IPC Tin Whiskers Conference: Real-world examples will be used to illustrate causes of growth, risk mitigation and materials perspective, methods for detection and failure analysis. Explore the full range of tin whiskers theory and practice in every market sector: military/aerospace, automotive and consumer electronics.
Technical Conference: April 18–19
Fort Worth Texas
Friday, March 30, 2012
IMAPS MinaPad 2012
Next events: Micro/Nano-Electronics Packaging and Assembly Design and Manufacturing Forum
MiNaPAD gathered 200 international participants. The exhibition hall was fully booked with 30 booths and the 35 technical presentations were unanimously hailed as "world standard quality". We therefore decided to host a second edition and we are proud to invite you to participate actively to MiNaPAD 2012 on April 24-26 in Grenoble-France.
MiNaPAD gathered 200 international participants. The exhibition hall was fully booked with 30 booths and the 35 technical presentations were unanimously hailed as "world standard quality". We therefore decided to host a second edition and we are proud to invite you to participate actively to MiNaPAD 2012 on April 24-26 in Grenoble-France.
Shanghai NEPCON hand soldering competition
Google Translate: 2012 IPC manual welding competition OK International Cup contest will be April 25 to 27, the first division in Shanghai NEPCON show kicked off the East China Shanghai Division, sponsored by OK International portrait!
As of March 30, 2012, has 24 well-known enterprises to join, registration is extremely strong! There are 10 companies participating places, rushed to register, filled up the newspaper!
Sub-division of the top three winners will receive round-trip ticket sponsorship, gathered in Shenzhen compete IPC manual welding contest the finals of the Year crown in the end of November 2012, runners-up!
The 2012 champion, will bring the 2nd Annual Winner: CAS Changchun Institute of Optics and Precision Machinery and Institute of Physics, Wang He (2010 champion) and the 8357 Institute of China Aerospace Science and Engineering Group Institute of Chen's (2011 champion) , on behalf of the majority of electronics associated workers to participate in the championship organized by the IPC APEX exhibition in San Diego in February 2013 the international manual welding, a world-class match-ups from the United States, Europe, Malaysia, India's annual championship.
Match official website Website: http://www.ipc.org.cn/Events/Hand-Soldering-Competition/2012/index.htm
East Division Information:
Time: April 25, 2011 to 27
Location: Shanghai World Expo Exhibition - NEPCON exhibition
Organizer: IPC-International Association Connecting Electronics Industries, Reed Exhibitions Reed Exhibitions Group
Registration Hotline: IPC China, Shen Yi-chun ,021 -54,973,435
Registration E-mail: bdachina@ipc.org
Online Online registration: http://www.ipc.org.cn/Events/Hand-Soldering-Competition/2012/register.htm
East China Shanghai Division have signed up as follows (the order in alphabetical order)
Shanghai Jabil, Jabil Wuxi, Nanjing the Tongchuang electronic information equipment manufacturing Co., Ltd., Lever Tech, Kunshan Wistron InfoComm, Norautron suzhou, Changzhou CREATION, China Aviation Industry Institute of Radio Electronics, 14 of the China Electronics Technology Group Company Institute Compal Electronics Technology (Kunshan) Co., Ltd., Huai'an College of Information Technology, Benchmark Electronics (Suzhou) Technology Co., Ltd., universally Electronics (Kunshan) Co., Ltd., Shanghai Railway Communication Co., Ltd., China Aviation Industry Aviation Power Control Systems Research Institute, Tong Fang Electronic Technology Co., Ltd., Suzhou NTT Electronics Integrated Manufacturing Services Limited, synchronous Electronics Manufacturing Co., Ltd. in Wuxi City, Wangyal core Microelectronics Co., Ltd., Nanjing Ericsson Panda Communications Company Ltd., China high-Science and Technology of Suzhou (Suzhou) limited Corporation, Guodian Nanjing Automation Co., Ltd. Oulang Technology (Suzhou) Co., Ltd., Shanghai Aerospace Electronics Co., Ltd. 539, Tian Tong Technology Co., Ltd. of Zhejiang Varitronix, Wuxi Green safety equipment Co., Ltd.
2012 Sponsors of the tournament:
Division of Shanghai, Beijing, Chengdu and the main sponsor of the final year: OK International
The main sponsor of the Shenzhen Division: Changzhou crack Electronic Equipment Co., Ltd.,
Solder exclusive sponsor: Cookson, Electronics, Ltd. - Alpha Metals
The testing equipment is the exclusive sponsor: Kunshan Scienscope Optoelectronics Technology Co., Ltd.
Bind IPC meager, we will be on hand for your live events progress. Become a meager 500, 800 and 1000 fans, I will send IPC custom digital photo frame a not Come interactive! ! !
Sina: http://weibo.com/ipcchina
As of March 30, 2012, has 24 well-known enterprises to join, registration is extremely strong! There are 10 companies participating places, rushed to register, filled up the newspaper!
Sub-division of the top three winners will receive round-trip ticket sponsorship, gathered in Shenzhen compete IPC manual welding contest the finals of the Year crown in the end of November 2012, runners-up!
The 2012 champion, will bring the 2nd Annual Winner: CAS Changchun Institute of Optics and Precision Machinery and Institute of Physics, Wang He (2010 champion) and the 8357 Institute of China Aerospace Science and Engineering Group Institute of Chen's (2011 champion) , on behalf of the majority of electronics associated workers to participate in the championship organized by the IPC APEX exhibition in San Diego in February 2013 the international manual welding, a world-class match-ups from the United States, Europe, Malaysia, India's annual championship.
Match official website Website: http://www.ipc.org.cn/Events/Hand-Soldering-Competition/2012/index.htm
East Division Information:
Time: April 25, 2011 to 27
Location: Shanghai World Expo Exhibition - NEPCON exhibition
Organizer: IPC-International Association Connecting Electronics Industries, Reed Exhibitions Reed Exhibitions Group
Registration Hotline: IPC China, Shen Yi-chun ,021 -54,973,435
Registration E-mail: bdachina@ipc.org
Online Online registration: http://www.ipc.org.cn/Events/Hand-Soldering-Competition/2012/register.htm
East China Shanghai Division have signed up as follows (the order in alphabetical order)
Shanghai Jabil, Jabil Wuxi, Nanjing the Tongchuang electronic information equipment manufacturing Co., Ltd., Lever Tech, Kunshan Wistron InfoComm, Norautron suzhou, Changzhou CREATION, China Aviation Industry Institute of Radio Electronics, 14 of the China Electronics Technology Group Company Institute Compal Electronics Technology (Kunshan) Co., Ltd., Huai'an College of Information Technology, Benchmark Electronics (Suzhou) Technology Co., Ltd., universally Electronics (Kunshan) Co., Ltd., Shanghai Railway Communication Co., Ltd., China Aviation Industry Aviation Power Control Systems Research Institute, Tong Fang Electronic Technology Co., Ltd., Suzhou NTT Electronics Integrated Manufacturing Services Limited, synchronous Electronics Manufacturing Co., Ltd. in Wuxi City, Wangyal core Microelectronics Co., Ltd., Nanjing Ericsson Panda Communications Company Ltd., China high-Science and Technology of Suzhou (Suzhou) limited Corporation, Guodian Nanjing Automation Co., Ltd. Oulang Technology (Suzhou) Co., Ltd., Shanghai Aerospace Electronics Co., Ltd. 539, Tian Tong Technology Co., Ltd. of Zhejiang Varitronix, Wuxi Green safety equipment Co., Ltd.
2012 Sponsors of the tournament:
Division of Shanghai, Beijing, Chengdu and the main sponsor of the final year: OK International
The main sponsor of the Shenzhen Division: Changzhou crack Electronic Equipment Co., Ltd.,
Solder exclusive sponsor: Cookson, Electronics, Ltd. - Alpha Metals
The testing equipment is the exclusive sponsor: Kunshan Scienscope Optoelectronics Technology Co., Ltd.
Bind IPC meager, we will be on hand for your live events progress. Become a meager 500, 800 and 1000 fans, I will send IPC custom digital photo frame a not Come interactive! ! !
