IWLPC - International Wafer-Level Packaging Conference:
SMTA and Chip Scale Review are pleased to announce the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition program is finalized. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
http://www.iwlpc.com/
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Showing posts with label Events. Show all posts
Showing posts with label Events. Show all posts
Friday, October 12, 2012
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy
ERA Technology | ERA Conference 2012 : 14 – 15 November 2012 | Specialist technical consultancy:
ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
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ERA Conference 2012 : 14 – 15 November 2012
Electrical and Electronic Equipment and the Environment 2012: Meeting the Technical and Regulatory Challenges
Conference Programme now available >> download
To book a place at the conference click here.
ERA’s annual conference, now its fourteenth year, attracts delegates from a broad range of professions involved in compliance, design, quality assurance and the production and distribution of electrical and electronic equipment. Click here to find out more about exhibition and sponsorship opportunities.
The event promises to be as stimulating and enlightening as ever, targeting hot topics from the introduction of RoHS2 and future amendments to the REACH regulation and WEEE directive, to the continuing struggle to exclude conflict minerals from the supply chain. The comprehensive 2012 programme includes:
Progress in Driving Conflict Free Sourcing. Carolyn Duran, Intel
Innovation, sustainability and public procurement. Maya de Souza, DEFRA (Department for Environment, Food and Rural Affairs)
RoHS 2 : interpretation and developments. Peter Askew, BIS (Department for Business, Innovation and Skills)
Developments in enforcement of RoHS and Eco-design. Chris Smith, NMO (National Measurement Office)
RoHS 2 : EN Standards to support manufacturers of finished products. Iain Lindsay, Rockwell Automation
Practical application of EN 50581 to generate Technical Documentation for RoHS2. Aidan Turnbull, Environ
Managing RoHS 2 compliance conformity in a global business. Eric Agoyé, GE Healthcare
Facing the challenge of REACH substance authorisation. Cristian Samoilovich, ADS
Developments in substance restriction legislation. Paul Goodman, ERA
Flame retardants – an update on regulatory status and environmental assessments. Adrian Beard, Clariant
A review of progress on EU eco-design measures. Mike Walker, DEFRA
Ecodesign: Product Directives and System Control – a view from an industrial control perspective. Steve Bramley, GAMBICA
Understanding and implementing ecodesign directive network standby requirements. Greg Batts, Kodak
Material sustainability – minimising technical and business risk. Chris Robertson, ERA
The WEEE Recast in the UK. David Styles, BIS
Status Report on US Product Related Environmental Restrictions for Electronic Products and Outlook for 2013. Holly Evans, Strategic Counsel
Implication of the Recast Directive for Business Products. David Burton, B2B Compliance
A recycling study for plastics from LCDs focusing on plastics with flame retardants. Lein Tange, EFRA
Our expert panel of organisers includes Dr. Chris Robertson and Dr. Paul Goodman, both of whom work for ERA Technology Ltd within our regulatory compliance department. ERA has helped numerous companies comply with RoHS, REACH and eco-design requirements, and also supports the European Commission, having previously assisted them in reviewing categories for inclusion and exemption in the RoHS directive and have recently completed projects to analyse the impact of RoHS2 as well as leading a preparatory study into industrial and laboratory furnaces and ovens.
The conference offers delegates a chance to meet with representatives of organisations directly involved with the implementation and enforcement of regulatory policy, as well as affording them the opportunity to learn from and connect with colleagues grappling with similar issues to their own.
This conference is the best event of its kind to interact and interface with leading organisations at the forefront of the electrical and electronic sector.
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SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time | LinkedIn:
SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
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SMART Group e-Webinar: "Contamination Testing Methods for Printed Boards & Assemblies" Nov 13th 14.30 -16.00 UK time
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation, coating and the demands of modern circuits, cleaning has come back into fashion and with it the need to monitor production and qualify materials and processes, hence the need for contamination test methods.
Each delegate may receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.
The webinar will run for approx. 60min plus questions
Topics include:
Testing boards, components and assemblies
International specifications and reference books
Ionic testing & non-ionic testing
Surface insulation measurement
Ion Chromatography (IC) test techniques
Shop floor test methods
Testing frequency during PCB fabrication & assembly
Cleanliness failure types
Booking Form Link smartgroup.org
http://www.smartgroup.org/wp-content/uploads/2012/10/Contaminationtesting.pdf
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Tuesday, October 9, 2012
IPC Medical Industries Technical Conference
IPC Medical Industries Technical Conference:
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November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
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November 7–9, 2012 | Wyndham Hotel-Boston | Andover, Massachusetts
Gain working knowledge that you need for implementation of lead-free electronics manufacturing processes.
Learn about engineering challenges associated with materials selection, reliability, testing and supply chain quality control, as well as potential solutions.
Take home practical applications that you can use today, from technical experts who will share lessons learned from the leaded-to-lead-free conversion process at their own operations, and those of their suppliers.
Connect with colleagues who can help you work effectively and efficiently.
The July 2014 deadline for regulatory compliance applies only in Europe at this time, but it is a wake-up call for all organizations with global sourcing and distribution in the medical sector.
