Factiva: "Joseph Charles Fjelstad, Maple Valley, Wash., for 'electronic assemblies without solder and methods for their manufacture.'
The abstract of the patent published by the U.S. Patent and Trademark Office states: 'The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder."
Tuesday, August 2, 2011
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
Scopus: "In this work, TiO2 nanoparticles were successfully incorporated into Sn3.5Ag and Sn3.5Ag0.7Cu solder, to synthesize novel lead-free composite solders.
Effects of the TiO2 nanoparticle addition on the microstructure, melting property, microhardness, and the interfacial reactions between Sn3.5AgXCu and Cu have been investigated. Experimental results revealed that the addition of 0.5 wt.% TiO2 nanoparticles in Sn3.5AgXCu composite solders resulted in a finely dispersed submicro Ag3Sn phase.
This apparently provides classical dispersion strengthening and thereby enhances the shear strength of composite solder joints. After soldering, the interfacial overall intermetallic compounds (IMC) layer of the Sn3.5AgXCu lead-free solder joint was observed to have grown more significantly than that of the Sn3.5AgXCu composite solder joints, indicating that the Sn3.5AgXCu composite solder joints had a lower diffusion coefficient. This signified that the presence of TiO2 nanoparticles was effective in retarding the growth of the overall IMC layer"
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
Scopus: "In this work, TiO2 nanoparticles were successfully incorporated into Sn3.5Ag and Sn3.5Ag0.7Cu solder, to synthesize novel lead-free composite solders.
Effects of the TiO2 nanoparticle addition on the microstructure, melting property, microhardness, and the interfacial reactions between Sn3.5AgXCu and Cu have been investigated. Experimental results revealed that the addition of 0.5 wt.% TiO2 nanoparticles in Sn3.5AgXCu composite solders resulted in a finely dispersed submicro Ag3Sn phase.
This apparently provides classical dispersion strengthening and thereby enhances the shear strength of composite solder joints. After soldering, the interfacial overall intermetallic compounds (IMC) layer of the Sn3.5AgXCu lead-free solder joint was observed to have grown more significantly than that of the Sn3.5AgXCu composite solder joints, indicating that the Sn3.5AgXCu composite solder joints had a lower diffusion coefficient. This signified that the presence of TiO2 nanoparticles was effective in retarding the growth of the overall IMC layer"
Solder-free Connectors Designed for LED Arrays
EDNAsia.com: "Molex Inc.’s solderless LED Array Holders for Cree’s energy-efficient XLamp MP-L and CXA2011 arrays feature compression contacts that power the arrays while eliminating the need for hand soldering or expensive SMT equipment. The holders also provide a stable connection in high-ambient temperature.
Ideal for light fixture OEMs, the LED Array Holders simplify the design and assembly process by using only two screws to secure the connector to the LED and thermal interface. Utilizing the Molded Interconnect Device (MID) technology, the holders allow the MP-L LEDs to be powered in either series or parallel, providing two options for Cree OEMs: high-voltage series wiring for lamp applications and low-voltage parallel wiring for fixtures."
Ideal for light fixture OEMs, the LED Array Holders simplify the design and assembly process by using only two screws to secure the connector to the LED and thermal interface. Utilizing the Molded Interconnect Device (MID) technology, the holders allow the MP-L LEDs to be powered in either series or parallel, providing two options for Cree OEMs: high-voltage series wiring for lamp applications and low-voltage parallel wiring for fixtures."
EU intensifies crackdown on hazardous electronics
BusinessGreen: "However, green groups have long argued the RoHS was too narrowly focused on IT equipment and household appliances, and as a result the EU moved in 2008 to revise the directive to cover a wider range of electronic devices and equipment, including thermostats, medical devices, control panels, cables, and spare parts.
The new rules were agreed between the European Parliament and the European Council last year and formally come into effect from today, giving Member States 18 months to pass the revised directive into national law."
The new rules were agreed between the European Parliament and the European Council last year and formally come into effect from today, giving Member States 18 months to pass the revised directive into national law."
Ishihara Chemical to Establish New Plant for Electronic Materials
Factiva: "Ishihara Chemical has made a decision to build a new production plant for electronic materials, probably on land acquired on the outskirts of Kobe, and will determine the plant's output capacity during this fiscal year. It will also funnel R&D investment into the setting up of a laboratory in the plant for the development of new products to foster its electronic materials into a core business.
The company produces primarily metal-surface finishing agents, such as tin and tin-alloy solder plating solutions"
The company produces primarily metal-surface finishing agents, such as tin and tin-alloy solder plating solutions"
Atotech Licenses Enthone Immersion Tin Tech Patent
PCB007: "Enthone Inc., a business of Cookson Electronics has granted Atotech Deutschland GmbH (Berlin, Germany) a license under an immersion tin patent (U.S. Patent Number No. 6,821,323). The Enthone patent encompasses technology that mitigates the propensity for whisker growth.
The Enthone immersion tin patent allows the use of metals, such as silver, to be incorporated within the tin process solution. The patent is registered and valid in Europe, Asia and the United States. Terms of the license agreement remain confidential.
Dr. Bernhard Wessling, Enthone Global Director ORMECON Products, said, “The Enthone patent being licensed to Atotech is not used in the formulation of the industry’s leading ORMECON CSN Classic immersion tin process for printed wiring board (PWB) fabrication. Instead, a distinctive Organic Metal technology is employed within the pre-dip process that appears to induce the formation of relatively large grain tin deposits and reduce the rate of IMC formation, thus rendering the immersion tin deposit whisker resistant."
The Enthone immersion tin patent allows the use of metals, such as silver, to be incorporated within the tin process solution. The patent is registered and valid in Europe, Asia and the United States. Terms of the license agreement remain confidential.
Dr. Bernhard Wessling, Enthone Global Director ORMECON Products, said, “The Enthone patent being licensed to Atotech is not used in the formulation of the industry’s leading ORMECON CSN Classic immersion tin process for printed wiring board (PWB) fabrication. Instead, a distinctive Organic Metal technology is employed within the pre-dip process that appears to induce the formation of relatively large grain tin deposits and reduce the rate of IMC formation, thus rendering the immersion tin deposit whisker resistant."
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