Sina: http://weibo.com/ipcchina
Wednesday, March 28, 2012
Monday, March 26, 2012
China Becomes the Hot Spot for Global Electronics Manufacturing Giants
EMSNow: According to the statistics released by the Ministry of Industry and Information Technology, the main business revenue of China's electronic information manufacturing enterprises above designated size in 2011 achieved RMB7490.9 billion Yuan, a year-on-year growth of 17.1 percent. Going through the global financial crisis, China is making steady progress in its electronics manufacturing industry scale
Through continuous development and optimization, Air Products' Inert Wave Soldering Technology Gen II enables customers to reduce manufacturing and material costs, including reduced nitrogen flow rates; significantly increase soldering joint quality; and transition to lead-free soldering technology with minimal effort, addressing the major issues faced by the electronics assembly and packaging industry.
This technology proven to be cost-effective: Saving up to20-40% of solder consumption, reduction up to 60-90 % in dross formation, reduction up to 10-30% of flux volume per board consumption, reduction up to 70-80% in equipment maintenance, reduction in soldering defects and rework, and easier post-soldering cleaning.
Through continuous development and optimization, Air Products' Inert Wave Soldering Technology Gen II enables customers to reduce manufacturing and material costs, including reduced nitrogen flow rates; significantly increase soldering joint quality; and transition to lead-free soldering technology with minimal effort, addressing the major issues faced by the electronics assembly and packaging industry.
This technology proven to be cost-effective: Saving up to20-40% of solder consumption, reduction up to 60-90 % in dross formation, reduction up to 10-30% of flux volume per board consumption, reduction up to 70-80% in equipment maintenance, reduction in soldering defects and rework, and easier post-soldering cleaning.
Friday, March 23, 2012
Lead-Free Assembly: Can We Achieve Consensus?
Variable melting point solders
Espacenet: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder
US2012055586 (A1) - VARIABLE MELTING POINT SOLDERS
Inventor(s): MCISAAC DOUGLAS J [CA]; WHITNEY MARK A [CA]; CORBIN STEPHEN F [CA] +
Applicant(s): DYNAJOIN CORP [CA] +
US2012055586 (A1) - VARIABLE MELTING POINT SOLDERS
Inventor(s): MCISAAC DOUGLAS J [CA]; WHITNEY MARK A [CA]; CORBIN STEPHEN F [CA] +
Applicant(s): DYNAJOIN CORP [CA] +
Green Data Exchange Content Surpasses 1 Million Parts
EMSNow: Q Point Technology has announced that content in Green Data Exchange (GDX) now texceeds 1 million items. GDX users have access to the entire repository of shared parts and assemblies. Data includes RoHS, REACH, full substance disclosure, and supporting documentation, such as test reports and declarations of conformance. The growth in content increases the availability of compliance information and further reduces the cost of compliance.
GDX serves as he compliance technical data file, allowing product manufacturers to maintain current compliance data for all their products and assemblies. As an online exchange, suppliers can access the system at no cost, and provide declaration data that can be shared with the supply chain. Maintaining information is dramatically simplified, as suppliers can update information in one place, and subsequently all customers automatically have access to updated data. GDX reduces the supplier burden of managing numerous individual information requests, including repeat requests for compliance updates.
GDX serves as he compliance technical data file, allowing product manufacturers to maintain current compliance data for all their products and assemblies. As an online exchange, suppliers can access the system at no cost, and provide declaration data that can be shared with the supply chain. Maintaining information is dramatically simplified, as suppliers can update information in one place, and subsequently all customers automatically have access to updated data. GDX reduces the supplier burden of managing numerous individual information requests, including repeat requests for compliance updates.
The Future of Solder Materials
SMTONLINE: Dr. Ning-Cheng Lee of Indium Corporation and Guest Editor Dr. Jennie S. Hwang discuss lead-free solder development on the show floor at IPC APEX EXPO 2012, as well as the future requirements of lead-free materials.
Andy - this is an important interview and would be good to summarise in a news item.
Note for example the discussion of 'Beyond Solder' at he end...
Video
Andy - this is an important interview and would be good to summarise in a news item.
Note for example the discussion of 'Beyond Solder' at he end...
Video
Brookhaven National Laboratory Report Recent Findings in Nanosolders
Factiva: According to the authors of recent research published in the journal Materials Science and Engineering B-Advanced Functional Solid-State Materials, "Development of a Pb-free Sn nanosolder paste with an initial melting temperature near or below the melting temperature of eutectic Sn-Pb solder (183 degrees C) has been investigated using the size-dependent melting behavior of small particles."
"Three to five nanometer Sn nanoparticles were fabricated by sonochemical reduction and observed to melt at temperatures near or below 183 degrees C. Prototype nanosolder pastes were produced by combining the nanoparticles with flux and were characterized by differential scanning calorimetry (DSC) in terms of their melting, solidification, coalescence, and metal particle loading properties," wrote J.P. Koppes and colleagues, Brookhaven National Laboratory.
The researchers concluded: "The results indicate that, although target melting temperatures were achieved, nanoparticle coalescence was limited by low volume loading of the metal, due in part to the capping layer (an organic layer adsorbed on the metal surface during chemical synthesis)."
"Three to five nanometer Sn nanoparticles were fabricated by sonochemical reduction and observed to melt at temperatures near or below 183 degrees C. Prototype nanosolder pastes were produced by combining the nanoparticles with flux and were characterized by differential scanning calorimetry (DSC) in terms of their melting, solidification, coalescence, and metal particle loading properties," wrote J.P. Koppes and colleagues, Brookhaven National Laboratory.
The researchers concluded: "The results indicate that, although target melting temperatures were achieved, nanoparticle coalescence was limited by low volume loading of the metal, due in part to the capping layer (an organic layer adsorbed on the metal surface during chemical synthesis)."
Koppes and colleagues published their study in Materials Science and Engineering B-Advanced Functional Solid-State Materials (Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder. Materials Science and Engineering B-Advanced Functional Solid-State Materials, 2012;177(2):197-204).
For additional information, contact J.P. Koppes, Brookhaven Natl Lab, Center Funct Nanomat, Electron Microscope Grp, Upton, NY 11973, United States.
Microstructure and properties of SnAgCu-xPr solder
Scopus: The effect of different Pr additions (0, 0.05, 0.5wt.%) on the solidification behavior, spreading property and microstructures of Sn-3.8Ag-0.7Cu (SAC) solder were investigated. The results showed that the undercooling of SAC, SAC-0.05Pr and SAC-0.5Pr solder in solidification were 23.2, 7 and 8.6 'C respectively which indicated that the proper content of Pr addition could obviously decrease the undercooling of SAC solder. Meanwhile, with Pr addition, the microstructure of SAC solder was improved and the primary Ag 3Sn plate in SAC/Cu solder joint was restrained. Moreover, the SAC-0.05Pr solder has the best wetting property and microstructure; when the Pr addition was up to 0.5 wt%, PrSn 3 phase with large size formed in solder would deteriorate the property of SAC solder joint.
Hanjie Xuebao/Transactions of the China Welding Institution
Volume 33, Issue 1, January 2012, Pages 69-72
Microstructure and properties of SnAgCu-xPr solder
Gao, L.,Xue, S. ,Xu, H.
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Hanjie Xuebao/Transactions of the China Welding Institution
Volume 33, Issue 1, January 2012, Pages 69-72
Microstructure and properties of SnAgCu-xPr solder
Gao, L.,Xue, S. ,Xu, H.