AGENDA
WEDNESDAY, NOVEMBER 7
Workshop 9:00 am–3:30 pm
Challenges of Conversion: From Leaded to Lead-Free Operation
Leo Lambert, Vice President, EPTAC Corporation and Umut Tosun, CTO, ZESTRON America
Be prepared for the challenges of converting to lead free from a leaded operation.
Process awareness issues based upon the conversion will be covered, including specification changes implemented with new alloy introduction and differences in the metallurgy.
What You Will Learn
Process changes for implementation
Laminate and material changes involved in the conversion
Thermal profile differences
Lessons learned since introduction of lead-free materials in the industry
Criticality of cleaning
Your Instructors
With more than 30 years of experience and special expertise in metallurgy and soldering, Leo Lambert provides expert consultation developing, troubleshooting and auditing manufacturing processes. He is a Master IPC Trainer for one of the most widely-utilized industry training programs (IPC-A-600 for Acceptability of Printed Boards).
Umut Tosun is the application technology manager at ZESTRON America, and has published in leading electronics manufacturing publications and presented technical papers and studies at international conferences. He holds a Bachelor of Science degree and master’s degree in chemical engineering from the Technical University of Hamburg, Germany.
TOUR 3:30 pm–5:00 pm
Customer Visit Center at the Philips Healthcare offices
THURSDAY, NOVEMBER 8
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Welcome and Introductions
Po Tse, Ph.D., Candidate, Sr. Reliability Risk Manager, Philips Healthcare
8:15 am Keynote: Reliability Priorities for Lead Free
Peter van der Heide, Ph.D., Sr. Director of Product Creation Process, Philips Healthcare
9:00 am Supply Chain: Lead-Free Quality Concerns and Expectations
Ravi Nabar, Ph.D., Sr. Director of Supplier Quality, Philips Healthcare
9:45 am PERM (Pb-free Electronics Risk Management) Status Report
Anthony Rafanelli, Ph.D., P.E., Engineering Fellow, Raytheon
10:30 am BREAK
10:45 am Past, Present and Future Lead-Free Projects Within HDPUG
Marshall Andrews, Executive Director, HDPUG (High Density Packaging User Group)
11:30 am Roles and Responsibilities Within Medical Electronics Manufacturing Organizations
Mulugeta Abtew, Senior Manager, Sanmina-SCI
12:15 pm LUNCHEON
1:15 pm Lead-Free PCB Testing: Experiences in the Medical Sector
Raj Kumar, Vice President of PCB Technology, Viasystems
2:00 pm Simulation-Based Reliability Assessment of RoHS compliant Electronic Equipment
Michael Osterman, Ph.D., Research Associate, CALCE, University of Maryland
2:45 pm BREAK
3:00 pm Sherlock II Prediction Model for Reliability
Craig Hillman, Ph.D., CEO and Managing Partner, DfR Solutions
3:45 pm Lead-Free PCB Cleanliness Requirements
Mike Bixenman, DBA, CTO, Kyzen Corporation
4:45 pm Concluding Remarks
5:00–6:30 pm NETWORKING RECEPTION at the Wyndham Hotel
FRIDAY, NOVEMBER 9
Technical Conference
7:30 am Check-in and Continental Breakfast
8:00 am Keynote: Benefit, Risk, and the FDA
Elisabeth George, Vice President Global Regulations & Standards, Philips Healthcare
8:45 am RoHS and Related Environmental Legislation Issues in the Context of Implantable Medical Electronics
Peter Tortorici, Ph.D., New Product Development Manager, Medtronic
9:15 am BREAK
10:30 am Optimal Choices for Lead-Free Soldering Materials
Karl Seelig, Vice President-Technology, AIM Solder
11:00 am Tin Whiskers: Detection, Formation, Mitigation
Bob Landman, President and CTO, H&L Instruments
11:45 am Concluding Remarks
12:00 pm ADJOURN
Tuesday, September 25, 2012
National Conference on Electronics Design, Assembly and Reliability
National Conference on Electronics Design, Assembly and Reliability: "The National Conference on Electronics Design, Assembly and Reliability (NCEDAR) is focused on your needs and your industry. This NEW event, backed by the experience and expertise of IPC — Association Connecting Electronics Industries®, brings you the latest information while providing valuable networking opportunities.
Organized by IPC India in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, NCEDAR will be held at the Indian Institute of Science, Bangalore, December 4–6, 2012.
Technical Conference — Discover the latest breakthroughs on topics including:
Design, simulation and modeling
Electronic components, RF and optoelectronics
Advanced packaging, including interconnections
Assembly and manufacturing technology (PCB)
Materials and processing
Reliability and quality control"
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Organized by IPC India in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, NCEDAR will be held at the Indian Institute of Science, Bangalore, December 4–6, 2012.
Technical Conference — Discover the latest breakthroughs on topics including:
Design, simulation and modeling
Electronic components, RF and optoelectronics
Advanced packaging, including interconnections
Assembly and manufacturing technology (PCB)
Materials and processing
Reliability and quality control"
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Thursday, September 13, 2012
TOWARDS ZERO DEFECTS SMART Group European Conference and Exhibition 2012
Tuesday 18th / Wednesday 19th September 2012 - Thame, Oxfordshire, UK
If your goal is 0% rework and 0% field failures, then the SMART Group’s exciting two day conference and exhibition is for you!
