Soldering Practices Are Insane | EE Times

Soldering Practices Are Insane | EE Times:

I think this would be an interesting article to include, perhaps paraphrasing & trying to induce some conversation?

He makes a number of interesting points.  Perhaps also point out that Soldertec used to teach a course on the metallurgy of soldering at the onset of Lead free


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2013 Roadmap | iNEMI

2013 Roadmap | iNEMI:

The 2013 Roadmap was developed by 20 Technology Working Groups (TWGs) in response to inputs regarding technology needs from representatives of OEMs in six Product Emulator Groups (PEGs). These groups included more than 650 individuals from over 350 corporations, consortia, government agencies and universities, located in 18 countries.

Download highlights of the Executive Summary (PDF).

View sample pages (PDF)

Press release (May 14, 2013)

WEBINARS: Introduction to the 2013 Roadmap plus highlights of selected chapters (requires log-in; if you do not have a web account, create one now).

2013 Product Emulator Groups (PEGs)
1.    Aerospace/Defense
2.    Automotive
3.    Consumer/Portable
4.    High-End Systems
5.    Medical
6.    Office Systems

The PEGs define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. These needs are presented in each PEG chapter, using key attribute spreadsheets and text according to templates that are furnished by the iNEMI Technical Committee (TC).  Each PEG has a Chair or Co-chairs and as many group members as needed for a broad-based view of that emulator’s scope (usually 2-5 individuals).

The TWGs use the OEM requirements detailed in the six PEG chapters (as applicable) to prepare each of their roadmap chapters, detailing where their respective technology stands today — and is expected to progress over the next 10 years — with respect to the stated needs.

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Manufacturing of the Raspberry PI to move to the UK

One of the biggest holdups to owning a Raspberry Pi was its stuttering availability, so much so that it even prompted a few copycat boards. Creator Eben Upton and equipment makers Premier Farnell might have found the solution, teaming up with Sony to produce an initial run of 300,000 of the educational computers at the company's UK Technology Center, in Pencoed, near Bridgend in Wales. Upton hopes to keep the cost at $25 and $35 for two boards, thanks to employing Sony's "lean manufacturing techniques," and the Japanese company has already spent £50,000 ($80,000) on new package-on-package assembly equipment -- ensuring that we'll all be able to get our hands on one soon enough.

Premier Farnell, Sony, team up to move Raspberry PI manufacturing to the UK -- Engadget:

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Weak demand in electronics solders forces stall in recovery of Tin price

Tin prices are expected to stay in the $19,000 – 21,000/tonne range in the short-term, with some potential for an increase in price through the final quarter of the year into 2013. The main factors constraining an increase an increasingly gloomy world macro-economic outlook and weak demand in electronics solders.  However, some Chinese solder companies have reported that their business has improved since August and think the worst time in the year has been passed. A government transition is rumoured to be happening in the end of September. We expect that Chinese consumption will be better in the last quarter of this year.

IPC Solder paste standard emerges

IPC-7527, the first published standard that originated outside the U.S., provides guidance for solder paste.

Solder paste is a necessity for basically all printed circuit boards, but it's one of the most overlooked technologies in the electronics industry. IPC has completed the first standard that will help development teams improve the quality of their solder paste operations, which could bring significant improvements in quality and reliability.

IPC-7527, Requirements for Solder Paste Printing, covers the many aspects of solder paste, from initial placement on the board through tests after boards are ready to move forward on production lines. The standard will cover a large footprint.

"This document is useful for anyone who uses solder paste," said Kris Roberson, IPC's manager of assembly technology. "Before this came together, much of the awareness for solder was 'tribal knowledge' passed from one person to another. That can get to be like the telephone game, where two or three generations down the road the information has changed quite a bit."

The benefits go beyond the unchanging nature of the printed word. The new standard serves as a reference guide for equipment operators. They can now turn to a book when they have questions and can't find the company expert.

"It provides the operators with a standard that will help them make the right decisions when they face with issues in production, and no professionals or specialists are present," Steven Juel Hansen, cochairman of the Solder Paste Printing Task Group and production engineer at Vestas Control Systems A/S, based in Hammel, Denmark.