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests
Scopus: Many lead-free solder alloys have been proposed as alternatives to the conventional eutectic Sn-37wt%Pb (SnPb). This replacement induces the drop/impact reliability issues of portable products. Under the drop/impact loading, the main failure mode is interfacial brittle failure between lead-free solder joints and intermetallic compound (IMC) layer. The identification of failure mechanism in the solder joint under drop test becomes a very critical issue. In this paper, a finite element analysis of BGA assembly with lead-free solder joints is conducted to investigate IMC interfacial stresses under repetitive mechanical drops. For the two drop conditions of concern, the dominant strain rates for the solder joints are studied. The results indicate that the stress on the PCB side is larger than that on the package side in both the solder and the IMC. After multiple drops, the stress in the IMC gradually increases due to the strain hardening effect of the solder. During the repetitive drop tests, the increasing stress will eventually exceed the strength of IMC and leads to the brittle fracture of solder joint. The findings in the present study result in a better understanding in the failure mechanism of solder joint under repetitive mechanical drop tests
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
2011, Article number 6142381
18th European Microelectronics and Packaging Conference, EMPC-2011;Brighton;12 September 2011through15 September 2011;Code88684
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests ( Conference Paper )
Jiang, T.,Zhengjian, X.,Lee, S.W.R.,Song, F.,Lo, J.C.C.,Yang, C.
Electronic Packaging Laboratory, Center for Advanced Microsystems Packaging, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
2011, Article number 6142381
18th European Microelectronics and Packaging Conference, EMPC-2011;Brighton;12 September 2011through15 September 2011;Code88684
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests ( Conference Paper )
Jiang, T.,Zhengjian, X.,Lee, S.W.R.,Song, F.,Lo, J.C.C.,Yang, C.
Electronic Packaging Laboratory, Center for Advanced Microsystems Packaging, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
Scopus: The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.
Scripta Materialia
Volume 66, Issue 8, April 2012, Pages 586-589
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
Yazzie, K.E.,Xie, H.X.,Williams, J.J.,Chawla, N.
Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, AZ 85287-6106, United States
Scripta Materialia
Volume 66, Issue 8, April 2012, Pages 586-589
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints
Yazzie, K.E.,Xie, H.X.,Williams, J.J.,Chawla, N.
Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, AZ 85287-6106, United States
Effects of Ti addition to Sn-Ag and Sn-Cu solders
Scopus: Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn-Cu and Sn-Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions
Journal of Alloys and Compounds
Volume 520, 15 April 2012, Pages 244-249
Effects of Ti addition to Sn-Ag and Sn-Cu solders
Chen, W.M.a,Kang, S.K.b,Kao, C.R.a
a Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
b IBM T. J. Watson Research Center, Yorktown Heights, NY, United States
Journal of Alloys and Compounds
Volume 520, 15 April 2012, Pages 244-249
Effects of Ti addition to Sn-Ag and Sn-Cu solders
Chen, W.M.a,Kang, S.K.b,Kao, C.R.a
a Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
b IBM T. J. Watson Research Center, Yorktown Heights, NY, United States
IPC Updates Assembly and Joining Handbook
SMTONLINE: For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB. With input from leading OEMs and research facilities, the recently released “A” revision of this industry handbook contains updated information on proven techniques for the assembly and soldering of electronic assemblies.
“IPC-AJ-820A covers 14 topics in 289 pages, addressing everything from handling to design to component selection and soldering,” says Kris Roberson, IPC assembly technology manager. “The handbook gives users basic data such as terms and definitions as well as the technical, more nitty-gritty, down-and-dirty information.”
With no shortage of in-depth information, the handbook includes equations for designers as well as techniques for tin whisker mitigation. A section titled “tin pest” explains how parts with high tin content can break down to powder under certain conditions.
“IPC-AJ-820A covers 14 topics in 289 pages, addressing everything from handling to design to component selection and soldering,” says Kris Roberson, IPC assembly technology manager. “The handbook gives users basic data such as terms and definitions as well as the technical, more nitty-gritty, down-and-dirty information.”
With no shortage of in-depth information, the handbook includes equations for designers as well as techniques for tin whisker mitigation. A section titled “tin pest” explains how parts with high tin content can break down to powder under certain conditions.
The constitutive response of three solder materials
Scopus: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196'C to 60'C) and strain rate (10 -3 to >10 3s -1). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature
Journal of Alloys and Compounds
Volume 524, Issue 6, 2012, Pages 32-37
The constitutive response of three solder materials ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Perez-Bergquist, A.G.a ,Cao, F.b,Perez-Bergquist, S.J.a,Lopez, M.F.a,Trujillo, C.P.a,Cerreta, E.K.a,Gray, G.T.a
a Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545, USA
b Exxon Mobil Research and Engineering Company, Annadale, NJ 08801, USA
Journal of Alloys and Compounds
Volume 524, Issue 6, 2012, Pages 32-37
The constitutive response of three solder materials ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Perez-Bergquist, A.G.a ,Cao, F.b,Perez-Bergquist, S.J.a,Lopez, M.F.a,Trujillo, C.P.a,Cerreta, E.K.a,Gray, G.T.a
a Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545, USA
b Exxon Mobil Research and Engineering Company, Annadale, NJ 08801, USA
Thermochemical and phase diagram studies of the Bi-Ni-Sn system
Scopus: The phase diagram Bi-Ni-Sn was studied by means of SEM (scanning electron microscopy)/EDS (energy-dispersive solid state spectrometry), by DSC (differential scanning calorimetry) and RT-XRD (room temperature X-Ray diffraction) in order to attain more information about this ternary phase diagram. The samples were positioned in three isopleths with nickel contents of: 0.05 (section 1), 0.10 (section 2) and 0.15 (section 3) mole fractions, respectively. The mole fractions of Sn corresponding to the particular sections were as follows: from 0.19 to 0.76 (section 1), from 0.18 to 0.72 (section 2); from 0.17 to 0.68 (section 3). Mixtures of pure metals were sealed under vacuum in amorphous silica ampoules and annealed at 350 C. A binary Bi-Sn eutectic sample was synthesized and used as internal standard. The existence of a previously reported ternary eutectic reaction was confirmed. Liquidus temperatures were identified and the results were compared to CALPHAD-type calculations. It was found that ternary samples' liquidus temperatures were higher than the calculated ones. Six more groups of thermal arrests were registered except the eutectic and liquidus related peaks.
Thermochimica Acta
Thermochemical and phase diagram studies of the Bi-Ni-Sn system ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Milcheva, N.a,Broz, P.bc,BurÅ¡Ãk, J.d,Vassilev, G.P.a
a Faculty of Chemistry, University of Plovdiv, 24 Tsar Asen str., 4000 Plovdiv, Bulgaria
b Masaryk University, Faculty of Science, Kotlářská 2, 61137 Brno, Czech Republic
c Masaryk University, Central European Institute of Technology, CEITEC, Kamenice 753/5, 625 00, Brno, Czech Republic
d Institute of Physics of Materials, Academy of Sciences, Žižkova 22, 61662 Brno, Czech Republic
Thermochimica Acta
Thermochemical and phase diagram studies of the Bi-Ni-Sn system ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Milcheva, N.a,Broz, P.bc,BurÅ¡Ãk, J.d,Vassilev, G.P.a
a Faculty of Chemistry, University of Plovdiv, 24 Tsar Asen str., 4000 Plovdiv, Bulgaria
b Masaryk University, Faculty of Science, Kotlářská 2, 61137 Brno, Czech Republic
c Masaryk University, Central European Institute of Technology, CEITEC, Kamenice 753/5, 625 00, Brno, Czech Republic
d Institute of Physics of Materials, Academy of Sciences, Žižkova 22, 61662 Brno, Czech Republic
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders
Scopus : The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica nanoparticles in the 100 nm range coated with 2 nm to 3 nm of gold can be dispersed within solders during the normal reflow soldering process, and that these particles are effective in hardening the solder and restricting dynamic grain growth during compression testing at low homologous temperature. As the homologous temperature increases towards 0.75, the effects of the nanoparticles on both mechanical properties and dynamical grain growth reduce, and by homologous temperatures of 0.86 the effects have completely disappeared. This behavior is explained by introducing the concept of an effective volume fraction of pinning nanoparticles, and the practical implications for using nanoparticles to control solder properties via Zener pinning at high homologous temperatures are discussed.