The proposed schedule for the two days is as follows:
DAY 1
Keynote Presentation: Printed Circuit Boards to Printed Electronics - The Future: Steve Jones - Printed Electronics Ltd
Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins
Electronics Design for Vibration: Andy Stiles - Aero Engine Controls
SMART HALT: Bob Page – Reliability Plus
Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services
High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV
Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium
Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen
Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group
DAY 2
DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd
A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS
Cleaning Under Low Stand-off Components: Rob Murphy - Zestron
Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL
Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins
Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus
DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)
ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd
The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins
Who should attend?
This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. Delegates can choose to attend either of the days or both. The costs for delegates include arrival drinks, mid-morning drinks, lunch, afternoon drinks and full access to all the proceedings immediately after the event.
http://www.smartgroup.org/wp-content/uploads/2012/06/SMARTConference2012flyer.pdf
IPC-SMTA Cleaning and Conformal Coating Conference
This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.
“How clean is clean?” is even more challenging to answer: conductors and circuit traces are growing narrower and what is acceptably clean for one industry segment may be unacceptable in others.
A half-day workshop will be followed by a two-day technical conference, that will include tabletop exhibits, luncheons, and a networking reception.
Workshop
Tuesday, November 13, 8:00 am–12:00 pm
Conformal Coatings: Types, Uses and Specifications
Doug Pauls, Rockwell Collins and Jason Keeping, Celestica
Technical Conference Agenda
Tuesday, November 13
12:50 pm–1:00 pm Welcome
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
1:00 pm–2:30 pm Nano-Coatings
Session Leader: Craig Hillman, Ph.D., DfR Solutions
Innovative Superhydrophobicity Nano-Coatings that Protect HDI Interconnects from Moisture Absorption
Dan Hobson, Ross Technology Corporation
Characterization and Analysis of Plasma Polymers for Protective Films
Tim Von Werne, Semblant Ltd.
Chemical Vapor Deposition Enables Well-Defined Polymeric Films on Micro and Nano-Scale Features
Aleksandr White, GVD Corporation, Inc.
2:30 pm–3:00 pm Break
3:00 pm–4:00 pm Increasing the Reliability of Electronic Devices
Stephen Coulson, Ph.D., P2i
Enhancing Water-Blocking Nano Coatings for Telecommunications Devices
Blake Stevens, Ph.D., HzO
4:00 pm–4:45 pm Keynote: Printed Circuit Board Reliability — Factors OEMs Should Consider in the Age of Miniaturization
Dave Hillman, Rockwell Collins
5:00 pm–6:30 pm Networking Reception sponsored by Kyzen Corporation
Wednesday, November 14
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–9:30 am Conformal Coating
Session Leader: Jeff Kennedy, Celestica
High Temperature Reliability Limits of Silicon Conformal Coatings
Carlos Montemayor, Dow Corning Corporation
Investigation of Adhesive Strength of Conformal Coatings
Rich Kraszewski, Plexus Corporation
Standardization of Electronic Conformal Coatings in an Aerospace OEM
Hector Valladares, Honeywell International
9:30 am–10:00 am Break
10:00 am–11:30 am Use of IPC-B-52 Test Assembly for Conformal Coating Process Optimization
Doug Pauls, Rockwell Collins
A Preliminary Investigation into Enhanced Automated Selective Conformal Coating of Electronic Assemblies by employing Plasma Treatment Technology
David Foote and Hector Pulido, Nordson Asymtek
Throughput and Yield Improvements via Conformal Coating Process Characterization
Brad Perkins and Hector Pulido, Nordson Asymtek and Manuel Fernandez, Celestica
11:30 am–12:30 pm Luncheon sponsored by Zestron
12:30 pm–3:00 pm Cleanliness Assessment & Process Control
Session Leader: Doug Pauls, Rockwell Collins
A ROSE is Still a ROSE? Ionically, It Makes a Difference!
Graham Naisbitt, Gen3 Systems Limited
Localized Extraction Methods for Ionic Analysis
Eric Camden, Foresite, Inc. and Doug Pauls, Rockwell Collins
Cleaning Challenges in an HDI World
Mark Northrup, IEC Electronics Corp., Joe Russeau, Precision Analytical Laboratory, Inc. and Mike Bixenman, DBA, Kyzen Corporation
IPC-B-52 SIR: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future
Matt Kelly, IBM Corporation
A Comparison of Extract Solution Composition for Bare Boards
Jennifer Klavon, Rockwell Collins
3:00 pm–3:30 pm Break
3:30 pm–5:30 pm Environmental Standards and Regulations
Session Leader: Lee Wilmot, TTM Technologies, Inc.
