Scopus - Document details: "The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to the inherent toxicity and environmental risks associated with lead. Although a number of "Pb-free" alloys have been invented, none of them meet all the standards generally satisfied by a conventional Pb-Sn alloy. A large number of reliability problems still exist with lead free solder joints. Solder joint reliability depends on mechanical strength, fatigue resistance, hardness, coefficient of thermal expansion which are influenced by the microstructure, type and morphology of inter metallic compounds (IMC). In recent years, Sn rich solders have been considered as suitable replacement for Pb bearing solders. The objective of this review is to study the evolution of microstructural phases in commonly used lead free xSn-yAg-zCu solders and the various factors such as substrate, minor alloying, mechanical and thermo-mechanical strains which affect the microstructure. A complete understanding of the mechanisms that determine the formation and growth of interfacial IMCs is essential for developing solder joints with high reliability. The data available in the open literature have been reviewed and discussed. "
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Wednesday, May 22, 2013
Extending the fatigue life of Pb-free SAC solder joints under thermal cycling
Scopus - Document details:
This paper reports on the dependence of the thermal fatigue life of Pb-free solder (Sn-3.0Ag-0.5Cu) joints on the points at which the printed circuit board (PCB) is fixed to a rigid support. Elastic-plastic finite element analysis under various thermal cycling conditions was performed. For the analysis, the mechanical boundary conditions around a solder joint bonded silicon chip were varied by changing the points at which the PCB was attached to its support. From the results of the analysis, it was found that the accumulated strain in the solder joints decreased when the PCB was fixed at points placed diagonally with respect to the silicon chip. The thermal fatigue life could therefore be expected to be extended by the choice of fixing points. Using a special support with a thermal expansion coefficient of less than 1.5 × 10-6 K-1, we demonstrated, experimentally, that the accumulated strain and the failure site of the solder joints could indeed be controlled by the positions at which the printed circuit board was fixed. © 2013 Elsevier Ltd. All rights reserved.
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This paper reports on the dependence of the thermal fatigue life of Pb-free solder (Sn-3.0Ag-0.5Cu) joints on the points at which the printed circuit board (PCB) is fixed to a rigid support. Elastic-plastic finite element analysis under various thermal cycling conditions was performed. For the analysis, the mechanical boundary conditions around a solder joint bonded silicon chip were varied by changing the points at which the PCB was attached to its support. From the results of the analysis, it was found that the accumulated strain in the solder joints decreased when the PCB was fixed at points placed diagonally with respect to the silicon chip. The thermal fatigue life could therefore be expected to be extended by the choice of fixing points. Using a special support with a thermal expansion coefficient of less than 1.5 × 10-6 K-1, we demonstrated, experimentally, that the accumulated strain and the failure site of the solder joints could indeed be controlled by the positions at which the printed circuit board was fixed. © 2013 Elsevier Ltd. All rights reserved.
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2013 Roadmap | iNEMI
2013 Roadmap | iNEMI:
The 2013 Roadmap was developed by 20 Technology Working Groups (TWGs) in response to inputs regarding technology needs from representatives of OEMs in six Product Emulator Groups (PEGs). These groups included more than 650 individuals from over 350 corporations, consortia, government agencies and universities, located in 18 countries.
Download highlights of the Executive Summary (PDF).
View sample pages (PDF)
Press release (May 14, 2013)
WEBINARS: Introduction to the 2013 Roadmap plus highlights of selected chapters (requires log-in; if you do not have a web account, create one now).
2013 Product Emulator Groups (PEGs)
1. Aerospace/Defense
2. Automotive
3. Consumer/Portable
4. High-End Systems
5. Medical
6. Office Systems
The PEGs define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. These needs are presented in each PEG chapter, using key attribute spreadsheets and text according to templates that are furnished by the iNEMI Technical Committee (TC). Each PEG has a Chair or Co-chairs and as many group members as needed for a broad-based view of that emulator’s scope (usually 2-5 individuals).