Journal of Electronic Materials
2012, Pages 1-8
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Mokhtari, O.a ,Roshanghias, A.b,Ashayer, R.a,Kotadia, H.R.c,Khomamizadeh, F.b,Kokabi, A.H.b,Clode, M.P.a,Miodownik, M.c,Mannan, S.H.c
a Materials Research Group, Division of Engineering, King's College London, London, WC2R 2LS, United Kingdom
b Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
c Department of Physics, King's College London, Strand, London, WC2R 2LS, United Kingdom
Journal of Electronic Materials
2012, Pages 1-8
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Mokhtari, O.a ,Roshanghias, A.b,Ashayer, R.a,Kotadia, H.R.c,Khomamizadeh, F.b,Kokabi, A.H.b,Clode, M.P.a,Miodownik, M.c,Mannan, S.H.c
a Materials Research Group, Division of Engineering, King's College London, London, WC2R 2LS, United Kingdom
b Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
c Department of Physics, King's College London, Strand, London, WC2R 2LS, United Kingdom
AIM to Present Paper on Lead-Free Alloy Development at ICSR 2012
AZom: This conference will happen at the Crowne Plaza Toronto Airport Hotel in Canada, from 16 to 18 May, 2012. The presentation will be on “Lead-Free Alloy Development”.
This paper aims to examine various factors related to the alloy families, including non-silver and low silver. These factors are utilization of these replacement alloys in solder paste for fixing a component, and an evaluation of the alloys’ paste medium chemistries and its impact on assemble performance. This paper categorizes these alloys in terms of thermal shock and drop shock risks. HiP mitigation, voiding and wetting are the other significant features that will be presented in the conference.
Several technical papers have been written and presented by Karl. The topics of those papers include no-clean flux technology, lead-free electronics assembly, process optimization and assembly, metallurgical studies, and inspection. He is the IPC Solder Products Value Council’s Chairman and is involved in the expansion of the specifications of the material, under IPC. He has obtained many patents in soldering technology that contains four solder alloys, free from lead.
This paper aims to examine various factors related to the alloy families, including non-silver and low silver. These factors are utilization of these replacement alloys in solder paste for fixing a component, and an evaluation of the alloys’ paste medium chemistries and its impact on assemble performance. This paper categorizes these alloys in terms of thermal shock and drop shock risks. HiP mitigation, voiding and wetting are the other significant features that will be presented in the conference.
Several technical papers have been written and presented by Karl. The topics of those papers include no-clean flux technology, lead-free electronics assembly, process optimization and assembly, metallurgical studies, and inspection. He is the IPC Solder Products Value Council’s Chairman and is involved in the expansion of the specifications of the material, under IPC. He has obtained many patents in soldering technology that contains four solder alloys, free from lead.
Electrically Conductive Adhesive from Henkel Compatible with Multiple Metals
EMSNow: Leveraging research regarding contact resistance performance, Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material’s advantages to multiple applications. The adhesive system, HYSOL ECCOBOND CE 3103WLV, provides exceptional contact resistance stability on surfaces such as OSP copper and Sn alloys– metals which have previously been challenging for ECAs
ECAs have been used for high-reliability applications such as automotive, medical and telecom products for some time, as they offer lower temperature processing, fine-pitch capability and improved thermal cycling resistance. With these applications, ECAs have most often been employed on devices with noble metallizations such as gold, silver, palladium and even ceramic substrates but have had limited success on common electronic metals such as copper and Sn alloys. Technical research conducted by Henkel, however, has revealed that electrochemical corrosion of these metals under elevated temperature and humidity is the root cause of the unstable contact resistance and, using this understanding as a foundation, Henkel developed HYSOL ECCOBOND CE 3103WLV to overcome these issues and deliver multi-metal compatibility.
The material has been incorporated into a variety of applications and, most recently, optical technology powerhouse, LensVector, has selected HYSOL ECCOBOND CE 3103WLV for use with its AutoFocus (LVAF) product. The LVAF is the world’s smallest autofocus device, which uses a unique patented technology to transform a single liquid crystal cell into a variable focus lens which can then be integrated by camera module manufacturers to deliver autofocus capability.
LensVector’s Vice-President of Engineering, Bahram Afshari, explains the demanding requirements of its product and why the company partnered with Henkel. "Not only do the contacts between the LVAF and the main module serve to make the electrical connections, but must also meet the challenging reliability requirements for camera phones, notebook computers and other handheld consumer electronic devices that incorporate these modules," says Afshari. "HYSOL ECCOBOND CE 3103WLV delivers the electrical conductivity and reliability performance in an easily dispensed, high-yield, low- temperature cure ECA. In fact, the cure temperature is well below most traditional ECAs, which gives us added process and module material selection flexibility."
ECAs have been used for high-reliability applications such as automotive, medical and telecom products for some time, as they offer lower temperature processing, fine-pitch capability and improved thermal cycling resistance. With these applications, ECAs have most often been employed on devices with noble metallizations such as gold, silver, palladium and even ceramic substrates but have had limited success on common electronic metals such as copper and Sn alloys. Technical research conducted by Henkel, however, has revealed that electrochemical corrosion of these metals under elevated temperature and humidity is the root cause of the unstable contact resistance and, using this understanding as a foundation, Henkel developed HYSOL ECCOBOND CE 3103WLV to overcome these issues and deliver multi-metal compatibility.
The material has been incorporated into a variety of applications and, most recently, optical technology powerhouse, LensVector, has selected HYSOL ECCOBOND CE 3103WLV for use with its AutoFocus (LVAF) product. The LVAF is the world’s smallest autofocus device, which uses a unique patented technology to transform a single liquid crystal cell into a variable focus lens which can then be integrated by camera module manufacturers to deliver autofocus capability.
LensVector’s Vice-President of Engineering, Bahram Afshari, explains the demanding requirements of its product and why the company partnered with Henkel. "Not only do the contacts between the LVAF and the main module serve to make the electrical connections, but must also meet the challenging reliability requirements for camera phones, notebook computers and other handheld consumer electronic devices that incorporate these modules," says Afshari. "HYSOL ECCOBOND CE 3103WLV delivers the electrical conductivity and reliability performance in an easily dispensed, high-yield, low- temperature cure ECA. In fact, the cure temperature is well below most traditional ECAs, which gives us added process and module material selection flexibility."
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
Scopus The shear force and failure behaviors of the Sn-58Bi epoxy solder joints with various surface finishes under the high-speed shear test were investigated. The relationships between the shear speed, shear force, and fracture mode are elucidated in this study. The shear force of the Sn-58Bi solder joints increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloys. Brittle interfacial fractures were more easily achieved at higher shear speed in the high-speed shear test. This result was discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect, and the resulting stress concentration in the interfacial regions. The fracture mode changed from ductile solder fracture to brittle interfacial fracture with increasing shear speed. On the other hand, the different surface finish materials did not affect the shear force and fracture mode of the Sn-58Bi solder joints under high-speed shear loading
Journal of Materials Science: Materials in Electronics
2012, Pages 1-6
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Cho, I.a,Ahn, J.-H.b,Yoon, J.-W.b,Shin, Y.-E.c ,Jung, S.-B.b
a Productivity Research Institute, LG Electronics Inc., 19-1, Cheongho-ri, Jinwi-myeon, Pyeongtaek-si, 451-713, South Korea
b School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, 440-746, South Korea
c School of Mechanical Engineering, Chung-Ang University, 221 Heuksuk-dong, Dongjak-gu, 156-756, South Korea
Journal of Materials Science: Materials in Electronics
2012, Pages 1-6
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Cho, I.a,Ahn, J.-H.b,Yoon, J.-W.b,Shin, Y.-E.c ,Jung, S.-B.b
a Productivity Research Institute, LG Electronics Inc., 19-1, Cheongho-ri, Jinwi-myeon, Pyeongtaek-si, 451-713, South Korea
b School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, 440-746, South Korea
c School of Mechanical Engineering, Chung-Ang University, 221 Heuksuk-dong, Dongjak-gu, 156-756, South Korea
Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al
Scopus: Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic (T eut = 217'C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly.
This work investigated minor substitutional additions of Al (<0.25 wt.%) to Sn-3.5Ag-0.95Cu (SAC3595) solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag 3Sn "blades," for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2-μm to 5-μm faceted Cu-Al particles, identified as Cu 33Al 17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness.
Clustering of Cu 33Al 17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface.
Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance
Journal of Electronic Materials
2012, Pages 1-14
Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Boesenberg, A.J.b ,Anderson, I.E.a ,Harringa, J.L.a
a Ames Laboratory (USDOE), Iowa State University, Ames, United States
b Iowa State University, Ames, United States
This work investigated minor substitutional additions of Al (<0.25 wt.%) to Sn-3.5Ag-0.95Cu (SAC3595) solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag 3Sn "blades," for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2-μm to 5-μm faceted Cu-Al particles, identified as Cu 33Al 17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness.
Clustering of Cu 33Al 17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface.
Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance
Journal of Electronic Materials
2012, Pages 1-14
Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Boesenberg, A.J.b ,Anderson, I.E.a ,Harringa, J.L.a
a Ames Laboratory (USDOE), Iowa State University, Ames, United States
b Iowa State University, Ames, United States
Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder
Scopus: In an effort to improve the performance of lead-free solder, Sn-3.5 wt.%Ag (Sn-3.5Ag) solder alloy with 0.03 wt.% carbon black was prepared under high pressure (5.5 GPa) and high temperature (1200'C). We have investigated the microstructure, melting behavior, and mechanical properties of the alloy using x-ray diffraction, differential scanning calorimetry (DSC), Vickers hardness testing, tensile testing, and scanning electron microscopy (SEM). The melting point was found to be unchanged, while the hardness and the tensile strength increased with the addition of carbon black. SEM images showed that the average thickness of the intermetallic compound (IMC) layer decreased with the addition of carbon black, indicating improvement in solder joint reliability
Journal of Electronic Materials
2012, Pages 1-5
Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Van Son, P.ab,Fujitsuka, A.a,Ohshima, K.-I.a
a Institute of Materials Science, University of Tsukuba, Tsukuba, 305-8573, Japan
b Department of Physics, Danang University of Education, 459 Ton Duc Thang, Danang, Viet Nam
Journal of Electronic Materials
2012, Pages 1-5
Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder ( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Van Son, P.ab,Fujitsuka, A.a,Ohshima, K.-I.a
a Institute of Materials Science, University of Tsukuba, Tsukuba, 305-8573, Japan
b Department of Physics, Danang University of Education, 459 Ton Duc Thang, Danang, Viet Nam
Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn-Ag-Cu solders
Scopus: In this paper, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) was incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. After that, the electrochemical behavior of Sn-Ag-Cu with varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) composite solder were investigated in 0.3% Na 2SO 4 solution by using potentiodynamic polarization method. Scanning microscopy was used to characterize the samples after the electrochemical tests. It was observed that the corrosion resistance decreased when the content of Ni-CNTs reached a certain level.
Advanced Materials Research
Volume 418-420, 2012, Pages 1171-1174
2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011;Guilin;16 December 2011through18 December 2011;Code87920
Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn-Ag-Cu solders ( Conference Paper )
Tang, S.a ,Jing, H.a ,Xu, L.a ,Han, Y.a ,Lu, G.ab
a School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
b Dept Mat Sci and Engn, Virginia Polytech Inst and State Univ, Blacksburg, VA 24061, United States
Advanced Materials Research
Volume 418-420, 2012, Pages 1171-1174
2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011;Guilin;16 December 2011through18 December 2011;Code87920
Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn-Ag-Cu solders ( Conference Paper )
Tang, S.a ,Jing, H.a ,Xu, L.a ,Han, Y.a ,Lu, G.ab
a School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
b Dept Mat Sci and Engn, Virginia Polytech Inst and State Univ, Blacksburg, VA 24061, United States
Developing a compliance system for RoHS2
Scopus: Directive 2011/65/EU, Restriction of Hazardous Substances (RoHS2), became European law on July 21, 2011. The law does not introduce new banned substances, but require manufacturers to follow specific obligations in Module A of decision 768/2008/EC, with a focus on technical documentation and product checks. The technical documentation package, as defined in Module A, must contain at least a general description of the product, design and manufacturing drawings of components and subassemblies, and describe the operation of the product. If the facility is building non-RoHS-compliant product or still using leaded solder, controls are required to eliminate the risk of cross-contamination. If dual, lead and lead-free, solder pastes are used, and the opportunity for cross-contamination is high, secondary green containers for lead-free are a good way to separate reused solder paste.
Printed Circuit Design and Fab/Circuits Assembly
Volume 29, Issue 2, February 2012, Pages 50-52
Developing a compliance system for RoHS2
Mazur, S.
Benchmark Electronics, United States
Printed Circuit Design and Fab/Circuits Assembly
Volume 29, Issue 2, February 2012, Pages 50-52
Developing a compliance system for RoHS2
Mazur, S.
Benchmark Electronics, United States
Improvement electromigration resistance of Pb-free solder joints with element addition
Scopus: Electromigration has become the most important concern for solder joint in electronic assembly. The solder joint durability under high current density stressing is highly dependent on the solder materials compositions. In this paper, the electromigration of five types of Sn based solder material were observed and compared.
The influence of elements addition on solder electromigration were investigated. The results indicated that intermetallic compounds (IMC) was formed near the cathode disappeared after electromigration tests, and the copper layer at the cathode was consumed significantly. A large amount of Cu 6Sn 5 IMC were observed at the anode of the solder interconnects. Considering the IMC layer thickness as a criterion of electromigration durability, Sn3.0Ag0.5Cu solder performed better than low-Ag solder.
By adding elements of Bi and Ni into the low-Ag solder, the solder microstructure were refined. The IMC accumulating near anode became thinner and electromigration resistance was improved significantly.
Hanjie Xuebao/Transactions of the China Welding Institution
Volume 33, Issue 2, February 2012, Pages 29-32
Wang, J. ,Sun, F. ,Liu, Y.
College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
The influence of elements addition on solder electromigration were investigated. The results indicated that intermetallic compounds (IMC) was formed near the cathode disappeared after electromigration tests, and the copper layer at the cathode was consumed significantly. A large amount of Cu 6Sn 5 IMC were observed at the anode of the solder interconnects. Considering the IMC layer thickness as a criterion of electromigration durability, Sn3.0Ag0.5Cu solder performed better than low-Ag solder.
By adding elements of Bi and Ni into the low-Ag solder, the solder microstructure were refined. The IMC accumulating near anode became thinner and electromigration resistance was improved significantly.
Hanjie Xuebao/Transactions of the China Welding Institution
Volume 33, Issue 2, February 2012, Pages 29-32
Wang, J. ,Sun, F. ,Liu, Y.
College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
The reliability of component boards studied with different shock impact repetition frequencies
Scopus: As a result of the ever-shortening time to market of new electronic products there is a clear need to make the currently employed reliability assessment procedures more efficient. However, while trying to achieve these cost savings it is important to pay attention to how much reliability tests can be accelerated without producing misleading lifetime statistics or irrelevant failure modes and mechanisms
Therefore, the primary objective of this work was to clarify the effects of impact repetition frequency on the lifetime and failure mechanisms of electronic component boards. The reliability assessments were conducted with four package types (BGA288, BGA144, QFN72, and μSMD36) with the intention of including different package dimensions and interconnection shapes and sizes in the scope of evaluation. Three shock impact repetition frequencies (0.01 Hz, 0.1 Hz, and 1.6 Hz) were used to study the sensitivity of their lifetime to the time between the shock impacts.
The results showed that the impact repetition frequency has a significant effect on the average lifetime of the studied packages: the average number of impacts-to-failure increased with increased impact repetition frequency. A change in the impact repetition frequency did not, however, change the primary failure mode and the failure mechanism. In order to explain this observation, the formation of residual stresses in the solder interconnections from shock impacts and their relaxation during the time between the shock impacts were evaluated by employing FEM, which showed that at room temperature the stress relaxation by creep of solder is significant even at less than 10 s time frame.