Regulations and Productive Electronics Assembly: A Review of the Proposed OTC Regulations Targeted for 13 Eastern States
Barbara Kanegsberg, BFK Solutions
Green Screen Chemical Hazard Assessment Tool for Selecting Safer Cleaning
Curtis Wray, Hewlett-Packard Company
Reduction of VOC Emissions and Alternatives to Toxic Conformal Coatings
Emmanuelle Guene, Inventec Performance Chemicals
RoHS 2 / REACH / Conflict Materials
Ron Lasky, Ph.D., Indium Corporation of America
Thursday, November 15
7:00 am–8:00 am Check-in and Continental Breakfast
8:00 am–10:00 am Electronics Assembly and PCB Failure Mechanisms & Reliability
Session Leader: Dave Hillman, Rockwell Collins
Influence of Ionic Contamination and Tin Whiskers
Stephan Meschter, Ph.D., BAE Systems Platform Solutions and Polina Snugovsky, Ph.D., Celestica
Creep Corrosion of PCB Assemblies: Effects of Surface Contamination
Martin Anselm, Universal Instruments
How Conformal Coating Can Kill
Craig Hillman, Ph.D., DfR Solutions
Electrical Reliability of Combinations of Solder Paste, Wave Soldering Flux and Conformal Coatings
Karen Tellefsen, Cookson Electronics
10:00 am–10:30 am Break and Box Lunch
10:30 am–1:30 pm Assembly Cleaning & Challenges
Session Leader: Dale Lee, Plexus Corporation
Process Optimization and Customer Requirements
Ken Van Zill, Ducommun LaBarge Technologies, Inc.
Cleaning No-Clean Flux Residues
Michael Havener, Benchmark Electronics Inc.
Electronics Effects of Cleaning Agents on Adhesives and Conformal Coating
Tana Soffa, L.W. Nusbaum, P.A. Panackal and K.F. Schoch, Jr., Northrop Grumman Corporation
Improvement of Cleaning Lead-Free Flux Residues for HDI Assemblies by Reduction of Oxygen Levels During Reflow
Maeva Tureau, Ph.D.; Chris Han-Adebekun, Ph.D. and Greg Arslanian, Air Products & Chemicals
Determining Critical Cleaning Process Parameters for QFNs
Umut Tosun, Naveen Ravindran and Michael McCutchen, ZESTRON America
Assembly Cleaning Process Characterization — Utilizing Repeatable Chemistry Solution Control
Dave Adams, Rockwell Collins; Dave Lober and John Williamson, Kyzen Corporation
1:30 pm–1:45 pm Adjournment
Event Chairman: Mike Bixenman, DBA, Kyzen Corporation
IPC-SMTA Cleaning and Conformal Coating Conference:
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Tuesday, September 11, 2012
IPC APEX EXPO 2013
San Diego Conference Centre
19 - 21 February 2013
FREE! Opening keynote — Join theoretical physicist, best-selling author and futurist Dr. Michio Kaku for an awe-inspiring look at the future!
Show highlights include:
FREE! More than 400 exhibitors showing equipment, materials and services for printed boards and electronics manufacturing — plus printed electronics! There's no better place to see and compare.
The largest technical conference for our industry in the world. Highly selective, the conference presents new research and innovations from experts in the fields of electronics assembly, test and board fabrication and design.
FREE! Industry poster sessions — Catch up on the latest research and meet the authors.
Professional development courses provide comprehensive updates on pressing industry concerns.
Standards development meetings that help shape the future of our industry.
Compete in or watch the exciting IPC International Hand Soldering Grand Championship on the show floor.
Stay tuned, there’s a lot more to come!
Home Page | IPC APEX EXPO 2013:
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Monday, September 10, 2012
IPCWorksAsia 2012
IPC WorksAsia 2012 to build the South China electronics industry technology festival
PCB & electronic assembly and cutting-edge technology / best practices / Green Manufacturing
Time: 30 to 31st October 2012
Location: Shenzhen, Shihua Hotel
Organizers: IPC-International Electronics Industry Association Connecting
IPC engineers in Shenzhen, southern China, the majority of electronics companies, professional and technical personnel, functional managers are meeting to create a PCB & electronic assembly and cutting-edge technology / best practices / green manufacturing technology festival! Economic slowdown, lack of demand, rising costs, the opportunity to learn a changing set of technologies, processes, management and policy in one place, absolutely not to be missed!
•Activities: theme seminars , experienced professionals bringing together well-known domestic and foreign enterprises and academia, side by side hot topics dedicated to advanced theories on PCB & assembly, best practices, management and policy.
•Activity Two: Reliability seminar, lectures by experts from well-known companies and laboratories on ways to improve product reliability.
Seats are limited, please register reserved seats as soon as possible!
http://www.ipc.org.cn/Events/IPCWorksAsia-2012/default.htm
PCB & electronic assembly and cutting-edge technology / best practices / Green Manufacturing
Time: 30 to 31st October 2012
Location: Shenzhen, Shihua Hotel
Organizers: IPC-International Electronics Industry Association Connecting
IPC engineers in Shenzhen, southern China, the majority of electronics companies, professional and technical personnel, functional managers are meeting to create a PCB & electronic assembly and cutting-edge technology / best practices / green manufacturing technology festival! Economic slowdown, lack of demand, rising costs, the opportunity to learn a changing set of technologies, processes, management and policy in one place, absolutely not to be missed!
•Activities: theme seminars , experienced professionals bringing together well-known domestic and foreign enterprises and academia, side by side hot topics dedicated to advanced theories on PCB & assembly, best practices, management and policy.