The TWGs use the OEM requirements detailed in the six PEG chapters (as applicable) to prepare each of their roadmap chapters, detailing where their respective technology stands today — and is expected to progress over the next 10 years — with respect to the stated needs.
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The 2013 Roadmap was developed by 20 Technology Working Groups (TWGs) in response to inputs regarding technology needs from representatives of OEMs in six Product Emulator Groups (PEGs). These groups included more than 650 individuals from over 350 corporations, consortia, government agencies and universities, located in 18 countries.
Download highlights of the Executive Summary (PDF).
View sample pages (PDF)
Press release (May 14, 2013)
WEBINARS: Introduction to the 2013 Roadmap plus highlights of selected chapters (requires log-in; if you do not have a web account, create one now).
2013 Product Emulator Groups (PEGs)
1. Aerospace/Defense
2. Automotive
3. Consumer/Portable
4. High-End Systems
5. Medical
6. Office Systems
The PEGs define OEM requirements for their respective product sectors, anticipating product technology and business-related needs over a 10-year horizon. These needs are presented in each PEG chapter, using key attribute spreadsheets and text according to templates that are furnished by the iNEMI Technical Committee (TC). Each PEG has a Chair or Co-chairs and as many group members as needed for a broad-based view of that emulator’s scope (usually 2-5 individuals).
The TWGs use the OEM requirements detailed in the six PEG chapters (as applicable) to prepare each of their roadmap chapters, detailing where their respective technology stands today — and is expected to progress over the next 10 years — with respect to the stated needs.
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Friday, May 10, 2013
FCT Assembly to Present New Technology for Paste Printing at the SMTA Toronto Expo
EMSNow: FCT Assembly will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel & Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions. Keith works closely with the FCT Assembly team, a licensee for Nihon Superior'sSN100C.
FCT Assembly has developed the world's most advanced stencil technology for solder paste printing. The technology is comprised of a specifically engineered nano coating applied over its proven Slic™ stencil. The technology is surprisingly cost-effective, making improved yields available to all levels of the industry. The technology can be used with current assembly equipment and processes.
The new NanoSlic™ stencil is based on the proven Slic™ stencil with its advanced foil composition and FCTA's state-of-the-art laser cutting process. Then, a permanent nano coating is applied that is based on a revolutionary chemistry platform called Hybrid-T Technology™. The coating imparts a highly hydrophobic and oleophobic surface to the bottom of the stencil and aperture walls. The robust coating should last the life of the stencil.
Using the newly developed NanoSlic™ coating system, NanoSlic™ is sprayed onto the stencil surface and aperture walls, reducing bridging and significantly improving paste release, permitting consistent printing of the smallest area ratios. The technology will be applied by FCT Assembly in its various locations. The user will see following benefits immediately: reduced bridging, reduced underside cleaning, improved paste release and improved yields.
An added benefit, the NanoSlic™ coating, is environmentally friendly. It does not use any Perfluorooctanoic acid (PFOA), a toxic substance currently being investigated by the EPA.
www.fctassembly.com.
FCT Assembly has developed the world's most advanced stencil technology for solder paste printing. The technology is comprised of a specifically engineered nano coating applied over its proven Slic™ stencil. The technology is surprisingly cost-effective, making improved yields available to all levels of the industry. The technology can be used with current assembly equipment and processes.
The new NanoSlic™ stencil is based on the proven Slic™ stencil with its advanced foil composition and FCTA's state-of-the-art laser cutting process. Then, a permanent nano coating is applied that is based on a revolutionary chemistry platform called Hybrid-T Technology™. The coating imparts a highly hydrophobic and oleophobic surface to the bottom of the stencil and aperture walls. The robust coating should last the life of the stencil.
Using the newly developed NanoSlic™ coating system, NanoSlic™ is sprayed onto the stencil surface and aperture walls, reducing bridging and significantly improving paste release, permitting consistent printing of the smallest area ratios. The technology will be applied by FCT Assembly in its various locations. The user will see following benefits immediately: reduced bridging, reduced underside cleaning, improved paste release and improved yields.