The effect of the stress relaxation on the lifetime of the component boards was studied experimentally by repeating the impact tests at elevated temperature with the intention of influencing rate of stress relaxation. The results showed that the relaxation of the residual stresses has a significant effect on the component boards shock reliability (at less than 1% risk level). The results presented in this paper indicate that the impact repetition frequency should be taken into account, especially when reliability assessments are being carried out with different testers, since the interval between the shock impacts varies from one test system to another
Microelectronics Reliability
2012
( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Hokka, J. ,Li, J.,Mattila, T.T.,Paulasto-Kröckel, M.
Department of Electronics, Aalto University, FI-00076 Aalto, Finland
Therefore, the primary objective of this work was to clarify the effects of impact repetition frequency on the lifetime and failure mechanisms of electronic component boards. The reliability assessments were conducted with four package types (BGA288, BGA144, QFN72, and μSMD36) with the intention of including different package dimensions and interconnection shapes and sizes in the scope of evaluation. Three shock impact repetition frequencies (0.01 Hz, 0.1 Hz, and 1.6 Hz) were used to study the sensitivity of their lifetime to the time between the shock impacts.
The results showed that the impact repetition frequency has a significant effect on the average lifetime of the studied packages: the average number of impacts-to-failure increased with increased impact repetition frequency. A change in the impact repetition frequency did not, however, change the primary failure mode and the failure mechanism. In order to explain this observation, the formation of residual stresses in the solder interconnections from shock impacts and their relaxation during the time between the shock impacts were evaluated by employing FEM, which showed that at room temperature the stress relaxation by creep of solder is significant even at less than 10 s time frame.
The effect of the stress relaxation on the lifetime of the component boards was studied experimentally by repeating the impact tests at elevated temperature with the intention of influencing rate of stress relaxation. The results showed that the relaxation of the residual stresses has a significant effect on the component boards shock reliability (at less than 1% risk level). The results presented in this paper indicate that the impact repetition frequency should be taken into account, especially when reliability assessments are being carried out with different testers, since the interval between the shock impacts varies from one test system to another
Microelectronics Reliability
2012
( Articles not published yet, but available online Article in press About articles in press (opens in a new window) )
Hokka, J. ,Li, J.,Mattila, T.T.,Paulasto-Kröckel, M.
Department of Electronics, Aalto University, FI-00076 Aalto, Finland
Thursday, March 22, 2012
Development of high-temperature solders: Review
Scopus: The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research on suitable replacement alloys, as well as traditional Pb-Sn alloys, collating relevant properties and identifying areas where further development is required. The main candidate alloys covered are derived from the Au-Sn, Au-Ge, Zn-Al, Zn-Sn, Bi-Ag and Sn-Sb alloy systems. Each of these systems is discussed with respect to the advantages and disadvantages associated with their use in soldering applications. It is concluded that further development of alloys suitable for high-temperature lead-free soldering applications is required
Microelectronics Reliability
2012
Zeng, G. ,McDonald, S.,Nogita, K.
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
Microelectronics Reliability
2012
Zeng, G. ,McDonald, S.,Nogita, K.
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
SMTA SouthEast Asia Technical Conference
Surface Mount Technology group Group News
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Sessions and topics in our 2012 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.
Soldering Processes and Materials
Soldering Challenges - Including Head in Pillow
Business and Supply Chain
Harsh Environments
Soldering - Through Hole Processes
Substrates and Printed Circuit Boards
Components and Advanced Packaging
April 18-20, Penang, Malaysia
The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
Sessions and topics in our 2012 program will focus on new processes and materials, reliability, cleaning challenges, harsh environment applications, advanced packaging to include package on package, process control and the latest developments in surface finishes.
Soldering Processes and Materials
Soldering Challenges - Including Head in Pillow
Business and Supply Chain
Harsh Environments
Soldering - Through Hole Processes
Substrates and Printed Circuit Boards
Components and Advanced Packaging
April 18-20, Penang, Malaysia
Tuesday, March 20, 2012
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder
ScienceDirect.comTo achieve the excellent wettability of a solder in an anisotropic conductive adhesive (ACA) in micro-packaging technology, not only the removal of the oxidized layer of the solder but also the chemo-rheological phenomena of the thermally induced self assembly of low-melting temperature solder powders were investigated for ACA applications. Both the optimum kind and amount of reductant were determined in this study to remove the oxidized layer formed on the solder surface in ambient environment. The solder wetting test was performed to observe the chemical and rheological compatibility between the solder, polymer matrix, and reductant. The thermal analysis was done using differential scanning calorimetry (DSC) analysis and rheometer test. Several chemical reactions by the reductant were proposed, and the mechanisms were postulated. It is believed that the reductant reacts with the oxidized layer, amine, and epoxide group, respectively. The relation between conversion and glass transition temperature of the polymer matrix was also obtained from DSC.
Microelectronic Engineering
Volume 87, Issue 10, October 2010, Pages 1968–1972
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder ☆
Ji-Won Baeka, b, Keon-Soo Janga, b, Yong-Sung Eoma, , , Jong-Tae Moona, Jong-Min Kimc, Jae-Do Namb, ,
a Next Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea
b Department of Polymer Science and Engineering, Sungkyunkwan University, Suwon, Republic of Korea
c Department of Mechanical Engineering, ChungAng University, Seoul, Republic of Korea
Received 23 July 2009. Revised 2 November 2009. Accepted 7 December 2009. Available online 29 December 2009
Microelectronic Engineering
Volume 87, Issue 10, October 2010, Pages 1968–1972
Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder ☆
Ji-Won Baeka, b, Keon-Soo Janga, b, Yong-Sung Eoma, , , Jong-Tae Moona, Jong-Min Kimc, Jae-Do Namb, ,
a Next Generation Packaging Team, Electronics and Telecommunications Research Institute, 161 Gajeong-dong, Yuseong-gu, Daejeon 305-700, Republic of Korea
b Department of Polymer Science and Engineering, Sungkyunkwan University, Suwon, Republic of Korea
c Department of Mechanical Engineering, ChungAng University, Seoul, Republic of Korea
Received 23 July 2009. Revised 2 November 2009. Accepted 7 December 2009. Available online 29 December 2009
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
ScienceDirect.com: A low viscosity epoxy resin with carboxylic acid-based novel reductants was introduced to improve the process ability and reliability of an anisotropic conductive adhesive (ACA) resin with a low melting point alloy (LMPA) filler system. The curing degree of the ACA resin and the melting of the LMPA filler were investigated using differential scanning calorimetry (DSC) conducted in the dynamic mode in order to control the curing conditions such as the reaction temperature and a melting temperature of solder. The temperature-dependent viscosity characteristics of the ACA resin were investigated using a rheometer. The compatibility between the viscosity of a polymer matrix and a melting temperature of solder was characterized to optimize the processing cycle. Three different types of carboxyl acid-based reductants were added to remove the oxide layer on the surfaces of the filler particles and the conductive pad. Good wetting properties were achieved between the LMPA filler and the Cu pad in the epoxy resin using these carboxylic acid-based reductants.
Microelectronics Reliability
Volume 50, Issue 2, February 2010, Pages 258–265
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
Hyomi Kima, Jongmin Kimb, Jooheon Kima, ,
a School of Chemical Engineering and Materials Science, Chung-Ang University, Seoul 156-756, Republic of Korea
b School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
Received 14 August 2009. Revised 28 October 2009. Available online 16 December 2009.
Microelectronics Reliability
Volume 50, Issue 2, February 2010, Pages 258–265
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
Hyomi Kima, Jongmin Kimb, Jooheon Kima, ,
a School of Chemical Engineering and Materials Science, Chung-Ang University, Seoul 156-756, Republic of Korea
b School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
Received 14 August 2009. Revised 28 October 2009. Available online 16 December 2009.
Properties of solders with low melting point
ScienceDirect.com: The aim of the work is to analyse thermal properties and microstructure of solders, which should be suitable for application in electronics.