•Activity Two: Reliability seminar, lectures by experts from well-known companies and laboratories on ways to improve product reliability.
Seats are limited, please register reserved seats as soon as possible!
http://www.ipc.org.cn/Events/IPCWorksAsia-2012/default.htm
Monday, August 13, 2012
SMART Group European Conference on Packaging, Assembly and Reliability
Events Diary | SMART Group: plus Table Top Exhibition
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England
The Big Zero Conference – Design and Build Reliability
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England
The Big Zero Conference – Design and Build Reliability
Friday, July 27, 2012
Dr. Jennie Hwang will deliver two Courses at SMTA International Exhibition & Conference on October 15, 2012, Orlando, Florida
Manufacturing PCB assemblies containing grid array packages in the co-existence of RoHS lead-free compliant and RoHS exempted industry sectors poses great challenges to both OEMs and EMSs. Much confusion has been generated. This course aims to clear the confusion and offer answers to industry-wide questions on solder-ball-array packages and assembly (BGA, CSP, WLP, and LGA) in manufacturing, as well as reliability. Questions to be answered include "Should reflow peak temperature be set to melt BGA solder balls?"
and
"What is the best practice for assembling lead-free components under the SnPb process?" The course provides working knowledge with focus on the challenges and solutions for Ball Grid Array (BGA) packages, fine pitch BGA and other BTC packages containing solder balls as interconnection technology. Using solder paste, six commonly occurring scenarios covering the backward and forward compatibility (backward compatibility: lead-free BGA using tin-lead solder paste; forward compatibility: lead-free BGA with lead-free solder paste) will be specified including the PCB assembly containing both lead-free BGA and tin-lead BGA. The desirable reflow process parameters will be specified. Real world production process parameters critical to the reliability and the impact of key process parameters will be presented. The course also discusses what constitutes the best practices enabling the manufacture of the ultimate reliability of PCB assemblies and the scientific rationale behind such practices.
The presentation will be concluded with the summary of relative ranking of the product reliability (solder joint reliability plus the PCB assembly integrity). Specific topics to be covered:
• Array package (BGA, CSP, WLP, BTC) interconnection – challenges; Array solder interconnection technology – principles, best practices
• Should the reflow profile set to specifically melt BGA solder balls?
• Key process parameters for commonly occurring production scenarios and rationale
• PCB assembly: BGA with SAC305 solder ball using SnPb(E) solder paste
• PCB assembly: BGA with SnPb(E) solder ball using SAC305 solder paste
• PCB assembly: BGA with SAC305 solder ball using SAC305msolder paste
• PCB assembly: BGA with low-Ag SAC solder ball using SAC305 solder paste
• PCB assembly: BGAs with SAC305 solder ball using low-Ag SAC solder paste
• PCB assembly: BGAs with low-Ag SAC solder ball using low-Ag SAC solder paste
• Solder joint reliability and PCB assembly integrity – principles, processes, failure prevention
• "What constitutes the best practices that enable the ultimate reliability of PCB assemblies and the scientific rationale behind?"
T16: Preventing Production Defects and Failures
Introduction
Considering the new and anticipated developments in packaging and assembly, this course focuses on "how-to" prevent the issues and take remedial measures of the prevailing production defects through the understanding of potential causes. Top five current issues/defects addressed in this half-day course include PCB bare board issues, PCB Pad cratering, BGA head-on-Pillow defect, passive 01005 issues, copper dissolution and Pb-free thru-hole barrel filling problem. PCB thermal properties and halogen-free PCB laminates will be summarized. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion. Specific topics to be covered:
• PCB – thermal properties for Pb-free assembly
• PCB – Halogen-free laminates
• PCB Pad cratering – causes, solutions
• Head-on-pillow defect – causes, factors, remedies
• Copper dissolution – impact on thru-hole solder joint reliability
• Through-hole barrel filling – process, solder joint integrity
• Tin whisker – new developments
• Passive 01005 assembly – process, factors, best practice
• Your issues
For info/registration: https://www.smta.org/event_registration/smtai_register.cfm
and
"What is the best practice for assembling lead-free components under the SnPb process?" The course provides working knowledge with focus on the challenges and solutions for Ball Grid Array (BGA) packages, fine pitch BGA and other BTC packages containing solder balls as interconnection technology. Using solder paste, six commonly occurring scenarios covering the backward and forward compatibility (backward compatibility: lead-free BGA using tin-lead solder paste; forward compatibility: lead-free BGA with lead-free solder paste) will be specified including the PCB assembly containing both lead-free BGA and tin-lead BGA. The desirable reflow process parameters will be specified. Real world production process parameters critical to the reliability and the impact of key process parameters will be presented. The course also discusses what constitutes the best practices enabling the manufacture of the ultimate reliability of PCB assemblies and the scientific rationale behind such practices.
The presentation will be concluded with the summary of relative ranking of the product reliability (solder joint reliability plus the PCB assembly integrity). Specific topics to be covered:
• Array package (BGA, CSP, WLP, BTC) interconnection – challenges; Array solder interconnection technology – principles, best practices
• Should the reflow profile set to specifically melt BGA solder balls?