That Hansen is in Denmark is quite significant. IPC-7527 is the first published IPC standard that originated outside the United States.

"The Nordic group came up with the idea, created the standard and brought a nearly-completed document to IPC. They had done a thorough job. Once they brought it to us it took less than a year to move it to publication. That's pretty speedy given the time needed for public comment and responses, as well as for getting the document ready to publish," Roberson said.

Given IPC's expanding global strategy, it's unlikely that it will be the last. Roberson cites another first for the document, this one on the technical side.

"There are standards that tell what the completed assembly should look like, but this is the first one to tell us what the solder paste should look like," Roberson said. "When things are written down, they provide a common language that clearly specifies requirements. IPC-7527 tells you how far off centers can be before they're considered faulty. In the past, operators did whatever the companies decided to do."

He noted that IPC-7527 is designed to be a useful document for equipment operators and others who work with one of this industry's basic infrastructure elements, solder. Preventing problems with this electrical and mechanical technology can help improve the quality and reliability of many printed circuit boards.

"The standard does a nice job of bringing out common problems, like solder that has rooftops or saddle shapes instead of a nice brick form, and it provides solutions so those issues can be fixed," Roberson said.

When issues like saddles and rooftops arise, the old adage of a picture being worth 1,000 words comes into play. Committee members endorsed that simple saying, packing 50 photos into the 15-page standard.

Though it's fairly short, IPC-7527 addresses a broad range of technologies. It covers solder paste from the early stages through production and testing.

"This covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. It also provides information on automated past inspection using either cameras or lasers," Roberson said.

For more information on the standard (already available in English and Danish), visit www.ipc.org/onlinestore.



EMSNow - Solder paste standard emerges:

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Current problems and possible solutions in high-temperature lead-free soldering

Lead use in solders for high-temperature applications (>85% lead, T _M≈250-350 °C) is still exempt in RoHS2, but the search for substitutes has been ongoing for a decade without finding a viable solution.  This article attempts to map the current situation with a short review of current legislation, requirements for a substitute alloy and describing some possible existing solutions.


http://www.scopus.com/record/display.url?eid=2-s2.0-84862182829&origin=inward&txGid=jCyxNaWvGqBFwEEMqY-XDsH%3a6


Journal of Materials Engineering and Performance
Volume 21, Issue 5, May 2012, Pages 629-637
Current problems and possible solutions in high-temperature lead-free soldering  ( Review )
Kroupa, A.a , Andersson, D.b, Hoo, N.c, Pearce, J.c, Watson, A.d, Dinsdale, A.e, Mucklejohn, S.f
a  Institute of Physics of Materials, AS CR, Zizkova 22, 61662 Brno, Czech Republic
b  Swerea IVF, Mölndal, Sweden
c  ITRI Ltd., Curo Park, St. Albans, United Kingdom
d  SPEME, University of Leeds, Leeds, United Kingdom
e  National Physical Laboratory, Teddington, United Kingdom
f  Ceravision Limited, The Mansion, Bletchley Park, MK3 6EB, United Kingdom

Critical concerns in soldering reactions arising from space confinement in 3-D IC packages

Scopus: Six critical issues relating to interfacial reactions arising from space confinement in 3-D integrated-circuit (3-D IC) packaging are presented in this paper. The first issue arises from the concern that intermetallics (IMCs) may occupy a large portion of the solder joint volume.

