Roberson cites another first for the document, this one on the technical side.
"There are standards that tell what the completed assembly should look like, but this is the first one to tell us what the solder paste should look like," Roberson said. "When things are written down, they provide a common language that clearly specifies requirements. IPC-7527 tells you how far off centers can be before they're considered faulty. In the past, operators did whatever the companies decided to do."
He noted that IPC-7527 is designed to be a useful document for equipment operators and others who work with one of this industry's basic infrastructure elements, solder. Preventing problems with this electrical and mechanical technology can help improve the quality and reliability of many printed circuit boards.
"The standard does a nice job of bringing out common problems, like solder that has rooftops or saddle shapes instead of a nice brick form, and it provides solutions so those issues can be fixed," Roberson said.
When issues like saddles and rooftops arise, the old adage of a picture being worth 1,000 words comes into play. Committee members endorsed that simple saying, packing 50 photos into the 15-page standard.
Though it's fairly short, IPC-7527 addresses a broad range of technologies. It covers solder paste from the early stages through production and testing.
"This covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. It also provides information on automated past inspection using either cameras or lasers," Roberson said.
For more information on the standard (already available in English and Danish), visit www.ipc.org/onlinestore.
EMSNow - Solder paste standard emerges:
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Thursday, August 30, 2012
Tin whisker mitigation research to be performed by Rockwell Collins for DoD program – Military Embedded Systems
A team lead by Rockwell Collins has been selected by the Department of Defense's (DoD's) Strategic Environmental Research and Development Program to lead team a research project on the Tin Whiskers Inorganic Coatings Evaluation (TWICE) program. The research will focus on mitigating the impact of tin whiskers on high-reliability, high-performance electronic systems caused by new lead-free alloys and finishes in the defense and aerospace and defense manufacturing systems and supply chain.
The project is expected to form a better scientific understanding of the mechanisms of tin whisker formation and how they may be managed with conformal coatings. Materials and the processes necessary to generate coatings that could mitigate tin whisker growth on a variety of surfaces over a wide range of environmental conditions will be developed.
Tin whisker mitigation research to be performed by Rockwell Collins for DoD program – Military Embedded Systems:
Wednesday, August 15, 2012
'WEEE II’
ENDS Legal Compliance Manager: The recast EU Waste Electrical and Electronic Equipment (‘WEEE II’) Directive will repeal and replace the original EU WEEE Directive 2002/96/EC from 15 February 2014, so as to increase national collection targets, as well as recovery targets, and extend the scope of the Directive. It applies to specific forms of WEEE (such as household appliances) from 13 August 2012, but will switch to ‘open scope’, with certain exemptions, from 15 August 2018. It is due to be transposed into Member State law from 14 February 2014.
The Directive will allow the existing national collection target of at least four kilograms of WEEE per person from private households to remain until 31 December 2015. From 1 January 2016, however, the national collection targets will increase to require a minimum collection rate of 45 per cent (or 40 per cent for new Member States) until the end of 2018, based on the average weight of WEEE placed on the market in each state over the previous three years. From 1 January 2019, Member States may either collect at least 65 per cent of EEE placed on the market or 85 per cent of WEEE generated each year, with new Member States permitted to delay the introduction of higher targets until 14 August 2021.
Recovery targets are also laid out that will increase every three years from August 2012, with certain products moving from a ‘recycling’ target to a ‘preparation for re-use and recycling’ target from August 2015.
The Directive will allow the existing national collection target of at least four kilograms of WEEE per person from private households to remain until 31 December 2015. From 1 January 2016, however, the national collection targets will increase to require a minimum collection rate of 45 per cent (or 40 per cent for new Member States) until the end of 2018, based on the average weight of WEEE placed on the market in each state over the previous three years. From 1 January 2019, Member States may either collect at least 65 per cent of EEE placed on the market or 85 per cent of WEEE generated each year, with new Member States permitted to delay the introduction of higher targets until 14 August 2021.
Recovery targets are also laid out that will increase every three years from August 2012, with certain products moving from a ‘recycling’ target to a ‘preparation for re-use and recycling’ target from August 2015.