• Key process parameters for commonly occurring production scenarios and rationale
• PCB assembly: BGA with SAC305 solder ball using SnPb(E) solder paste
• PCB assembly: BGA with SnPb(E) solder ball using SAC305 solder paste
• PCB assembly: BGA with SAC305 solder ball using SAC305msolder paste
• PCB assembly: BGA with low-Ag SAC solder ball using SAC305 solder paste
• PCB assembly: BGAs with SAC305 solder ball using low-Ag SAC solder paste
• PCB assembly: BGAs with low-Ag SAC solder ball using low-Ag SAC solder paste
• Solder joint reliability and PCB assembly integrity – principles, processes, failure prevention
• "What constitutes the best practices that enable the ultimate reliability of PCB assemblies and the scientific rationale behind?"
T16: Preventing Production Defects and Failures
Introduction
Considering the new and anticipated developments in packaging and assembly, this course focuses on "how-to" prevent the issues and take remedial measures of the prevailing production defects through the understanding of potential causes. Top five current issues/defects addressed in this half-day course include PCB bare board issues, PCB Pad cratering, BGA head-on-Pillow defect, passive 01005 issues, copper dissolution and Pb-free thru-hole barrel filling problem. PCB thermal properties and halogen-free PCB laminates will be summarized. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion. Specific topics to be covered:
• PCB – thermal properties for Pb-free assembly
• PCB – Halogen-free laminates
• PCB Pad cratering – causes, solutions
• Head-on-pillow defect – causes, factors, remedies
• Copper dissolution – impact on thru-hole solder joint reliability
• Through-hole barrel filling – process, solder joint integrity
• Tin whisker – new developments
• Passive 01005 assembly – process, factors, best practice
• Your issues
For info/registration: https://www.smta.org/event_registration/smtai_register.cfm
Wednesday, June 27, 2012
The IPC WorksAsia 2012 Technical Seminar
Call for Papers: Share your professional knowledge to colleagues in the industry! The electronics industry focused its attention on research and innovation to your company! The most effective way to show your company in front of the industry!
The IPC WorksAsia held by the IPC-International Association Connecting Electronics Industries in southern China, influential large technical activities. Covering all aspects of the electronics industry chain, the audience coverage of China (including Hong Kong, Taiwan), electronics companies, technology, management and executives.
Involving design, materials, assembly, process, equipment and other areas of the following:
The IPC WorksAsia held by the IPC-International Association Connecting Electronics Industries in southern China, influential large technical activities. Covering all aspects of the electronics industry chain, the audience coverage of China (including Hong Kong, Taiwan), electronics companies, technology, management and executives.
Involving design, materials, assembly, process, equipment and other areas of the following:
|
|
Tuesday, June 26, 2012
6th International Symposium on Tin Whiskers - Call for Partcipation
Whisker Growth on Tin Plated Lead
The Center of Advanced Life Cycle Engineering at the University of Maryland and Department of Materials Research at Loughbourugh University are pleased to announce the Sixth International Symposium on Tin Whiskers. Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices.
Whisker Induced Metal Vapor Arc
A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent.
Listing of proceeding of prior International Symposia on Tin Whiskers can be found at http://www.calce.umd.edu/tin-whiskers/symposia.htm
This symposium presentations can cover case histories, theories of tin whisker growth experiments and results, risk evaluation methods and risk mitigation strategies. Presentations submitted for this year’s symposium may cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Free admission will be provided to symposium participants.
Novermber 27-28, 2012
Ford College, Loughborough University Leicestershire, UK LE11 3TU
Organized by
Department of Materials Research at Loughbourugh University
Center for Advanced Life Cycle Engineering ( CALCE )
Contact
Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Dr Geoffrey D. Wilcox, Department of Materials Research, G.D.Wilcox@lboro.ac.uk
http://www.calce.umd.edu/cgi-bin/entityTools/webmultidbhtmlfrm.cgi?events+standard.irp+7
The Center of Advanced Life Cycle Engineering at the University of Maryland and Department of Materials Research at Loughbourugh University are pleased to announce the Sixth International Symposium on Tin Whiskers. Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices.
Whisker Induced Metal Vapor Arc
A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent.
Listing of proceeding of prior International Symposia on Tin Whiskers can be found at http://www.calce.umd.edu/tin-whiskers/symposia.htm
This symposium presentations can cover case histories, theories of tin whisker growth experiments and results, risk evaluation methods and risk mitigation strategies. Presentations submitted for this year’s symposium may cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Free admission will be provided to symposium participants.