It will be demonstrated that this concern is real even for Ni under bump metallurgy (UBM) or surface finish, which reacts very slowly with solders. The second issue relates to impingement and ripening of IMC grains. When IMCs occupy a large portion of a joint, the IMC grains growing from the opposite sides of a joint will eventually touch each other. The morphology evolution from this point on determines the final microstructure of a joint. Structural defects might form as a result of the impingement and ripening of IMC grains. The third issue is the rise of impurity concentration due to solder consumption. Many of the impurities in solders, such as those from electroplating, are not soluble in IMCs. As Sn reacts to form IMCs, these impurities are rejected from IMCs into the remaining solder. Consequently, the concentrations of these impurities increase with the progress of reaction. Eventually, these impurities are trapped between IMCs growing from the opposite directions. The impact of these trapped impurities on the properties of solder joints is an important issue. The fourth issue is similar to the third except that the role of impurities is replaced by inert alloy elements of solders. The most obvious element is Ag. The fifth issue arises from the fact that, as the size of a joint becomes smaller, the surface-area-to- volume ratio increases. This makes the impact of thin-film layers on UBM and surface finish become ever higher. One well-known element is Au. The so-called Au embrittlement issue may become relevant again. The last issue is the volume shrinkage from chemical reactions. Internal stress or structure defects may form because of this shrinkage. Experimental evidence will be used in this paper to illustrate these six issues, and the implications of these issues will be discussed.

(This is inside components rather than on PCB's but still interesting perhaps? - Jeremy)

   
IEEE Transactions on Device and Materials Reliability
Volume 12, Issue 2, 2012, Article number 6135780, Pages 233-240
Critical concerns in soldering reactions arising from space confinement in 3-D IC packages

Chuang, H.Y., Yang, T.L., Kuo, M.S., Chen, Y.J., Yu, J.J., Li, C.C., Kao, C.R.  

Department of Materials Science and Engineering, National Taiwan University, Taipei 10617, Taiwan

NanoBond® assembly - A rapid, room temperature soldering process

Scopus: Indium Corporation of America has commercialized a new technology that will revolutionize how manufacturers join components using solder materials. (See Figure 1) The joining process is based on the use of reactive multilayer foils as local heat sources.

The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds are completed at room temperature in air, argon or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resistivity an order of magnitude lower, than current commercial TIMs (Thermal Interface Material). The use of reactive foils as a local heat source eliminates the need for torches, furnaces, or lasers, speeds the soldering processes, and dramatically reduces the total heat that is needed. Thus, temperature-sensitive or small components can be joined without thermal damage or excessive heating. In addition, mismatches in thermal contraction on cooling can be avoided because components see very small increases in temperature. This is particularly beneficial for joining metals to ceramics. The fabrication and characterization of the reactive foils is described, and the value proposition for NanoBonding is presented. This paper also shows the applicability of this platform technology to many areas of packaging including Thermal Interface Materials, microelectronics, optoelectronics, and Light Emitting Diodes (LEDs)


IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
2012, Pages 32-37
5th International Brazing and Soldering Conference, IBSC 2012;Las Vegas, NV;22 April 2012through25 April 2012;Code90195
NanoBond® assembly - A rapid, room temperature soldering process  ( Conference Paper )

Matteau, J.  

Indium Corporation of America, Utica, NY, United States

NanoBond and NanoFoil from Indium for room temperature soldering

Indium Corporation: NanoBond is RNT’s patented process for bonding components utilizing NanoFoil. Activated by a small pulse of energy, in a fraction of a second, NanoFoil delivers the necessary amount of heat and energy to reflow solder or braze and create a strong, true metallic joint. The process enables high strength, high conductivity bonds between most combinations of materials making it ideal for many joining and assembly operations.

RNT has developed and tailored its patented NanoBond process with each of its customers in mind. The multilayer foil is placed between two components to be bonded, along with two layers of solder, either pre-applied to the components or freestanding. Pressure is applied to prevent the components from moving, and the chemical reaction between the Al and Ni layers in the foil is activated. Heat from the NanoFoil’s reaction melts the solder or brazed layers and enables metallic bonding at room temperature in fractions (thousandths) of a second.