Monday, August 13, 2012
SMART Group European Conference on Packaging, Assembly and Reliability
Events Diary | SMART Group: plus Table Top Exhibition
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England
The Big Zero Conference – Design and Build Reliability
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England
The Big Zero Conference – Design and Build Reliability
Friday, July 27, 2012
Dr. Jennie Hwang will deliver two Courses at SMTA International Exhibition & Conference on October 15, 2012, Orlando, Florida
Manufacturing PCB assemblies containing grid array packages in the co-existence of RoHS lead-free compliant and RoHS exempted industry sectors poses great challenges to both OEMs and EMSs. Much confusion has been generated. This course aims to clear the confusion and offer answers to industry-wide questions on solder-ball-array packages and assembly (BGA, CSP, WLP, and LGA) in manufacturing, as well as reliability. Questions to be answered include "Should reflow peak temperature be set to melt BGA solder balls?"
and
"What is the best practice for assembling lead-free components under the SnPb process?" The course provides working knowledge with focus on the challenges and solutions for Ball Grid Array (BGA) packages, fine pitch BGA and other BTC packages containing solder balls as interconnection technology. Using solder paste, six commonly occurring scenarios covering the backward and forward compatibility (backward compatibility: lead-free BGA using tin-lead solder paste; forward compatibility: lead-free BGA with lead-free solder paste) will be specified including the PCB assembly containing both lead-free BGA and tin-lead BGA. The desirable reflow process parameters will be specified. Real world production process parameters critical to the reliability and the impact of key process parameters will be presented. The course also discusses what constitutes the best practices enabling the manufacture of the ultimate reliability of PCB assemblies and the scientific rationale behind such practices.
The presentation will be concluded with the summary of relative ranking of the product reliability (solder joint reliability plus the PCB assembly integrity). Specific topics to be covered:
• Array package (BGA, CSP, WLP, BTC) interconnection – challenges; Array solder interconnection technology – principles, best practices
• Should the reflow profile set to specifically melt BGA solder balls?
• Key process parameters for commonly occurring production scenarios and rationale
• PCB assembly: BGA with SAC305 solder ball using SnPb(E) solder paste
• PCB assembly: BGA with SnPb(E) solder ball using SAC305 solder paste
• PCB assembly: BGA with SAC305 solder ball using SAC305msolder paste
• PCB assembly: BGA with low-Ag SAC solder ball using SAC305 solder paste
• PCB assembly: BGAs with SAC305 solder ball using low-Ag SAC solder paste
• PCB assembly: BGAs with low-Ag SAC solder ball using low-Ag SAC solder paste
• Solder joint reliability and PCB assembly integrity – principles, processes, failure prevention
• "What constitutes the best practices that enable the ultimate reliability of PCB assemblies and the scientific rationale behind?"
T16: Preventing Production Defects and Failures
Introduction
Considering the new and anticipated developments in packaging and assembly, this course focuses on "how-to" prevent the issues and take remedial measures of the prevailing production defects through the understanding of potential causes. Top five current issues/defects addressed in this half-day course include PCB bare board issues, PCB Pad cratering, BGA head-on-Pillow defect, passive 01005 issues, copper dissolution and Pb-free thru-hole barrel filling problem. PCB thermal properties and halogen-free PCB laminates will be summarized. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion. Specific topics to be covered:
• PCB – thermal properties for Pb-free assembly
• PCB – Halogen-free laminates
• PCB Pad cratering – causes, solutions
• Head-on-pillow defect – causes, factors, remedies
• Copper dissolution – impact on thru-hole solder joint reliability
• Through-hole barrel filling – process, solder joint integrity
• Tin whisker – new developments
• Passive 01005 assembly – process, factors, best practice
• Your issues
For info/registration: https://www.smta.org/event_registration/smtai_register.cfm
and
"What is the best practice for assembling lead-free components under the SnPb process?" The course provides working knowledge with focus on the challenges and solutions for Ball Grid Array (BGA) packages, fine pitch BGA and other BTC packages containing solder balls as interconnection technology. Using solder paste, six commonly occurring scenarios covering the backward and forward compatibility (backward compatibility: lead-free BGA using tin-lead solder paste; forward compatibility: lead-free BGA with lead-free solder paste) will be specified including the PCB assembly containing both lead-free BGA and tin-lead BGA. The desirable reflow process parameters will be specified. Real world production process parameters critical to the reliability and the impact of key process parameters will be presented. The course also discusses what constitutes the best practices enabling the manufacture of the ultimate reliability of PCB assemblies and the scientific rationale behind such practices.