An added benefit, the NanoSlic™ coating, is environmentally friendly. It does not use any Perfluorooctanoic acid (PFOA), a toxic substance currently being investigated by the EPA.
www.fctassembly.com.
EMSNow - Indium Corporation Technology Expert to Present at IMAPS Advanced Technology Workshop
EMSNow - Indium Corporation Technology Expert to Present at IMAPS Advanced Technology Workshop: Indium Corporation's Brook Sandy-Smith, Product Support Specialist - PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis,
Sandy-Smith will present the following papers:
• A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of a low-Ag SAC solder alloy doped with Mn (SACM). SACM is compared to eutectic SnPb, SAC105, SAC305 alloys under various test conditions, such as JEDEC drop shock, dynamic bending, thermal cycling, and cyclic bending.
• Soldering Technologies Enabling Medical Device Packaging in the 3D Era. This paper will review the various forms of soldering for medical electronics and other types of medical devices. It examines how soldering technology is evolving to meet the challenges of smaller devices, which are more sensitive to manufacturing processes. Flux and similar materials that enable new assembly processes in the era of 2.5D and 3D technology will also be discussed.
Sandy-Smith serves as a technical liaison between Indium Corporation's customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
Sandy-Smith will present the following papers:
• A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of a low-Ag SAC solder alloy doped with Mn (SACM). SACM is compared to eutectic SnPb, SAC105, SAC305 alloys under various test conditions, such as JEDEC drop shock, dynamic bending, thermal cycling, and cyclic bending.
• Soldering Technologies Enabling Medical Device Packaging in the 3D Era. This paper will review the various forms of soldering for medical electronics and other types of medical devices. It examines how soldering technology is evolving to meet the challenges of smaller devices, which are more sensitive to manufacturing processes. Flux and similar materials that enable new assembly processes in the era of 2.5D and 3D technology will also be discussed.
Sandy-Smith serves as a technical liaison between Indium Corporation's customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
Thursday, May 9, 2013
Method for inhibiting growth of intermetallic compounds
Espacenet - Bibliographic data: The present invention relates to a method for inhibiting growth of intermetallic compounds, comprising the steps of: (i) preparing a substrate element including a substrate on which at least one layer of metal pad is deposited, wherein at least one layer of solder having a thin thickness is deposited onto the layer of metal pad, and then carry out reflowing process; and (ii) further depositing a layer of solder with an appropriate thickness on the substrate element, characterized in that a thin intermetallic compound is formed by the reaction of the solder having a thin thickness and the metal in the metallic pad after appropriate heat treatment of the thin solder. In the present invention, the formation of thin intermetallic compound is able to slow down the growth of the intermetallic compound and to prevent the transformation of the intermetallic compounds. Once the growth of the intermetallic compounds can be inhibited, the growth of Sn whiskers can also be inhibited.
TW201308451 (A) - Method for inhibiting growth of intermetallic compounds
Inventor(s): CHEN CHIH [TW]; TU KING-NING [US]; HSIAO HSIANG-YAO [TW] +
Applicant(s): UNIV NAT CHIAO TUNG [TW] +
TW201308451 (A) - Method for inhibiting growth of intermetallic compounds
Inventor(s): CHEN CHIH [TW]; TU KING-NING [US]; HSIAO HSIANG-YAO [TW] +
Applicant(s): UNIV NAT CHIAO TUNG [TW] +
SMTONLINE IPC Conference Centers on Medical Device Manufacturing
SMTONLINE Electronic medical device manufacturers are under constant pressure to deliver innovative products on time and within budget, while contending with rapidly changing technologies, increasing product complexity, and strict compliance and safety standards across a global marketplace. To help address these challenges, IPC — Association Connecting Electronics Industries� will host a one-and-a-half day conference, “Innovations in Electronics in Manufacturing for Medical Devices,” June 12-13, 2013 in Minneapolis, Minnesota.