Effect of isothermal aging on Sn-Ag-Cu solder joints on electroless Ni-P/Au plating by laser reflow soldering

Scopus: With the miniaturization of electronic productions and the use of heat sensitive electronic components, the traditional reflow soldering process often has difficulties. As an alternative soldering process, the laser reflow soldering has been recently proposed. To clarify joint properties of the joint soldered by the laser reflow soldering, we investigated the effect of isothermal aging on Sn-Ag-Cu solder joints on electroless Ni- P/Au plating by the laser reflow soldering. Especially, the microstructure at the interface between Sn-Ag-Cu solder and Ni-P/Au plating and joint properties of solder joints were studied


IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
2012, Pages 1-4
5th International Brazing and Soldering Conference, IBSC 2012;Las Vegas, NV;22 April 2012through25 April 2012;Code90195
Effect of isothermal aging on Sn-Ag-Cu solder joints on electroless Ni-P/Au plating by laser reflow soldering  ( Conference Paper )

Nishikawa, H.a , Takemoto, T.a, Iwata, N.b 

a  Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan
b  Graduate School of Engineering, Osaka University, Suita, Osaka, Japan

Solder powders manufacture process by the wire explosion method

Scopus: Now that solder powders, which are key components of all the solder pastes, have been finer to meet the needs of the electronic industry, the wire explosion method to make solder powders smaller is being one of the ways to be in the spotlight. The wire explosion method is the powder making process using the wire form of solder. As the solder feeder moves the solder wire to the chamber full of argon gases, the wire evaporates in the electrical explosion. Then, it is solidified into the powder. The K factor, the wire feeder length, the speed, the voltage, the wire diameter are main variables in the process of making solder powders in this study. As a result of the study, 45% of the solder powders are in the range of type 6(5∼15um). Those are effectively accepted to be used after taking the tensile test, the hot zone test, the thermal shock test.


IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
2012, Pages 27-31
5th International Brazing and Soldering Conference, IBSC 2012;Las Vegas, NV;22 April 2012through25 April 2012;Code90195
Solder powders manufacture process by the wire explosion method  ( Conference Paper )

Kim, S. , Kim, S.H.  

RIST, Research Institute of Industrial Science and Technology, 32 Hyoja-Dong, Pohang City, 790-330, South Korea

Waste Electrical and Electronic Equipment: call for evidence

Open date: 28 May 2012

Closing date: 23 Jul 2012

Call for evidence to seek data from key stakeholders that can be used to assess the compliance costs to existing Waste Electrical and Electronic Equipment (WEEE) system.

Following the 2012 Budget, BIS committed to consult on preventing excessive compliance costs for business arising from the Waste Electrical and Electronic Equipment Regulations.

This call for evidence aims to improve the evidence we have regarding compliance costs arising from the UK WEEE Regulations. It aims to help to inform our decisions about alternative policy proposals to reduce burdens on business whilst ensuring environmental objectives are achieved.

Following the closure of the call for evidence on the 23 July 2012, we will assess the results against the data that we already hold and use these to develop proposals. We will issue a formal consultation on these proposals early next year. This consultation will enable the proposals to be introduced alongside changes required to transpose the requirements of the recast EU WEEE Directive agreed in December 2011.

Section 7 of the below call for evidence document includes the call for evidence questions. Three pro-forma excel spreadsheets are also provided below for data collection intended for producers of electrical and electronic equipment, Producer Compliance Schemes, and WEEE treatment facilities



Waste Electrical and Electronic Equipment: call for evidence | Consultations | BIS:

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Zn based lead-free solder patent from Sumitomo

Espacenet  Provided is a Zn-based, Pb-free solder alloy for use at high temperatures, the alloy having a melting point of 300-400 DEG C and excellent wetting properties, bonding properties, workability, and reliability. A Pb-free solder alloy having Zn as a main component, the alloy containing 1.0-9.0 mass % and preferably 3.0-7.0 mass % of Al, and containing 0.002-0.800 mass % and preferably 0.005-0.500 mass % of P; and the remainder comprising Zn, besides elements that are unavoidably included due to manufacture. The Pb-free solder alloy may also contain Mg and/or Ge at 0.3-4.0 mass % in the case of Mg and 0.3-3.0 mass % in the case of Ge.