The solders must have low enough working temperature to avoid thermal damage of the assembly and uniform microstructure in whole bulk. For solders presented in this work the required temperatures are less than 150 °C. They represent alternative, for example, to the conductive adhesives, which are in use. Five types of solders have been studied. They were created from the metals: Sn, In, Bi, Cd. The solder on the basis of Bi/Sn, has the composition of 58 wt.% Bi and 42 wt.% Sn of eutectic point of the alloy and the melting point of 141 °C. The second solder of the composition of 53 wt.% Bi, 26 wt.% Sn and 21 wt.% Cd proved the melting temperature of 103 °C. The next both solders are on Sn/In basis. The solder with composition of 70 wt.% In and 30 wt.% Sn has the melting point temperature of 126 °C. The second solder of nearly eutectic composition, 50 wt.% Sn and 50 wt.% In has lower melting temperatures about 117 °C. The last one is ternary solder with composition of 53 wt.% Sn, 37 wt.% Bi and 10 wt.% In with the melting point between 100 and 123 °C. Differential scanning calorimetry (DSC) was used to determine the thermal properties of these solders. For the study of microstructure light microscopy and X-ray diffraction analysis were used. The analysis of solders microstructure show that almost all solders have homogenous distribution of two or three phases in the microstructure.
Journal of Alloys and Compounds
Volume 457, Issues 1–2, 12 June 2008, Pages 323–328
Janka Chriašteľová, , Milan Ožvold
Department of Materials Engineering, Faculty of Materials Science and Technology, Slovak University of Technology, PaulÃnska 16, 917 24 Trnava, Slovak Republic
Received 28 January 2007. Revised 13 March 2007. Accepted 14 March 2007. Available online 19 March 2007.
The solders must have low enough working temperature to avoid thermal damage of the assembly and uniform microstructure in whole bulk. For solders presented in this work the required temperatures are less than 150 °C. They represent alternative, for example, to the conductive adhesives, which are in use. Five types of solders have been studied. They were created from the metals: Sn, In, Bi, Cd. The solder on the basis of Bi/Sn, has the composition of 58 wt.% Bi and 42 wt.% Sn of eutectic point of the alloy and the melting point of 141 °C. The second solder of the composition of 53 wt.% Bi, 26 wt.% Sn and 21 wt.% Cd proved the melting temperature of 103 °C. The next both solders are on Sn/In basis. The solder with composition of 70 wt.% In and 30 wt.% Sn has the melting point temperature of 126 °C. The second solder of nearly eutectic composition, 50 wt.% Sn and 50 wt.% In has lower melting temperatures about 117 °C. The last one is ternary solder with composition of 53 wt.% Sn, 37 wt.% Bi and 10 wt.% In with the melting point between 100 and 123 °C. Differential scanning calorimetry (DSC) was used to determine the thermal properties of these solders. For the study of microstructure light microscopy and X-ray diffraction analysis were used. The analysis of solders microstructure show that almost all solders have homogenous distribution of two or three phases in the microstructure.
Journal of Alloys and Compounds
Volume 457, Issues 1–2, 12 June 2008, Pages 323–328
Janka Chriašteľová, , Milan Ožvold
Department of Materials Engineering, Faculty of Materials Science and Technology, Slovak University of Technology, PaulÃnska 16, 917 24 Trnava, Slovak Republic
Received 28 January 2007. Revised 13 March 2007. Accepted 14 March 2007. Available online 19 March 2007.
Nihon Superior Picks Up Another Award
Nihon Superior Picks Up Another Award: Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, recently received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire.
Monday, March 19, 2012
Development of SnAg-based lead free solders in electronics packaging
ScienceDirect.com: Lead free solder alloys for electronic assembly is being driven by environmental and health concerns regarding toxicity of lead and, more importantly, by the perceived economic advantage of marketing “green” products
Of the currently available lead free solders, SnAg has the greatest potential. In this solder, the Ag3Sn compound is distributed in a eutectic network throughout the β-Sn matrix and these results represent mechanical strength. In order to further improve the microstructures and properties of SnAg-based alloys, alloying elements such as rare earth, Zn, In, P, Cu, Ni and particles such as ZrO2, POSS are selected to meet the requirement of high reliability of high-density electronics devices. For SnAg solder bearing rare earth (Ce and La), the creep-rupture life of solder joints can be remarkably increased up to four times more than that of the original SnAg solder joints at room temperature, meanwhile, rare earths can dramatically reduce the thickness of IMCs layer at solder/pad interfaces and also refine the microstructure of the alloy which results in the enhancement of mechanical properties of the SnAg solder. Moreover, the addition of ZrO2 nanoparticles significantly refined the size of Ag3Sn due to the adsorption effect of the ZrO2 nanoparticles. This paper summarizes the effects of alloying elements and particles on the wettability, mechanical properties, creep behavior, microstructures, etc. of SnAg-based lead free solder alloys.
Microelectronics Reliability
Volume 52, Issue 3, March 2012, Pages 559–578
Special section on International Seminar on Power Semiconductors 2010
Liang Zhanga, , , Cheng-wen Hea, Yong-huan Guoa, Ji-guang Hana, Yong-wei Zhanga, Xu-yan Wangb
a School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China
b The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China
Received 27 July 2011. Revised 5 October 2011. Accepted 5 October 2011. Available online 9 November 2011.
Of the currently available lead free solders, SnAg has the greatest potential. In this solder, the Ag3Sn compound is distributed in a eutectic network throughout the β-Sn matrix and these results represent mechanical strength. In order to further improve the microstructures and properties of SnAg-based alloys, alloying elements such as rare earth, Zn, In, P, Cu, Ni and particles such as ZrO2, POSS are selected to meet the requirement of high reliability of high-density electronics devices. For SnAg solder bearing rare earth (Ce and La), the creep-rupture life of solder joints can be remarkably increased up to four times more than that of the original SnAg solder joints at room temperature, meanwhile, rare earths can dramatically reduce the thickness of IMCs layer at solder/pad interfaces and also refine the microstructure of the alloy which results in the enhancement of mechanical properties of the SnAg solder. Moreover, the addition of ZrO2 nanoparticles significantly refined the size of Ag3Sn due to the adsorption effect of the ZrO2 nanoparticles. This paper summarizes the effects of alloying elements and particles on the wettability, mechanical properties, creep behavior, microstructures, etc. of SnAg-based lead free solder alloys.
Microelectronics Reliability
Volume 52, Issue 3, March 2012, Pages 559–578
Special section on International Seminar on Power Semiconductors 2010
Liang Zhanga, , , Cheng-wen Hea, Yong-huan Guoa, Ji-guang Hana, Yong-wei Zhanga, Xu-yan Wangb
a School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China
b The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China
Received 27 July 2011. Revised 5 October 2011. Accepted 5 October 2011. Available online 9 November 2011.
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
ScienceDirect.com Currently, the portable electronic products trend to high speed, light weight, miniaturization and multifunctionality. In that field, solder joint reliability in term of both drop impact and thermal cycling loading conditions is a great concern for portable electronic products. The transition to lead-free solder happened to coincide with a dramatic increase in portable electronic products. Sn–Ag–Cu (SAC) is now recognized as the standard lead free solder alloy for packaging interconnects in the electronics industry. The present study reviews the reliability of different Ag-content SAC solder joints in term of both thermal cycling and drop impact from the viewpoints of bulk alloy microstructure and tensile properties. The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability. The level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements. As a result, most component assemblers are using at least two (and in many cases even more) lead-free solder sphere alloys to meet various package requirements.
Microelectronics Reliability
Volume 52, Issue 1, January 2012, Pages 90–99
2011 Reliability of Compound Semiconductors (ROCS) Workshop
Dhafer Abdulameer Shnawah, , Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin
Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
Received 8 March 2011. Revised 30 July 2011. Accepted 30 July 2011. Available online 30 August 2011.
Microelectronics Reliability
Volume 52, Issue 1, January 2012, Pages 90–99
2011 Reliability of Compound Semiconductors (ROCS) Workshop
Dhafer Abdulameer Shnawah, , Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin
Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia
Received 8 March 2011. Revised 30 July 2011. Accepted 30 July 2011. Available online 30 August 2011.
EU consultant draft recommendation on ELV windscreen exemption
EU consultant Okopol has drafted a recommendation that the End of Life Vehicle Directive exemption for lead solders used in windscreens be removed.