Novermber 27-28, 2012
Ford College, Loughborough University Leicestershire, UK LE11 3TU
Organized by
Department of Materials Research at Loughbourugh University
Center for Advanced Life Cycle Engineering ( CALCE )
Contact
Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Dr Geoffrey D. Wilcox, Department of Materials Research, G.D.Wilcox@lboro.ac.uk
http://www.calce.umd.edu/cgi-bin/entityTools/webmultidbhtmlfrm.cgi?events+standard.irp+7
Thursday, June 21, 2012
Supply Chain Support for Medical Products | iNEMI Telecons
Upcoming Telecons
Tuesday, June 26, 2012 at 1:00 p.m. EDT
iNEMI is beginning the planning process for an initiative on supply chain support for medical electronics. The objective of this planning process is to explore areas for industry collaboration that will lead to a Statement of Work (SOW) describing the scope, objectives and resources required for an industry-led project. The final SOW will be dependent on the contributions and interests of the initiative team. Possible areas for collaboration identified by iNEMI workshops and other meetings are:
1. Create widely available information on component and supplier capabilities
a. Clarity of supplier/OEM business models that support:
i. NPI for innovative new products
ii. Change control and product requalification
iii. Requirements for long-life products
2. Clarity of OEM/supplier operating agreements (e.g., best known methods templates)
a. Liability indemnification (separate for each of the 3 sub-segments)
b. Standardized qualification of suppliers (separate for each of the 3 sub-segments)
3. Development of data declaration standards for medical – electronically transferrable (iNEMI provides the base and submits to a standard organization)
4. Consider looking at combined needs of military and medical
5. For rare earth metals and scarce/threatened plastics – clarify the medical market priorities and create an action plan:
a. Needs to be an ongoing effort as the priorities will continually evolve/change
6. Need to stimulate supply base for medical (components, materials, etc.)
Project Meetings
Allen Mayar (Kemet) and Eddie Suckow (Fairchild Semiconductor) have agreed to co-chair the discussions for this project formation team. The first open meeting was held on December 15, 2011.
Follow-up calls will be held on a regular basis until the Statement of Work (SOW) has been completed.
The iNEMI process of defining a SOW (project plan) is open to all interested parties; iNEMI membership is not required. We look forward to working with you on the development of the SOW and hope you will continue to be involved in the planning process.
An email invitation will be sent to individuals who have already expressed a direct interest in participating in the project formation discussions. If you don’t receive an invitation and are interested in being added to the distribution list, please contact Jim Arnold.
Further Information
Jim Arnold
jim.arnold@inemi.org
+1 480-854-0906
http://www.inemi.org/node/2280
Tuesday, June 26, 2012 at 1:00 p.m. EDT
iNEMI is beginning the planning process for an initiative on supply chain support for medical electronics. The objective of this planning process is to explore areas for industry collaboration that will lead to a Statement of Work (SOW) describing the scope, objectives and resources required for an industry-led project. The final SOW will be dependent on the contributions and interests of the initiative team. Possible areas for collaboration identified by iNEMI workshops and other meetings are:
1. Create widely available information on component and supplier capabilities
a. Clarity of supplier/OEM business models that support:
i. NPI for innovative new products
ii. Change control and product requalification
iii. Requirements for long-life products
2. Clarity of OEM/supplier operating agreements (e.g., best known methods templates)
a. Liability indemnification (separate for each of the 3 sub-segments)
b. Standardized qualification of suppliers (separate for each of the 3 sub-segments)
3. Development of data declaration standards for medical – electronically transferrable (iNEMI provides the base and submits to a standard organization)
4. Consider looking at combined needs of military and medical
5. For rare earth metals and scarce/threatened plastics – clarify the medical market priorities and create an action plan:
a. Needs to be an ongoing effort as the priorities will continually evolve/change
6. Need to stimulate supply base for medical (components, materials, etc.)
Project Meetings
Allen Mayar (Kemet) and Eddie Suckow (Fairchild Semiconductor) have agreed to co-chair the discussions for this project formation team. The first open meeting was held on December 15, 2011.
Follow-up calls will be held on a regular basis until the Statement of Work (SOW) has been completed.
The iNEMI process of defining a SOW (project plan) is open to all interested parties; iNEMI membership is not required. We look forward to working with you on the development of the SOW and hope you will continue to be involved in the planning process.
An email invitation will be sent to individuals who have already expressed a direct interest in participating in the project formation discussions. If you don’t receive an invitation and are interested in being added to the distribution list, please contact Jim Arnold.
Further Information
Jim Arnold
jim.arnold@inemi.org
+1 480-854-0906
http://www.inemi.org/node/2280
Wednesday, June 20, 2012
Announcement from The SMART Group - UK: 2012 European 2-Day Conference & Exhibition Programme Announced | LinkedIn
Announcement from The SMART Group - UK: 2012 European 2-Day Conference & Exhibition Programme Announced
This year's SMART Group European Conference & Exhibition will be held at an excellent new venue in Thame, Oxfordshire on September 18th-19th. The proposed schedule of papers to be presented over the two days is as follows:
DAY 1
Keynote Presentation: Steve Jones - Printed Electronics Ltd
Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins
Electronics Design for Vibration: Andy Stiles - Aero Engine Controls
SMART HALT: Bob Page – Reliability Plus
Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services
High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV
Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium
Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen
Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group
DAY 2
DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd
A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS
Cleaning Under Low Stand-off Components: Rob Murphy - Zestron
Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL
Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins
Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus
DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)
ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd
The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins
BOOK YOUR DELEGATES NOW HERE:
< http://www.smartgroup.org/wp-content/uploads/2012/06/SMARTConference2012.pdf >
BOOK YOUR EXHIBITION SPACE NOW HERE:
< http://www.smartgroup.org/wp-content/uploads/2012/05/TableTopSpace2012.pdf >
DAY 1
Keynote Presentation: Steve Jones - Printed Electronics Ltd
Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins
Electronics Design for Vibration: Andy Stiles - Aero Engine Controls
SMART HALT: Bob Page – Reliability Plus
Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services
High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV
Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium
Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen
Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group
DAY 2
DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd
A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS
Cleaning Under Low Stand-off Components: Rob Murphy - Zestron
Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL
Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins
Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus
DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)
ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd
The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins
BOOK YOUR DELEGATES NOW HERE:
< http://www.smartgroup.org/wp-content/uploads/2012/06/SMARTConference2012.pdf >
BOOK YOUR EXHIBITION SPACE NOW HERE:
< http://www.smartgroup.org/wp-content/uploads/2012/05/TableTopSpace2012.pdf >
Flexible Circuits – A Guide to Assembly and Inspection: SMART Group Webinar 14 Aug | LinkedIn
Online Webinar format 14th August 2012 – 14:30 BST
The flexible circuit is another packaging technology which has seen wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don’t; many flexibles are designed purely to aid the circuits design and assembly into a final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture.