Page bookmark     WO2012077415  (A1)  -  Pb-FREE SOLDER ALLOY HAVING Zn AS MAIN COMPONENT
Inventor(s):     ISEKI TAKASHI [JP] +
Applicant(s):     SUMITOMO METAL MINING CO [JP]; ISEKI TAKASHI [JP] +
Classification:    
- international:     B23K35/28; C22C18/00; C22C18/04; H05K3/34
- european:    
Application number:     WO2011JP74162 20111020
Priority number(s):     JP20100274134 20101208 

Soldering in Space - video

MAKE: The solder, heated, became a molten blob with a droplet of rosin clinging tight to the outside. Solder melts: that’s not too surprising. It’s the behavior of the rosin that amazed. As the temperature increased, the droplet began to spin, round and round, faster and faster, like a miniature carnival ride.

Video

Draft Version of New China RoHS Published - Measures for Administration of the Pollution Control of Electronic and Electrical Products

The Chinese Ministry of Industry and Information Technology (MIIT) has published draft Measures for Administration of the Pollution Control of Electronic and Electrical Products (known as new China RoHS) for public consultations. The deadline for comment is 10 July 2012. The old measures issued in 2006 will be revoked once the new measures enter into force.

New China RoHS also restricts the use of certain hazardous substances such as lead, mercury, cadmium, and hexavalent chromium and flame retardants such as polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) in electrical and electronic equipments and their packaging materials. However, there are a few changes(for example, change of product scope, new labeling requirement and flexible certification mechanism) in the new China RoHS that companies might need to know before placing electronic and electrical products on the Chinese market.

Change of Product Scope

Old China RoHS regulates electronic information products which are referred to as electronic radar products, electronic communication products, broadcast and television products, computer products, household electronic products, electronic measurement instrument products, security products for electron, electronic component products, electronic application products, electronic material products, and other relative products and their accessory parts.

Products affected by new China RoHS include electrical and electronic equipments which are designed for use with a voltage rating not exceeding 1000 Volt for alternating current and 1500 Volt for direct current(similar to EU RoHS) and its accessory parts.  Many home appliances (Washing machines, refrigerators) that fall out of the scope of old China RoHS will now be regulated by new China RoHS.

New Labeling Requirement

New China RoHS requires that manufacturers and importers of electrical and electronic products provide information about the impact of a product on environment and human health when the product is misused or disposed of in addition to the name and concentration of hazardous substances, the name of parts that contain hazardous substances, and whether a part or product can be recycled.

Flexible Certification Mechanism

Under the old China RoHS, products listed in the Key Administrative Catalog for the Pollution Control of Electronic Information Products (“Catalog”) will need to be tested by one of the approved labs in China and obtain CCC accreditation (China Compulsory Certification).

Under the new China RoHS, the Catalog will be renamed as Target Administrative Catalog for the Pollution Control of Electrical and Electronic Products. Various government bodies will set a timeline to prohibit the use of certain hazardous chemicals for the products listed in the Catalog. In the future, various certification mechanisms might be available. It is possible for companies to issue a self-declaration or ask independent third party to carry out the certification.

Reference

http://zfs.miit.gov.cn/n11293472/n11294912/n11296182/14644981.html

http://www.cirs-reach.com/news/Draft_Version_of_New_China_RoHS_Published.html

Revised China RoHS II Proposal (11 June 2012)

Young and Global On 4 June 2012, the Ministry of Industry and Information Technology (工业和信息化部) of China released the revised China RoHS II proposal (电子电气产品污染控制管理办法). Amongst others, the revised China RoHS II proposal of 4 June 2002
further clarified the definition on "Electrical and Electronic Equipment" (电子电气产品) by virtually adopting the definition of the EU RoHS Directive;
clarified the definition of "hazardous substances", e.g., from "lead" to "lead and its compounds";
provide more authority to the Ministry of Industry and Information Technology to coordinate implementation of China RoHS issues;
introduction of "product compliance assessment system" on electrical and electronic equipment;
The Ministry of Industry and Information Technology and the Certification and Accreditation Administration of China will establish "product compliance assessment system".
The revised China RoHS II Proposal of 4 June 2012 is under consultation until 10 July 2012.

Please download the China RoHS II Proposal (4 June 2012) here.

Our previous alerts on China RoHS issues:
China RoHS 2011 Reloaded (September 2011)
All EEE to be Regulated by China RoHS
China RoHS Catalog and China Compulsory Certification (CCC)