Possible 3-year extension:
"In case the Commission grants the OEMs additional time, the consultants suggest the following wording for exemption 8 (i):
Lead in solders in electrical glazing applications on glass, except for soldering in laminated glazing, in vehicles type approved before 1 January 2015, and lead in spare parts for these vehicles."
The report has some revealing insights into development and properties of indium lead-free solders.
ACEA representing the car industry argued that indium solders melt at too low temperature and sunlight etc will melt them. However, it seems to depend on how this is measured. Some indium solders are already used in the industry for some years with no evidence of failure.
However, indium is on the list of critical materials.
In fact this is a very small market - only about 15 tonnes maximum (?in Europe) and probably less.
It also says the St Gobain are developing bismuth-based low temperature solders by end-2012.
Report
Related story
Possible 3-year extension:
"In case the Commission grants the OEMs additional time, the consultants suggest the following wording for exemption 8 (i):
Lead in solders in electrical glazing applications on glass, except for soldering in laminated glazing, in vehicles type approved before 1 January 2015, and lead in spare parts for these vehicles."
The report has some revealing insights into development and properties of indium lead-free solders.
ACEA representing the car industry argued that indium solders melt at too low temperature and sunlight etc will melt them. However, it seems to depend on how this is measured. Some indium solders are already used in the industry for some years with no evidence of failure.
However, indium is on the list of critical materials.
In fact this is a very small market - only about 15 tonnes maximum (?in Europe) and probably less.
It also says the St Gobain are developing bismuth-based low temperature solders by end-2012.
Report
Related story
Creative Materials offers new lower cost silver inks and adhesives
Global SMT and Packaging: Creative Materials, Inc., has continued to develop promising lower cost alternatives to conventionally manufactured silver inks and adhesives. With several new products qualified for production, we are confidently expanding our lower cost product line. In applications where a slight reduction in conductivity may be acceptable, these new “economical” products can provide cost savings while delivering the same high-quality performance of our standard silver inks and adhesives.
Two new successful lower cost products:125-43A/B119-44, Solvent-Resistant Electrically Conductive Ink—Developed for touch screens and shielding applications, this product has been successfully implemented in the manufacture of RFI-shielded displays. Adapted from CMI’s highly regarded 118-09A/B, 125-43A/B offers the same properties and chemical composition, with a slight decrease in overall conductivity. http://server.creativematerials.com/datasheets/DS_125_43A_B.pdf
125-46A/B,C, Economical Electrically Conductive Epoxy Adhesive—With little compromise to overall conductivity, this product was developed for making attachments on electrical and mechanical devices. Available for a wide range of dispensing options, 125-46A/B,C can be used with direct write and jet-dispensing systems. Based on the chemistry of our popular 124-08A/B,C, this product is also available in a two-component easily mixed one-to-one system and a one-component pre-mixed system. http://server.creativematerials.com/datasheets/DS_125_46.pdf
Two new successful lower cost products:125-43A/B119-44, Solvent-Resistant Electrically Conductive Ink—Developed for touch screens and shielding applications, this product has been successfully implemented in the manufacture of RFI-shielded displays. Adapted from CMI’s highly regarded 118-09A/B, 125-43A/B offers the same properties and chemical composition, with a slight decrease in overall conductivity. http://server.creativematerials.com/datasheets/DS_125_43A_B.pdf
125-46A/B,C, Economical Electrically Conductive Epoxy Adhesive—With little compromise to overall conductivity, this product was developed for making attachments on electrical and mechanical devices. Available for a wide range of dispensing options, 125-46A/B,C can be used with direct write and jet-dispensing systems. Based on the chemistry of our popular 124-08A/B,C, this product is also available in a two-component easily mixed one-to-one system and a one-component pre-mixed system. http://server.creativematerials.com/datasheets/DS_125_46.pdf
Electronica China & Productronica China
electronica China & productronica China: Within the framework of electronica China & productronica China, again a top-class conference program illuminating important topics, current trends and developments with long-range significance for the Chinese electronics market will be organized again in 2012.
March 20-22, Shanghai New International Expo Centre
International Green Manufacturing Innovation Forum
Green electronics manufacturing, an important part of energy saving and emissions reduction, promotes the environmental protection demanded by central government. To accommodate this trend, productronica China will host this forum focused on green electronics design, manufacturing technologies, equipment and integrated green solutions.
"International Green Manufacturing Innovation Forum" will better promote interaction between the vendors and Industrial customers, building a platform of technical innovation. There will be representatives of the industry leaders and renowned experts exchanging views deeply in hot topics around the green manufacturing technologies, the latest applications and market development.
Topics:
Component Manufacturing
Hybrid-component manufacturing
Organic Electronics
Micronano production
New Materials & Applications
Test & Measurement SMT
New Equipment and Technologies
EMS Innovation and Business Model Evolution
Lean Manufacturing Software and Management System
Certification of environmental protection and pollution control
For more information please click International Green Manufacturing Innovation Forum and Forum Agenda.
March 20-22, Shanghai New International Expo Centre
International Green Manufacturing Innovation Forum
Green electronics manufacturing, an important part of energy saving and emissions reduction, promotes the environmental protection demanded by central government. To accommodate this trend, productronica China will host this forum focused on green electronics design, manufacturing technologies, equipment and integrated green solutions.
"International Green Manufacturing Innovation Forum" will better promote interaction between the vendors and Industrial customers, building a platform of technical innovation. There will be representatives of the industry leaders and renowned experts exchanging views deeply in hot topics around the green manufacturing technologies, the latest applications and market development.
Topics:
Component Manufacturing
Hybrid-component manufacturing
Organic Electronics
Micronano production
New Materials & Applications
Test & Measurement SMT
New Equipment and Technologies
EMS Innovation and Business Model Evolution
Lean Manufacturing Software and Management System
Certification of environmental protection and pollution control
For more information please click International Green Manufacturing Innovation Forum and Forum Agenda.
IPC 2011 International technology roadmap for electronic interconnections
Global SMT and Packaging The International Technology Roadmap provides vision and direction for product development, process development and services required to satisfy the current and future needs of companies who are building electronic equipment for global customer requirements
The Roadmap presents findings and recommendations based on OEM, ODM and EMS vision and needs assessment. The Roadmap encompasses the supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points. Many chapters contain specific recommendations addressing current, near-term, mid-term and long-term requirements, proposed actions and opportunities. In addition, technical presentations made by industry experts are included as a special resource section used by the roadmap developers to provide predictions and visionary descriptions. The Roadmap is a valuable resource for companies throughout the global electronic equipment manufacturing industry and can be used for business, technology, and strategic planning for the near and long term. A new feature of the roadmap is to provide a technical driver comparison tool where the software is included in the CD so that long range planners can compare their technical descriptions of company products with the eight industry emulators published in the 2011 Roadmap. 590 pages. Released February 2012.
IPC Member Price $75.00
Non member Price $150.00
This document is only available for purchase. If you wish to order the above (or other) IPC standard please go to the EIPC website and click on the section Publications/IPC Standards for more information.
Please note EIPC members are entitled to the IPC member price.
For more information you can contact the EIPC office at eipc@eipc.org or +31-43-3440872 .
The Roadmap presents findings and recommendations based on OEM, ODM and EMS vision and needs assessment. The Roadmap encompasses the supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points. Many chapters contain specific recommendations addressing current, near-term, mid-term and long-term requirements, proposed actions and opportunities. In addition, technical presentations made by industry experts are included as a special resource section used by the roadmap developers to provide predictions and visionary descriptions. The Roadmap is a valuable resource for companies throughout the global electronic equipment manufacturing industry and can be used for business, technology, and strategic planning for the near and long term. A new feature of the roadmap is to provide a technical driver comparison tool where the software is included in the CD so that long range planners can compare their technical descriptions of company products with the eight industry emulators published in the 2011 Roadmap. 590 pages. Released February 2012.
IPC Member Price $75.00
Non member Price $150.00
This document is only available for purchase. If you wish to order the above (or other) IPC standard please go to the EIPC website and click on the section Publications/IPC Standards for more information.
Please note EIPC members are entitled to the IPC member price.
For more information you can contact the EIPC office at eipc@eipc.org or +31-43-3440872 .
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