Where design departments have limited experience a useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad. A link will be provided to all delegates to download this free book.
http://www.smartgroup.org/wp-content/uploads/2012/03/flex2012.pdf
The flexible circuit is another packaging technology which has seen wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don’t; many flexibles are designed purely to aid the circuits design and assembly into a final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture.
Where design departments have limited experience a useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad. A link will be provided to all delegates to download this free book.
http://www.smartgroup.org/wp-content/uploads/2012/03/flex2012.pdf
Thursday, May 3, 2012
R2i Electronics Conference
IMAPS UK
Title:
R2i Electronics Conference - Connecting Research to Industry
When:
19.06.2012 - 19.06.2012
Where:
Henry Ford College - Loughborough
Discover the next generation technology - The R2i Electronics Conference will provide the opportunity for the electronics manufacturing industry, research & development companies and institutional research centres to meet, review and discuss the best of the UK’s academic electronic research projects.
This event will bridge the gap between industry and research, allowing organisations to:
• Showcase innovative electronics research and highlight its potential value to UK industry
• Identify resources or competence in specific areas
• Find specialists to support further or related research
• Bridge skills gaps by discovering graduates to employ, second or sponsor
This innovative conference will comprise five sessions with forty high impact presentations, where each presenter will provide a short five minute dissertation of their research project and capabilities covering:
• Semiconductor technology (processing materials & processes, devices, packaging etc)
• Printed & Plastic (displays, devices, inks, applications, materials etc)
• PCB & Assembly (solders, finishing, processes, materials)
• DfX (design for reliability, re-use, manufacture, test, low volume etc)
• Renewables, sustainability and related power management (re wind, solar, battery vehicles etc.)
Title:
R2i Electronics Conference - Connecting Research to Industry
When:
19.06.2012 - 19.06.2012
Where:
Henry Ford College - Loughborough
Discover the next generation technology - The R2i Electronics Conference will provide the opportunity for the electronics manufacturing industry, research & development companies and institutional research centres to meet, review and discuss the best of the UK’s academic electronic research projects.
This event will bridge the gap between industry and research, allowing organisations to:
• Showcase innovative electronics research and highlight its potential value to UK industry
• Identify resources or competence in specific areas
• Find specialists to support further or related research
• Bridge skills gaps by discovering graduates to employ, second or sponsor
This innovative conference will comprise five sessions with forty high impact presentations, where each presenter will provide a short five minute dissertation of their research project and capabilities covering:
• Semiconductor technology (processing materials & processes, devices, packaging etc)
• Printed & Plastic (displays, devices, inks, applications, materials etc)
• PCB & Assembly (solders, finishing, processes, materials)
• DfX (design for reliability, re-use, manufacture, test, low volume etc)
• Renewables, sustainability and related power management (re wind, solar, battery vehicles etc.)
Monday, April 30, 2012
TOFA 2012
TOFA 2012 :
Pula, Croatia 23-28, September, 2012
MAIN TOPICS
1. Experimental and theoretical thermodynamics
2. Phase diagrams
3. Computational thermodynamics
4. Thermodynamics of nanoparticles
5. Structure of Alloys
6. Metallic clusters
7. Surface and interfacial phenomena
8. Thermodynamic aspects of the reactivity
9.Thermochemistry of metallurgical processes
Pula, Croatia 23-28, September, 2012
MAIN TOPICS
1. Experimental and theoretical thermodynamics
2. Phase diagrams
3. Computational thermodynamics
4. Thermodynamics of nanoparticles
5. Structure of Alloys
6. Metallic clusters
7. Surface and interfacial phenomena
8. Thermodynamic aspects of the reactivity
9.Thermochemistry of metallurgical processes
POP, LGA, QFN Designing & Assembly Workshop
SMART Group:
Stoke Mandeville Stadium – Aylesbury
To book your place or table top exhibition space contact Tony Gordon
Package on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection.
Stoke Mandeville Stadium – Aylesbury
To book your place or table top exhibition space contact Tony Gordon
Package on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection.
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