“Global regulations, lead-free technology, evolving manufacturing processes, reliability demands, and R&D issues are transforming the way medical device companies manage their supply chains,” said Sanjay Huprikar, IPC vice president of member success. “This conference is focused on the innovations taking place in electronics manufacturing at every stage of the medical devices supply chain.”
Subject matter experts from Mayo Clinic, Medtronic, Philips Healthcare, Boston Scientific, St. Jude Medical, Micro Systems Engineering, Sanmina Corporation, Celestica, Jabil, Benchmark Electronics, Endicott Interconnect Technologies, Indium, HDPUG, Frost and Sullivan, and more will help attendees identify new market forces driving cost reductions, discover new lead-free technology breakthroughs, address sustainability challenges, and obtain practical and advanced manufacturing techniques for the age of miniaturization.
“Global regulations, lead-free technology, evolving manufacturing processes, reliability demands, and R&D issues are transforming the way medical device companies manage their supply chains,” said Sanjay Huprikar, IPC vice president of member success. “This conference is focused on the innovations taking place in electronics manufacturing at every stage of the medical devices supply chain.”
Subject matter experts from Mayo Clinic, Medtronic, Philips Healthcare, Boston Scientific, St. Jude Medical, Micro Systems Engineering, Sanmina Corporation, Celestica, Jabil, Benchmark Electronics, Endicott Interconnect Technologies, Indium, HDPUG, Frost and Sullivan, and more will help attendees identify new market forces driving cost reductions, discover new lead-free technology breakthroughs, address sustainability challenges, and obtain practical and advanced manufacturing techniques for the age of miniaturization.
SMTONLINE Webinar to Discuss ReUSE Project
SMTONLINE The NPL Management Ltd will be holding a webinar on May 15 that will discuss the ReUSE (Reuseable, Unzippable, Sustainable Electronics) project, an innovative printed electronics solution to increase the recyclability of electronic assemblies.
The project partners - NPL, GEM Group and In2Tec - designed, developed and tested a series of unzippable polymeric layers which, while withstanding prolonged thermal cycling and damp heat stressing, allow the assemblies to be easily separated at end-of-life into their constituent parts, after immersion in hot water. The project demonstrated a 90% recyclable inverter circuit for an electroluminescent lamp.
The free webinar will run for between 45-60 minutes and will have a Q&A session.
The project partners - NPL, GEM Group and In2Tec - designed, developed and tested a series of unzippable polymeric layers which, while withstanding prolonged thermal cycling and damp heat stressing, allow the assemblies to be easily separated at end-of-life into their constituent parts, after immersion in hot water. The project demonstrated a 90% recyclable inverter circuit for an electroluminescent lamp.
The free webinar will run for between 45-60 minutes and will have a Q&A session.
Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
Espacenet: A high-temperature solder alloy is a Bi-Sn based solder alloy containing at least 90 mass % of Bi, further containing 1 - 5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5 - 5 mass %, and preferably further containing 0.0004 - 0.01 mass % of P.
EP2589459 (A1) - Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
Inventor(s): UESHIMA MINORU [JP]; INAGAWA YOSHIMI [JP]; TOYODA MINORU [JP] +
Applicant(s): SENJU METAL INDUSTRY CO [JP] +
Classification:
- international: B23K1/00; B23K35/26; C22C12/00; H05K3/34; B23K101/40
- cooperative: B23K1/0016; B23K35/264; C22C12/00; H05K3/3463; B23K2201/42; H05K3/3494;
Application number: EP20110800638 20110617
EP2589459 (A1) - Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
Inventor(s): UESHIMA MINORU [JP]; INAGAWA YOSHIMI [JP]; TOYODA MINORU [JP] +
Applicant(s): SENJU METAL INDUSTRY CO [JP] +
Classification:
- international: B23K1/00; B23K35/26; C22C12/00; H05K3/34; B23K101/40
- cooperative: B23K1/0016; B23K35/264; C22C12/00; H05K3/3463; B23K2201/42; H05K3/3494;
Application number: EP20110800638 20110617
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