The presentation will be concluded with the summary of relative ranking of the product reliability (solder joint reliability plus the PCB assembly integrity). Specific topics to be covered:
• Array package (BGA, CSP, WLP, BTC) interconnection – challenges; Array solder interconnection technology – principles, best practices
• Should the reflow profile set to specifically melt BGA solder balls?
• Key process parameters for commonly occurring production scenarios and rationale
• PCB assembly: BGA with SAC305 solder ball using SnPb(E) solder paste
• PCB assembly: BGA with SnPb(E) solder ball using SAC305 solder paste
• PCB assembly: BGA with SAC305 solder ball using SAC305msolder paste
• PCB assembly: BGA with low-Ag SAC solder ball using SAC305 solder paste
• PCB assembly: BGAs with SAC305 solder ball using low-Ag SAC solder paste
• PCB assembly: BGAs with low-Ag SAC solder ball using low-Ag SAC solder paste
• Solder joint reliability and PCB assembly integrity – principles, processes, failure prevention
• "What constitutes the best practices that enable the ultimate reliability of PCB assemblies and the scientific rationale behind?"
T16: Preventing Production Defects and Failures
Introduction
Considering the new and anticipated developments in packaging and assembly, this course focuses on "how-to" prevent the issues and take remedial measures of the prevailing production defects through the understanding of potential causes. Top five current issues/defects addressed in this half-day course include PCB bare board issues, PCB Pad cratering, BGA head-on-Pillow defect, passive 01005 issues, copper dissolution and Pb-free thru-hole barrel filling problem. PCB thermal properties and halogen-free PCB laminates will be summarized. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion. Specific topics to be covered:
• PCB – thermal properties for Pb-free assembly
• PCB – Halogen-free laminates
• PCB Pad cratering – causes, solutions
• Head-on-pillow defect – causes, factors, remedies
• Copper dissolution – impact on thru-hole solder joint reliability
• Through-hole barrel filling – process, solder joint integrity
• Tin whisker – new developments
• Passive 01005 assembly – process, factors, best practice
• Your issues
For info/registration: https://www.smta.org/event_registration/smtai_register.cfm
Monday, July 23, 2012
TIN/TIN ALLOY NANOPARTICLE HAVING LOW MELTING TEMPERATURE AND METHOD FOR MANUFACTURING SAME
Disclosed are a nanoparticle having a size of 1-20nm prepared by electrolyzing a tin or a tin alloy, and a method for preparing same. The nanoparticle surface-melts in a temperature range of 80-130?. A solder ball having the nanoparticle can be sintered at or below 160?, and can thus, first, save 22% of energy by resolving the energy consumption of 74 kW for the conventionally used reflow processing device to an energy consumption of 50 kW by enabling the heating temperature to be lowered from 240? to 160? during reflow process. Second, deformation of a PCB board can be minimized by enabling the temperature for the reflow process to be lowered, and application areas for implementation materials having a low unit cost can be created by enabling the use of low cost polymer materials such as PET having low glass transition temperature. And third, the uniformity of a solder paste on a pad can be enhance when using a nanoparticle having a size of 10 nm or smaller, and in the case of a nano-solder ink, the limitations of micro-patterning can be overcome due to the small size of the particle (Figure 4).
WO2012096489 (A2) - TIN/TIN ALLOY NANOPARTICLE HAVING LOW MELTING TEMPERATURE AND METHOD FOR MANUFACTURING SAME
Inventor(s): KIM YOUNG SANG [KR] +
Applicant(s): ISP CO LTD [KR]; KIM YOUNG SANG [KR]; CHO KYUNG JIN [KR]; JANG SEOK PIL [KR]; LEE JONG HYUN [KR]; KIM HYUN SOO [KR] +
Classification:
- international: B22F1/00; B23K35/26; C25C5/02
- European:
Application number: WO2012KR00223 20120110
Priority number(s): KR20110002482 20110110
WO2012096489 (A2) - TIN/TIN ALLOY NANOPARTICLE HAVING LOW MELTING TEMPERATURE AND METHOD FOR MANUFACTURING SAME
Inventor(s): KIM YOUNG SANG [KR] +
Applicant(s): ISP CO LTD [KR]; KIM YOUNG SANG [KR]; CHO KYUNG JIN [KR]; JANG SEOK PIL [KR]; LEE JONG HYUN [KR]; KIM HYUN SOO [KR] +
Classification:
- international: B22F1/00; B23K35/26; C25C5/02
- European:
Application number: WO2012KR00223 20120110
Priority number(s): KR20110002482 20110110
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